Plasma etching Reactive-ion etching

Industry

CPC
H01L21/3065

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/3065Plasma etching Reactive-ion etching

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Methods of forming semiconductor devices
- Patent number 12,272,555
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Jinyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oblique deposition and etch processes
- Patent number 12,272,559
- Issue date Apr 8, 2025
- Tokyo Electron Limited
- Akiteru Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective and isotropic etch of silicon over silicon-germanium allo...
- Patent number 12,272,558
- Issue date Apr 8, 2025
- Tokyo Electron Limited
- Matthew Flaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spectroscopic analysis method, method for fabricating semiconductor...
- Patent number 12,272,535
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Se Jin Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded metal contamination removal from BEOL wafers
- Patent number 12,272,545
- Issue date Apr 8, 2025
- International Business Machines Corporation
- Devika Sil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial capping layer for contact etch
- Patent number 12,266,533
- Issue date Apr 1, 2025
- Tokyo Electron Limited
- Yun Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of providing contacts on a graphene sheet
- Patent number 12,265,055
- Issue date Apr 1, 2025
- Paragraf Limited
- Lok Yi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistors with recessed silicon cap and method forming same
- Patent number 12,266,655
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma treatment apparatus, lower electrode assembly and forming me...
- Patent number 12,261,012
- Issue date Mar 25, 2025
- ADVANCED MICRO-FABRICATION EQUIPMENT INC.
- Tuqiang Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, and etching gas
- Patent number 12,261,050
- Issue date Mar 25, 2025
- Kioxia Corporation
- Takaya Ishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with reduced loading effect
- Patent number 12,261,085
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Lun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing substrate, substrate processing apparatus, rec...
- Patent number 12,255,072
- Issue date Mar 18, 2025
- Kokusai Electric Corporation
- Masato Kawanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a FinFET with merged epitaxial source/drain...
- Patent number 12,255,255
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Min Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated cleaning process for substrate etching
- Patent number 12,255,055
- Issue date Mar 18, 2025
- Applied Materials, Inc.
- Yi Zhou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Silicon carbide substrate manufacturing method, silicon carbide sub...
- Patent number 12,255,073
- Issue date Mar 18, 2025
- Kwansei Gakuin Educational Foundation
- Tadaaki Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective etching method and semiconductor structure manufactured u...
- Patent number 12,255,074
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Da Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor component and method of fabrica...
- Patent number 12,255,162
- Issue date Mar 18, 2025
- Infineon Technologies Austria AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and etching apparatus
- Patent number 12,249,515
- Issue date Mar 11, 2025
- Tokyo Electron Limited
- Shigeru Tahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing the same and electron...
- Patent number 12,249,544
- Issue date Mar 11, 2025
- Institute of Microelectronics, Chinese Academy of Sciences
- Huilong Zhu
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method for manufacturing a grid
- Patent number 12,249,630
- Issue date Mar 11, 2025
- II-VI DELAWARE, INC.
- Adolf Schöner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate treating apparatus and substrate support unit
- Patent number 12,249,491
- Issue date Mar 11, 2025
- Semes Co., Ltd.
- Hyoungkyu Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Managing trench depth in integrated systems
- Patent number 12,249,540
- Issue date Mar 11, 2025
- Ciena Corporation
- Benoît Filion
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device, method of manufacturing the same and electron...
- Patent number 12,245,442
- Issue date Mar 4, 2025
- Institute of Microelectronics, Chinese Academy of Sciences
- Huilong Zhu
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method for auto-aligned manufacturing of a VDMOS transistor, and au...
- Patent number 12,243,922
- Issue date Mar 4, 2025
- STMicroelectronics S.r.l.
- Vincenzo Enea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas curtain for semiconductor manufacturing system
- Patent number 12,243,750
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kent Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for processing substrate using plasma
- Patent number 12,237,151
- Issue date Feb 25, 2025
- SEMES CO, LTD.
- Seong Gil Lee
- B08 - CLEANING
Information Patent Grant
Etching method
- Patent number 12,237,174
- Issue date Feb 25, 2025
- HITACHI HIGH-TECH CORPORATION
- Kazunori Shinoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing assembly using pulsed-voltage and radio-frequency...
- Patent number 12,237,148
- Issue date Feb 25, 2025
- Applied Materials, Inc.
- Leonid Dorf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for increasing germanium concentration of surfaces of a sil...
- Patent number 12,237,404
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Che-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch process for oxide of alkaline earth metal
