Plasma etching Reactive-ion etching

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H01L21/3065

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/3065Plasma etching Reactive-ion etching

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Hybrid channel semiconductor device and method
- Patent number 12,211,900
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing thereof
- Patent number 12,211,919
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and etching apparatus
- Patent number 12,211,695
- Issue date Jan 28, 2025
- Tokyo Electron Limited
- Nobuhiro Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for treating substrate and method for treating a substrate
- Patent number 12,211,675
- Issue date Jan 28, 2025
- Semes Co., Ltd.
- Ji Hun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET device and method of forming same
- Patent number 12,211,752
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-high modulus and etch selectivity boron-carbon hardmask films
- Patent number 12,211,694
- Issue date Jan 28, 2025
- Applied Materials, Inc.
- Prashant Kumar Kulshreshtha
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing semiconductor structure with improved etchi...
- Patent number 12,211,696
- Issue date Jan 28, 2025
- NANYA TECHNOLOGY CORPORATION
- Zhi-Yi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and a semiconductor...
- Patent number 12,211,895
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing element chips
- Patent number 12,205,823
- Issue date Jan 21, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Toshiyuki Takasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of preparing semiconductor structure having low dielectric c...
- Patent number 12,205,825
- Issue date Jan 21, 2025
- NANYA TECHNOLOGY CORPORATION
- Yu-Kai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for anisotropic pattern etching and treatment
- Patent number 12,205,793
- Issue date Jan 21, 2025
- Lam Research Corporation
- Seokmin Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma control method in semiconductor wafer fabrication
- Patent number 12,205,844
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Huang-Shao Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor structure
- Patent number 12,206,010
- Issue date Jan 21, 2025
- Winbond Electronics Corp.
- Shu-Ming Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition of organic films
- Patent number 12,205,820
- Issue date Jan 21, 2025
- ASM IP Holding B.V.
- Eva E. Tois
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etching method and plasma processing apparatus
- Patent number 12,198,937
- Issue date Jan 14, 2025
- Tokyo Electron Limited
- Koki Chino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for semiconductor manufacturing
- Patent number 12,198,939
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Han-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing process for semiconductor optical device for lidar se...
- Patent number 12,199,132
- Issue date Jan 14, 2025
- AURORA OPERATIONS, INC.
- Lei Wang
- G01 - MEASURING TESTING
Information Patent Grant
Substrate support with multiple embedded electrodes
- Patent number 12,198,966
- Issue date Jan 14, 2025
- Applied Materials, Inc.
- Philip Allan Kraus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method
- Patent number 12,198,938
- Issue date Jan 14, 2025
- Tokyo Electron Limited
- Takatoshi Orui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around transistor with reduced source/drain contact resist...
- Patent number 12,191,151
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jui-Ping Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer treatment system and method of treating wafer
- Patent number 12,183,550
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure with improved etchi...
- Patent number 12,183,584
- Issue date Dec 31, 2024
- NANYA TECHNOLOGY CORPORATION
- Zhi-Yi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Remote source pulsing with advanced pulse control
- Patent number 12,183,583
- Issue date Dec 31, 2024
- Tokyo Electron Limited
- Peter Lowell George Ventzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of performing gap filling including filling trenches between...
- Patent number 12,183,590
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- De-Wei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Profile control of channel structures for semiconductor devices
- Patent number 12,183,797
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chao-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scanning ion beam deposition and etch
- Patent number 12,176,178
- Issue date Dec 24, 2024
- Plasma-Therm NES LLC
- Sarpangala Hariharakeshava Hegde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus and method for manufacturing...
- Patent number 12,176,236
- Issue date Dec 24, 2024
- Kioxia Corporation
- Wu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,170,314
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun Hsiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,170,320
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Chia Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for advanced ion control for etching processes
- Patent number 12,165,872
- Issue date Dec 10, 2024
- Lam Research Corporation
- Zhongkui Tan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR WAFER PROCESSING METHOD
- Publication number 20250038033
- Publication date Jan 30, 2025
