Plasma etching Reactive-ion etching

Industry

CPC
H01L21/3065

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/3065Plasma etching Reactive-ion etching

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of separating electronic devices having a back layer and app...
- Patent number 12,224,208
- Issue date Feb 11, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process recipe search apparatus, etching recipe search method and s...
- Patent number 12,222,690
- Issue date Feb 11, 2025
- HITACHI HIGH-TECH CORPORATION
- Takashi Dobashi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing semiconductor devices with multiple silicid...
- Patent number 12,218,012
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yip Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon dry etching method
- Patent number 12,217,969
- Issue date Feb 4, 2025
- ULVAC, Inc.
- Kenta Doi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET device and method of forming same
- Patent number 12,218,222
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of etching film and plasma processing apparatus
- Patent number 12,217,973
- Issue date Feb 4, 2025
- Tokyo Electron Limited
- Kosuke Ogasawara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-state pulsing for achieving a balance between bow control and...
- Patent number 12,217,972
- Issue date Feb 4, 2025
- Lam Research Corporation
- Nikhil Dole
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid channel semiconductor device and method
- Patent number 12,211,900
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing thereof
- Patent number 12,211,919
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and etching apparatus
- Patent number 12,211,695
- Issue date Jan 28, 2025
- Tokyo Electron Limited
- Nobuhiro Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for treating substrate and method for treating a substrate
- Patent number 12,211,675
- Issue date Jan 28, 2025
- Semes Co., Ltd.
- Ji Hun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET device and method of forming same
- Patent number 12,211,752
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and a semiconductor...
- Patent number 12,211,895
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-high modulus and etch selectivity boron-carbon hardmask films
- Patent number 12,211,694
- Issue date Jan 28, 2025
- Applied Materials, Inc.
- Prashant Kumar Kulshreshtha
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing semiconductor structure with improved etchi...
- Patent number 12,211,696
- Issue date Jan 28, 2025
- NANYA TECHNOLOGY CORPORATION
- Zhi-Yi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing element chips
- Patent number 12,205,823
- Issue date Jan 21, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Toshiyuki Takasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of preparing semiconductor structure having low dielectric c...
- Patent number 12,205,825
- Issue date Jan 21, 2025
- NANYA TECHNOLOGY CORPORATION
- Yu-Kai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for anisotropic pattern etching and treatment
- Patent number 12,205,793
- Issue date Jan 21, 2025
- Lam Research Corporation
- Seokmin Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma control method in semiconductor wafer fabrication
- Patent number 12,205,844
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Huang-Shao Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor structure
- Patent number 12,206,010
- Issue date Jan 21, 2025
- Winbond Electronics Corp.
- Shu-Ming Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition of organic films
- Patent number 12,205,820
- Issue date Jan 21, 2025
- ASM IP Holding B.V.
- Eva E. Tois
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etching method and plasma processing apparatus
- Patent number 12,198,937
- Issue date Jan 14, 2025
- Tokyo Electron Limited
- Koki Chino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for semiconductor manufacturing
- Patent number 12,198,939
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Han-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing process for semiconductor optical device for lidar se...
- Patent number 12,199,132
- Issue date Jan 14, 2025
- AURORA OPERATIONS, INC.
- Lei Wang
- G01 - MEASURING TESTING
Information Patent Grant
Substrate support with multiple embedded electrodes
- Patent number 12,198,966
- Issue date Jan 14, 2025
- Applied Materials, Inc.
- Philip Allan Kraus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method
- Patent number 12,198,938
- Issue date Jan 14, 2025
- Tokyo Electron Limited
- Takatoshi Orui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around transistor with reduced source/drain contact resist...
- Patent number 12,191,151
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jui-Ping Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer treatment system and method of treating wafer
- Patent number 12,183,550
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure with improved etchi...
- Patent number 12,183,584
- Issue date Dec 31, 2024
- NANYA TECHNOLOGY CORPORATION
- Zhi-Yi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Remote source pulsing with advanced pulse control
- Patent number 12,183,583
- Issue date Dec 31, 2024
- Tokyo Electron Limited
- Peter Lowell George Ventzek
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR ION ENERGY ANALYSIS OF PLASMA PROCESSES
- Publication number 20250054740
- Publication date Feb 13, 2025
- Impedans Ltd
- Paul SCULLIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF ETCHING CARBON-CONTAINING FEATURES AT LOW TEMPERATURES
- Publication number 20250054768
- Publication date Feb 13, 2025
- Applied Materials, Inc.
- Jiajing Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ION BEAM ETCHING APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20250046629
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Geun Young YEOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PATTERNING A TARGET LAYER, APPARATUS FOR PATTERNING A TAR...
- Publication number 20250046577
- Publication date Feb 6, 2025
- ASML NETHERLANDS B.V.
- Syam Parayil VENUGOPALAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD
- Publication number 20250046615
- Publication date Feb 6, 2025
- TOKYO ELECTRON LIMITED
- Takahiro YOKOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Atomic Layer Deposition of Passivation Layer
- Publication number 20250046603
- Publication date Feb 6, 2025
- TOKYO ELECTRON LIMITED
- Du Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ATOMIC LAYER ETCH OF Si-BASED MATERIALS
- Publication number 20250046614
- Publication date Feb 6, 2025
- TOKYO ELECTRON LIMITED
- Mehrdad Rostami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-GATE FET WITH SELF-ALIGNED TAPERED ACTIVE REGION EDGE
- Publication number 20250048695
- Publication date Feb 6, 2025
- International Business Machines Corporation
- Reinaldo Vega
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS WITH HEATED FILTER AND OPERATION METHOD OF THE SAME
- Publication number 20250046584
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Lun LU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DOPED DIAMOND-LIKE CARBON
- Publication number 20250046610
- Publication date Feb 6, 2025
- Applied Materials, Inc.
- Jialiang WANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR WAFER PROCESSING METHOD
- Publication number 20250038033
- Publication date Jan 30, 2025
- Hitachi High-Tech Corporation
- Nozomu YOSHIOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF ANTIREFLECTIVE SURFACES
- Publication number 20250033955
- Publication date Jan 30, 2025
- Brookhaven Science Associates, LLC
- Charles T. Black
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method For Forming Resist Underlayer Film And Patterning Process
- Publication number 20250036029
- Publication date Jan 30, 2025
- Shin-Etsu Chemical Co., Ltd.
- Naoki KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20250031434
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR SEPARATING SEMICONDUCTOR DEVICES USING SINGULATION GROO...
- Publication number 20250029878
- Publication date Jan 23, 2025
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ETCHING BETWEEN SILICON-AND-GERMANIUM-CONTAINING MATERIAL...
- Publication number 20250029841
- Publication date Jan 23, 2025
- Applied Materials, Inc.
- Jiayin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
- Publication number 20250022755
- Publication date Jan 16, 2025
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLASMA ETCHING PROCESSES
- Publication number 20250022715
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Ging Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ADJUSTING LINEWIDTH DUE TO PATTERN LOAD EFFECT IN SADP M...
- Publication number 20250022717
- Publication date Jan 16, 2025
- Shanghai Huali Integrated Circuit Corporation
- Liyuan Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS CLUSTER ASSISTED PLASMA PROCESSING
- Publication number 20250022689
- Publication date Jan 16, 2025
- TOKYO ELECTRON LIMITED
- Peter Ventzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CYCLIC ETCH OF SILICON OXIDE AND SILICON NITRIDE
- Publication number 20250022714
- Publication date Jan 16, 2025
- Applied Materials, Inc.
- Sonam Dorje Sherpa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250022706
- Publication date Jan 16, 2025
- TOKYO ELECTRON LIMITED
- Tomohiko NIIZEKI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING
- Publication number 20250015166
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Ging Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE TREATMENT METHOD
- Publication number 20250014905
- Publication date Jan 9, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Ludovic DUPRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROTECTING ACTIVE LAYERS OF ELECTRONIC CHIPS
- Publication number 20250014912
- Publication date Jan 9, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Emilie BOURJOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR STACKING INTEGRATED CIRCUIT WAFERS AND DIES
- Publication number 20250015045
- Publication date Jan 9, 2025
- TOKYO ELECTRON LIMITED
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD
- Publication number 20250014907
- Publication date Jan 9, 2025
- HITACHI HIGH-TECH CORPORATION
- Takashi Hattori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MULTI-GATE DEVICE WITH REDUCED CONTACT RESISTANCE AND METHO...
- Publication number 20250006561
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Kan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma Etching Method and Apparatus
- Publication number 20250006537
- Publication date Jan 2, 2025
- SPTS TECHNOLOGIES LIMITED
- Adam S. BEACHEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES WITH REMOVED SUB-FIN
- Publication number 20250006547
- Publication date Jan 2, 2025
- Intel Corporation
- Mohammad HASAN
- H01 - BASIC ELECTRIC ELEMENTS