- Patent number 12,237,172
- Issue date Feb 25, 2025
- Tokyo Electron Limited
- Du Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CARBON REPLENISHMENT OF SILICON-CONTAINING MATERIALS TO REDUCE THIC...
- Publication number 20250112054
- Publication date Apr 3, 2025
- Applied Materials, Inc.
- Yuriy Shusterman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAM-FREE SINGLE OPERATION AMORPHOUS SILICON GAP FILL
- Publication number 20250112039
- Publication date Apr 3, 2025
- Applied Materials, Inc.
- John Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ETCHING OF SILICON-AND-GERMANIUM-CONTAINING MATERIALS WIT...
- Publication number 20250112051
- Publication date Apr 3, 2025
- Applied Materials, Inc.
- Jiayin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECTIONAL RIE FEATURE RECTANGULARITY
- Publication number 20250112052
- Publication date Apr 3, 2025
- Applied Materials, Inc.
- Yi-Hsin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF CMOS ACOUSTIC PRESSURE SENSOR
- Publication number 20250112053
- Publication date Apr 3, 2025
- CHUAN-WEI WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL REGIONS IN SEMICONDUCTOR DEVICES
- Publication number 20250113517
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shao-An WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ANNULAR SEMICONDUCTOR FIN AND METHOD FOR...
- Publication number 20250107224
- Publication date Mar 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Te-Yin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING METHOD
- Publication number 20250105019
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- HAN-YU LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250107189
- Publication date Mar 27, 2025
- Hon Young Semiconductor Corporation
- Jian-Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USIN...
- Publication number 20250104967
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- CHANGBAE PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ANNULAR SEMICONDUCTOR FIN AND METHOD FOR...
- Publication number 20250107223
- Publication date Mar 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Te-Yin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP SURFACE OF A JUNCTION TERMINATION EXTENSION FOR SEMICONDUCTOR D...
- Publication number 20250107165
- Publication date Mar 27, 2025
- NEXPERIA B.V.
- Tim Böttcher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO CONTROL ETCH PROFILE BY RF PULSING
- Publication number 20250095964
- Publication date Mar 20, 2025
- LAM RESEARCH CORPORATION
- Daksh AGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEMS, AND METHODS OF USING ATOMIC HYDROGEN RADICALS W...
- Publication number 20250087485
- Publication date Mar 13, 2025
- Applied Materials, Inc.
- Chen-Ying WU
- C30 - CRYSTAL GROWTH
Information Patent Application
CONTACT RESISTANCE REDUCTION FOR TRANSISTORS
- Publication number 20250087491
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jui-Ping Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SELECTIVITY AND UNIFORM DIELECTRIC ETCH
- Publication number 20250087456
- Publication date Mar 13, 2025
- LAM RESEARCH CORPORATION
- Sriharsha Jayanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250081530
- Publication date Mar 6, 2025
- Institute of Microelectronics, Chinese Academy of Sciences
- Junjie LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PLASMA ETCHING A LAYER BASED ON A III-N MATERIAL
- Publication number 20250079122
- Publication date Mar 6, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Nicolas POSSEME
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR STRUCTURES, SEMICONDUCTOR PROCESSI...
- Publication number 20250079167
- Publication date Mar 6, 2025
- ASM IP HOLDING B.V.
- Ernesto Suarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma Etched Compound Semiconductor
- Publication number 20250079175
- Publication date Mar 6, 2025
- SPTS TECHNOLOGIES LIMITED
- Alex CROOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL FABRICATION OF ELECTROSTATIC DISCHARGE DEVICES
- Publication number 20250079401
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Profile Control of Channel Structures for Semiconductor Devices
- Publication number 20250081531
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Wei HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Carbide Epitaxy
- Publication number 20250079165
- Publication date Mar 6, 2025
- ThinSiC Inc.
- Tirunelveli Subramaniam Ravi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOTE SOURCE PULSING WITH ADVANCED PULSE CONTROL
- Publication number 20250079178
- Publication date Mar 6, 2025
- TOKYO ELECTRON LIMITED
- Peter Lowell George Ventzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20250079177
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- En-Ping LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF FORMATION
- Publication number 20250069893
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsu Ming HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING...
- Publication number 20250069935
- Publication date Feb 27, 2025
- KIOXIA Corporation
- Wu LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250063777
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun Hsiung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA ETCHING IN SEMICONDUCTOR PROCESSING
- Publication number 20250062131
- Publication date Feb 20, 2025
- Applied Materials, Inc.
- Hanbyul Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION MODULE FOR BACKSIDE POWER DELIVERY
- Publication number 20250063797
- Publication date Feb 20, 2025
- Applied Materials, Inc.
- Kyoung Ha KIM
- H01 - BASIC ELECTRIC ELEMENTS