- Hitachi High-Tech Corporation
- Nozomu YOSHIOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF ANTIREFLECTIVE SURFACES
- Publication number 20250033955
- Publication date Jan 30, 2025
- Brookhaven Science Associates, LLC
- Charles T. Black
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method For Forming Resist Underlayer Film And Patterning Process
- Publication number 20250036029
- Publication date Jan 30, 2025
- Shin-Etsu Chemical Co., Ltd.
- Naoki KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20250031434
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR SEPARATING SEMICONDUCTOR DEVICES USING SINGULATION GROO...
- Publication number 20250029878
- Publication date Jan 23, 2025
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ETCHING BETWEEN SILICON-AND-GERMANIUM-CONTAINING MATERIAL...
- Publication number 20250029841
- Publication date Jan 23, 2025
- Applied Materials, Inc.
- Jiayin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
- Publication number 20250022755
- Publication date Jan 16, 2025
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLASMA ETCHING PROCESSES
- Publication number 20250022715
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Ging Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ADJUSTING LINEWIDTH DUE TO PATTERN LOAD EFFECT IN SADP M...
- Publication number 20250022717
- Publication date Jan 16, 2025
- Shanghai Huali Integrated Circuit Corporation
- Liyuan Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS CLUSTER ASSISTED PLASMA PROCESSING
- Publication number 20250022689
- Publication date Jan 16, 2025
- TOKYO ELECTRON LIMITED
- Peter Ventzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CYCLIC ETCH OF SILICON OXIDE AND SILICON NITRIDE
- Publication number 20250022714
- Publication date Jan 16, 2025
- Applied Materials, Inc.
- Sonam Dorje Sherpa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250022706
- Publication date Jan 16, 2025
- TOKYO ELECTRON LIMITED
- Tomohiko NIIZEKI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SURFACE TREATMENT METHOD
- Publication number 20250014905
- Publication date Jan 9, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Ludovic DUPRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROTECTING ACTIVE LAYERS OF ELECTRONIC CHIPS
- Publication number 20250014912
- Publication date Jan 9, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Emilie BOURJOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING
- Publication number 20250015166
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Ging Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR STACKING INTEGRATED CIRCUIT WAFERS AND DIES
- Publication number 20250015045
- Publication date Jan 9, 2025
- TOKYO ELECTRON LIMITED
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD
- Publication number 20250014907
- Publication date Jan 9, 2025
- HITACHI HIGH-TECH CORPORATION
- Takashi Hattori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MULTI-GATE DEVICE WITH REDUCED CONTACT RESISTANCE AND METHO...
- Publication number 20250006561
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Kan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma Etching Method and Apparatus
- Publication number 20250006537
- Publication date Jan 2, 2025
- SPTS TECHNOLOGIES LIMITED
- Adam S. BEACHEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES WITH REMOVED SUB-FIN
- Publication number 20250006547
- Publication date Jan 2, 2025
- Intel Corporation
- Mohammad HASAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR IMPROVING RESIDUE FORMATION AFTER MANDREL REMOVAL
- Publication number 20240429059
- Publication date Dec 26, 2024
- Shanghai Huali Integrated Circuit Corporation
- Tianchen Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON ETCH WITH ORGANOCHLORIDE
- Publication number 20240429063
- Publication date Dec 26, 2024
- LAM RESEARCH CORPORATION
- Ilya PISKUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU ETCHING OF GALLIUM OXIDE WITH METAL ORGANIC GALLIUM PRECURSORS
- Publication number 20240429058
- Publication date Dec 26, 2024
- Nidhin Kurian Kalarickal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADJUSTABLE EDGE RING TILT FOR EDGE OF WAFER SKEW COMPENSATION
- Publication number 20240429089
- Publication date Dec 26, 2024
- Applied Materials, Inc.
- Peter MURAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DEPOSITION IN HIGH ASPECT RATIO (HAR) FEATURES
- Publication number 20240420965
- Publication date Dec 19, 2024
- TOKYO ELECTRON LIMITED
- Shihsheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING SOLUTION FOR SEMICONDUCTOR DEVICE, METHOD FOR PROCESSING...
- Publication number 20240417648
- Publication date Dec 19, 2024
- Tokyo Ohka Kogyo Co., Ltd.
- Kenta Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC SUBSTRATE SUPPORT
- Publication number 20240420984
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Andrew Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE WET CHANNELS FOR WATER DRAINAGE PPLICATIONS
- Publication number 20240421104
- Publication date Dec 19, 2024
- SAUDI ARABIANOIL COMPANY
- Dong Kyu Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240412958
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Jeongil MUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DRY ETCHING USING PLASMA
- Publication number 20240412979
- Publication date Dec 12, 2024
- Research & Business Foundation Sungkyunkwan University
- Geun Young YEOM
- H01 - BASIC ELECTRIC ELEMENTS

