Plasma etching Reactive-ion etching

Industry

CPC
H01L21/3065

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/3065Plasma etching Reactive-ion etching

Industries

Patents Grantslast 30 patents

Information Patent Grant
Thermal atomic layer etching processes
- Patent number 12,320,012
- Issue date Jun 3, 2025
- ASM IP Holding B.V.
- Tom E. Blomberg
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Integrated circuit device with source/drain barrier
- Patent number 12,324,201
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Feng-Ching Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternating hardmasks for tight-pitch line formation
- Patent number 12,322,601
- Issue date Jun 3, 2025
- Adeia Semiconductor Solutions LLC
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,322,590
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced directed self-assembly in the presence of low Tg oligomers...
- Patent number 12,319,810
- Issue date Jun 3, 2025
- Merck Patent GmbH
- Durairaj Baskaran
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method and apparatus for etching a semiconductor substrate in a pla...
- Patent number 12,315,732
- Issue date May 27, 2025
- Applied Materials, Inc.
- Daisuke Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced etch selectivity using halides
- Patent number 12,315,733
- Issue date May 27, 2025
- Applied Materials, Inc.
- David Knapp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isotropic silicon nitride removal
- Patent number 12,315,739
- Issue date May 27, 2025
- Applied Materials, Inc.
- Mikhail Korolik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making semiconductor device with selective etching of su...
- Patent number 12,315,723
- Issue date May 27, 2025
- ATOMERA INCORPORATED
- Marek Hytha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET device and method of forming same
- Patent number 12,315,759
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Cyuan Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal atomic layer etching processes
- Patent number 12,312,696
- Issue date May 27, 2025
- ASM IP Holding B.V.
- Tom E. Blomberg
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Plasma processing method and plasma processing apparatus
- Patent number 12,315,698
- Issue date May 27, 2025
- Tokyo Electron Limited
- Cedric Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimized proximity profile for strained source/drain feature and m...
- Patent number 12,317,548
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-An Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a radio frequency silicon-on-insulator (RFSOI) wa...
- Patent number 12,315,722
- Issue date May 27, 2025
- ATOMERA INCORPORATED
- Nyles Wynn Cody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate treating method and substrate treating apparatus
- Patent number 12,315,743
- Issue date May 27, 2025
- Semes Co., Ltd.
- Ki Yung Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processing apparatus and methods of manufacturing semiconduc...
- Patent number 12,315,703
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Kyoungchon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming films with improved film quality
- Patent number 12,315,718
- Issue date May 27, 2025
- Applied Materials, Inc.
- Bhargav S. Citla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 12,308,208
- Issue date May 20, 2025
- Tokyo Electron Limited
- Shinya Morikita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing isolation structure of hybrid epitaxial ar...
- Patent number 12,308,281
- Issue date May 20, 2025
- Shanghai Huali Integrated Circuit Corporation
- Yongyue Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,310,093
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Liang Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure having fins
- Patent number 12,308,280
- Issue date May 20, 2025
- NANYA TECHNOLOGY CORPORATION
- Chen-Tsung Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor silicon wafer
- Patent number 12,308,228
- Issue date May 20, 2025
- Globalwafers Japan Co., Ltd
- Takeshi Senda
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method and apparatus
- Patent number 12,308,240
- Issue date May 20, 2025
- SPTS Technologies Limited
- Janet Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for selective metal compound removal
- Patent number 12,300,501
- Issue date May 13, 2025
- Applied Materials, Inc.
- Zhenjiang Cui
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for low temperature selective epitaxy in a dee...
- Patent number 12,297,559
- Issue date May 13, 2025
- Applied Materials, Inc.
- Abhishek Dube
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Autonomous operation of plasma processing tool
- Patent number 12,300,477
- Issue date May 13, 2025
- Tokyo Electron Limited
- Jun Shinagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching of polycrystalline semiconductors
- Patent number 12,300,500
- Issue date May 13, 2025
- Tokyo Electron Limited
- Yun Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of uniformity control
- Patent number 12,300,468
- Issue date May 13, 2025
- Tokyo Electron Limited
- Shyam Sridhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 12,300,728
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sai-Hooi Yeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure
- Patent number 12,295,164
- Issue date May 6, 2025
