Plasma cleaning

Industry

CPC
H01L2224/81913

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81913Plasma cleaning

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,948,808
- Issue date Apr 2, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,195,726
- Issue date Dec 7, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect bump structures for photo detectors
- Patent number 10,957,733
- Issue date Mar 23, 2021
- Sensors Unlimited, Inc.
- Wei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect bump structures for photo detectors
- Patent number 10,727,267
- Issue date Jul 28, 2020
- Sensors Unlimited, Inc.
- Wei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure with selective surface finishes for flip chip a...
- Patent number 10,607,960
- Issue date Mar 31, 2020
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,553,451
- Issue date Feb 4, 2020
- Amkor Technology, Inc.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure with selective surface finishes for flip chip a...
- Patent number 10,283,480
- Issue date May 7, 2019
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,008,393
- Issue date Jun 26, 2018
- Amkor Technology, Inc.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package in package
- Patent number 9,768,124
- Issue date Sep 19, 2017
- Amkor Technology, Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for producing same
- Patent number 9,740,067
- Issue date Aug 22, 2017
- Sharp Kabushiki Kaisha
- Keiji Aota
- G02 - OPTICS
Information Patent Grant
Reducing glitching in an ion implanter
- Patent number 9,062,377
- Issue date Jun 23, 2015
- Varian Semiconductor Equipment Associates, Inc.
- William T. Levay
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Stacked electronics for sensors
- Patent number 7,518,251
- Issue date Apr 14, 2009
- General Electric Company
- Rayette Ann Fisher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Infrared detector array with improved spectral range and method for...
- Patent number 6,852,976
- Issue date Feb 8, 2005
- Indigo Systems Corporation
- Jeffrey B. Barton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices
- Patent number 6,723,627
- Issue date Apr 20, 2004
- NEC Corporation
- Syuuichi Kariyazaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240332032
- Publication date Oct 3, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT BUMP STRUCTURES FOR PHOTO DETECTORS
- Publication number 20200312900
- Publication date Oct 1, 2020
- Sensors Unlimited, Inc.
- Wei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT BUMP STRUCTURES FOR PHOTO DETECTORS
- Publication number 20200083272
- Publication date Mar 12, 2020
- Sensors Unlimited, Inc.
- Wei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE WITH SELECTIVE SURFACE FINISHES FOR FLIP CHIP A...
- Publication number 20190229087
- Publication date Jul 25, 2019
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180308712
- Publication date Oct 25, 2018
- Amkor Technology, Inc.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reducing Glitching In An Ion Implanter
- Publication number 20140099430
- Publication date Apr 10, 2014
- William T. Levay
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Stacked electronics for sensors
- Publication number 20060118939
- Publication date Jun 8, 2006
- Rayette Ann Fisher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Infrared detector array with improved spectral range and method for...
- Publication number 20040061056
- Publication date Apr 1, 2004
- Jeffrey B. Barton
- H01 - BASIC ELECTRIC ELEMENTS

Plasma cleaning

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Interconnect bump structures for photo detectors

Interconnect bump structures for photo detectors

Substrate structure with selective surface finishes for flip chip a...

Semiconductor device and manufacturing method thereof

Substrate structure with selective surface finishes for flip chip a...

Semiconductor device and manufacturing method thereof

Semiconductor package in package

Display device and method for producing same

Reducing glitching in an ion implanter

Stacked electronics for sensors

Infrared detector array with improved spectral range and method for...

Method for manufacturing semiconductor devices

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

INTERCONNECT BUMP STRUCTURES FOR PHOTO DETECTORS

INTERCONNECT BUMP STRUCTURES FOR PHOTO DETECTORS

SUBSTRATE STRUCTURE WITH SELECTIVE SURFACE FINISHES FOR FLIP CHIP A...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Reducing Glitching In An Ion Implanter

Stacked electronics for sensors

Infrared detector array with improved spectral range and method for...