Plasma etching Reactive-ion etching

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Hybrid channel semiconductor device and method

Semiconductor devices and methods of manufacturing thereof

Etching method and etching apparatus

Apparatus for treating substrate and method for treating a substrate

FinFET device and method of forming same

Ultra-high modulus and etch selectivity boron-carbon hardmask films

Method of manufacturing semiconductor structure with improved etchi...

Method of manufacturing a semiconductor device and a semiconductor...

Method for producing element chips

Method of preparing semiconductor structure having low dielectric c...

Method and apparatus for anisotropic pattern etching and treatment

Plasma control method in semiconductor wafer fabrication

Method for forming a semiconductor structure

Deposition of organic films

Etching method and plasma processing apparatus

Technique for semiconductor manufacturing

Manufacturing process for semiconductor optical device for lidar se...

Substrate support with multiple embedded electrodes

Etching method

Gate-all-around transistor with reduced source/drain contact resist...

Wafer treatment system and method of treating wafer

Method of manufacturing semiconductor structure with improved etchi...

Remote source pulsing with advanced pulse control

Method of performing gap filling including filling trenches between...

Profile control of channel structures for semiconductor devices

Scanning ion beam deposition and etch

Semiconductor manufacturing apparatus and method for manufacturing...

Semiconductor device and manufacturing method thereof

Semiconductor device and method of manufacture

Methods and systems for advanced ion control for etching processes

Patents Applicationslast 30 patents

SEMICONDUCTOR WAFER PROCESSING METHOD

FORMATION OF ANTIREFLECTIVE SURFACES

Method For Forming Resist Underlayer Film And Patterning Process

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

METHODS FOR SEPARATING SEMICONDUCTOR DEVICES USING SINGULATION GROO...

SELECTIVE ETCHING BETWEEN SILICON-AND-GERMANIUM-CONTAINING MATERIAL...

WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH

PLASMA ETCHING PROCESSES

METHOD FOR ADJUSTING LINEWIDTH DUE TO PATTERN LOAD EFFECT IN SADP M...

GAS CLUSTER ASSISTED PLASMA PROCESSING

CYCLIC ETCH OF SILICON OXIDE AND SILICON NITRIDE

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

SURFACE TREATMENT METHOD

METHOD FOR PROTECTING ACTIVE LAYERS OF ELECTRONIC CHIPS

SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING

METHOD FOR STACKING INTEGRATED CIRCUIT WAFERS AND DIES

ETCHING METHOD

STACKED MULTI-GATE DEVICE WITH REDUCED CONTACT RESISTANCE AND METHO...

Plasma Etching Method and Apparatus

INTEGRATED CIRCUIT STRUCTURES WITH REMOVED SUB-FIN

METHOD FOR IMPROVING RESIDUE FORMATION AFTER MANDREL REMOVAL

SILICON ETCH WITH ORGANOCHLORIDE

IN-SITU ETCHING OF GALLIUM OXIDE WITH METAL ORGANIC GALLIUM PRECURSORS

ADJUSTABLE EDGE RING TILT FOR EDGE OF WAFER SKEW COMPENSATION

METHOD OF DEPOSITION IN HIGH ASPECT RATIO (HAR) FEATURES

PROCESSING SOLUTION FOR SEMICONDUCTOR DEVICE, METHOD FOR PROCESSING...

ELECTROSTATIC SUBSTRATE SUPPORT

SELECTIVE WET CHANNELS FOR WATER DRAINAGE PPLICATIONS

PLASMA PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...

METHOD FOR DRY ETCHING USING PLASMA