- Semiconductor Technology Innovation Center (Beijing) Corporation
- Ren Ye
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PLASMA PROCESS FOR ETCHING A MULTILAYER STACK
- Publication number 20250183046
- Publication date Jun 5, 2025
- TOKYO ELECTRON LIMITED
- Jason Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND ETCHING APPARATUS
- Publication number 20250183048
- Publication date Jun 5, 2025
- TOKYO ELECTRON LIMITED
- Nobuhiro TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CLEANING PROCESS FOR SUBSTRATE ETCHING
- Publication number 20250183016
- Publication date Jun 5, 2025
- Applied Materials, Inc.
- Yi Zhou
- B08 - CLEANING
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250183047
- Publication date Jun 5, 2025
- TOKYO ELECTRON LIMITED
- Naoki SHINDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATION OF SEMICONDUCTOR STRUCTURES AND APPARATUS FO...
- Publication number 20250183045
- Publication date Jun 5, 2025
- National Yang Ming Chiao Tung University
- Seiji Samukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PACKAGE INCLUDING THE SEMICONDUCTOR DEVICE
- Publication number 20250183210
- Publication date Jun 5, 2025
- Infineon Technologies Austria AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING OF TRENCHES IN A SUBSTRATE
- Publication number 20250174489
- Publication date May 29, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Thierry BERGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH QUALITY NITRIDE AND OXIDE FABRICATION AND SYSTEM
- Publication number 20250174455
- Publication date May 29, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Saiful Islam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
- Publication number 20250174462
- Publication date May 29, 2025
- TOKYO ELECTRON LIMITED
- Takuya SEINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Edge structure of semiconductor wafer and manufacturing method thereof
- Publication number 20250166997
- Publication date May 22, 2025
- UNITED MICROELECTRONICS CORP.
- Yu-Ping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transistors with Recessed Silicon Cap and Method Forming Same
- Publication number 20250169170
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TREATING APPARATUS AND SUBSTRATE SUPPORT UNIT
- Publication number 20250166977
- Publication date May 22, 2025
- SEMES CO., LTD.
- HYOUNGKYU SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS CURTAIN FOR SEMICONDUCTOR MANUFACUTRING SYSTEM
- Publication number 20250166998
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Lid.
- Kent LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHOWERHEAD DEVICE FOR SEMICONDUCTOR PROCESSING SYSTEM
- Publication number 20250167013
- Publication date May 22, 2025
- ASM IP HOLDING B.V.
- Tom E. Blomberg
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELECTIVE FEATURE MODIFICATION USING DIRECTIONAL DEPOSITION
- Publication number 20250157815
- Publication date May 15, 2025
- Applied Materials, Inc.
- Tassie ANDERSEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20250157811
- Publication date May 15, 2025
- ASM IP HOLDING B.V.
- Jeonghoon Jang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ETCHING METHOD
- Publication number 20250154409
- Publication date May 15, 2025
- Resonac Corporation
- Atsushi SUZUKI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMAL ATOMIC LAYER ETCHING PROCESSES
- Publication number 20250154662
- Publication date May 15, 2025
- ASM IP HOLDING B.V.
- Tom E. Blomberg
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CHIP LIQUID-COOLING HEAT DISSIPATION STRUCTURE AND FABRICATION METH...
- Publication number 20250157884
- Publication date May 15, 2025
- ZTE Corporation
- Cheng TAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inductively Coupled Plasma Source with Radial Coil Network
- Publication number 20250157791
- Publication date May 15, 2025
- Yuhui ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES WITH MULTIPLE SILICID...
- Publication number 20250159965
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yip Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM TRANSISTOR DEVICE AND MANUFACTURING METHOD THEREOF, COMPO...
- Publication number 20250151308
- Publication date May 8, 2025
- WUHAN BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Zhaojian WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELD STRUCTURE FOR BACKSIDE THROUGH SUBSTRATE VIAS (TSVS)
- Publication number 20250149407
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD
- Publication number 20250149294
- Publication date May 8, 2025
- Hitachi High-Tech Corporation
- Juhyun NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20250149342
- Publication date May 8, 2025
- TOKYO ELECTRON LIMITED
- Koki CHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149424
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS OF CONTROL FOR PLASMA PROCESSING
- Publication number 20250149295
- Publication date May 8, 2025
- TOKYO ELECTRON LIMITED
- Alok Ranjan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149425
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE SENSORS AND A METHOD OF MANUFACTURE
- Publication number 20250146971
- Publication date May 8, 2025
- Paragraf Limited
- Liam McDonnell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO SUPPRESS BASE POLY LINKUP OVERGROWTH INTO THE EMITTER CAV...
- Publication number 20250142851
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jerald Rock
- H01 - BASIC ELECTRIC ELEMENTS