Plasma etching Reactive-ion etching

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of forming semiconductor devices

Oblique deposition and etch processes

Selective and isotropic etch of silicon over silicon-germanium allo...

Spectroscopic analysis method, method for fabricating semiconductor...

Embedded metal contamination removal from BEOL wafers

Sacrificial capping layer for contact etch

Method of providing contacts on a graphene sheet

Transistors with recessed silicon cap and method forming same

Plasma treatment apparatus, lower electrode assembly and forming me...

Method of manufacturing semiconductor device, and etching gas

Semiconductor device with reduced loading effect

Method of processing substrate, substrate processing apparatus, rec...

Method of manufacturing a FinFET with merged epitaxial source/drain...

Integrated cleaning process for substrate etching

Silicon carbide substrate manufacturing method, silicon carbide sub...

Selective etching method and semiconductor structure manufactured u...

Semiconductor device, semiconductor component and method of fabrica...

Etching method and etching apparatus

Semiconductor device, method of manufacturing the same and electron...

Method for manufacturing a grid

Substrate treating apparatus and substrate support unit

Managing trench depth in integrated systems

Semiconductor device, method of manufacturing the same and electron...

Method for auto-aligned manufacturing of a VDMOS transistor, and au...

Gas curtain for semiconductor manufacturing system

Apparatus and method for processing substrate using plasma

Etching method

Plasma processing assembly using pulsed-voltage and radio-frequency...

Methods for increasing germanium concentration of surfaces of a sil...

Etch process for oxide of alkaline earth metal

Patents Applicationslast 30 patents

CARBON REPLENISHMENT OF SILICON-CONTAINING MATERIALS TO REDUCE THIC...

SEAM-FREE SINGLE OPERATION AMORPHOUS SILICON GAP FILL

SELECTIVE ETCHING OF SILICON-AND-GERMANIUM-CONTAINING MATERIALS WIT...

DIRECTIONAL RIE FEATURE RECTANGULARITY

MANUFACTURING METHOD OF CMOS ACOUSTIC PRESSURE SENSOR

EPITAXIAL REGIONS IN SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE WITH ANNULAR SEMICONDUCTOR FIN AND METHOD FOR...

SEMICONDUCTOR MANUFACTURING METHOD

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USIN...

SEMICONDUCTOR DEVICE WITH ANNULAR SEMICONDUCTOR FIN AND METHOD FOR...

TOP SURFACE OF A JUNCTION TERMINATION EXTENSION FOR SEMICONDUCTOR D...

METHOD TO CONTROL ETCH PROFILE BY RF PULSING

APPARATUS, SYSTEMS, AND METHODS OF USING ATOMIC HYDROGEN RADICALS W...

CONTACT RESISTANCE REDUCTION FOR TRANSISTORS

HIGH SELECTIVITY AND UNIFORM DIELECTRIC ETCH

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR PLASMA ETCHING A LAYER BASED ON A III-N MATERIAL

METHODS OF FORMING SEMICONDUCTOR STRUCTURES, SEMICONDUCTOR PROCESSI...

Plasma Etched Compound Semiconductor

WAFER-LEVEL FABRICATION OF ELECTROSTATIC DISCHARGE DEVICES

Profile Control of Channel Structures for Semiconductor Devices

Silicon Carbide Epitaxy

REMOTE SOURCE PULSING WITH ADVANCED PULSE CONTROL

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHODS OF FORMATION

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PLASMA ETCHING IN SEMICONDUCTOR PROCESSING

ISOLATION MODULE FOR BACKSIDE POWER DELIVERY