Plasma etching Reactive-ion etching

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Thermal atomic layer etching processes

Integrated circuit device with source/drain barrier

Alternating hardmasks for tight-pitch line formation

Semiconductor device and method

Enhanced directed self-assembly in the presence of low Tg oligomers...

Method and apparatus for etching a semiconductor substrate in a pla...

Enhanced etch selectivity using halides

Isotropic silicon nitride removal

Method for making semiconductor device with selective etching of su...

FinFET device and method of forming same

Thermal atomic layer etching processes

Plasma processing method and plasma processing apparatus

Optimized proximity profile for strained source/drain feature and m...

Method for making a radio frequency silicon-on-insulator (RFSOI) wa...

Substrate treating method and substrate treating apparatus

Plasma processing apparatus and methods of manufacturing semiconduc...

Forming films with improved film quality

Substrate processing method and substrate processing apparatus

Method for manufacturing isolation structure of hybrid epitaxial ar...

Semiconductor device and manufacturing method thereof

Method of manufacturing semiconductor structure having fins

Manufacturing method for semiconductor silicon wafer

Method and apparatus

Systems and methods for selective metal compound removal

Method and apparatus for low temperature selective epitaxy in a dee...

Autonomous operation of plasma processing tool

Etching of polycrystalline semiconductors

Method of uniformity control

Semiconductor devices

Method for forming semiconductor structure

Patents Applicationslast 30 patents

PLASMA PROCESS FOR ETCHING A MULTILAYER STACK

ETCHING METHOD AND ETCHING APPARATUS

INTEGRATED CLEANING PROCESS FOR SUBSTRATE ETCHING

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

METHOD FOR FABRICATION OF SEMICONDUCTOR STRUCTURES AND APPARATUS FO...

SEMICONDUCTOR DEVICE AND PACKAGE INCLUDING THE SEMICONDUCTOR DEVICE

FORMING OF TRENCHES IN A SUBSTRATE

HIGH QUALITY NITRIDE AND OXIDE FABRICATION AND SYSTEM

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM

Edge structure of semiconductor wafer and manufacturing method thereof

Transistors with Recessed Silicon Cap and Method Forming Same

SUBSTRATE TREATING APPARATUS AND SUBSTRATE SUPPORT UNIT

GAS CURTAIN FOR SEMICONDUCTOR MANUFACUTRING SYSTEM

SHOWERHEAD DEVICE FOR SEMICONDUCTOR PROCESSING SYSTEM

SELECTIVE FEATURE MODIFICATION USING DIRECTIONAL DEPOSITION

SUBSTRATE PROCESSING METHOD

ETCHING METHOD

THERMAL ATOMIC LAYER ETCHING PROCESSES

CHIP LIQUID-COOLING HEAT DISSIPATION STRUCTURE AND FABRICATION METH...

Inductively Coupled Plasma Source with Radial Coil Network

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES WITH MULTIPLE SILICID...

THIN FILM TRANSISTOR DEVICE AND MANUFACTURING METHOD THEREOF, COMPO...

SHIELD STRUCTURE FOR BACKSIDE THROUGH SUBSTRATE VIAS (TSVS)

PLASMA PROCESSING METHOD

ETCHING METHOD AND PLASMA PROCESSING APPARATUS

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

SYSTEMS AND METHODS OF CONTROL FOR PLASMA PROCESSING

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

GRAPHENE SENSORS AND A METHOD OF MANUFACTURE

METHOD TO SUPPRESS BASE POLY LINKUP OVERGROWTH INTO THE EMITTER CAV...