Plasma etching Reactive-ion etching

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of separating electronic devices having a back layer and app...

Process recipe search apparatus, etching recipe search method and s...

Method of manufacturing semiconductor devices with multiple silicid...

Silicon dry etching method

FinFET device and method of forming same

Method of etching film and plasma processing apparatus

Multi-state pulsing for achieving a balance between bow control and...

Hybrid channel semiconductor device and method

Semiconductor devices and methods of manufacturing thereof

Etching method and etching apparatus

Apparatus for treating substrate and method for treating a substrate

FinFET device and method of forming same

Method of manufacturing a semiconductor device and a semiconductor...

Ultra-high modulus and etch selectivity boron-carbon hardmask films

Method of manufacturing semiconductor structure with improved etchi...

Method for producing element chips

Method of preparing semiconductor structure having low dielectric c...

Method and apparatus for anisotropic pattern etching and treatment

Plasma control method in semiconductor wafer fabrication

Method for forming a semiconductor structure

Deposition of organic films

Etching method and plasma processing apparatus

Technique for semiconductor manufacturing

Manufacturing process for semiconductor optical device for lidar se...

Substrate support with multiple embedded electrodes

Etching method

Gate-all-around transistor with reduced source/drain contact resist...

Wafer treatment system and method of treating wafer

Method of manufacturing semiconductor structure with improved etchi...

Remote source pulsing with advanced pulse control

Patents Applicationslast 30 patents

APPARATUS FOR ION ENERGY ANALYSIS OF PLASMA PROCESSES

METHODS OF ETCHING CARBON-CONTAINING FEATURES AT LOW TEMPERATURES

ION BEAM ETCHING APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR...

METHOD OF PATTERNING A TARGET LAYER, APPARATUS FOR PATTERNING A TAR...

ETCHING METHOD

Atomic Layer Deposition of Passivation Layer

SELECTIVE ATOMIC LAYER ETCH OF Si-BASED MATERIALS

MULTI-GATE FET WITH SELF-ALIGNED TAPERED ACTIVE REGION EDGE

APPARATUS WITH HEATED FILTER AND OPERATION METHOD OF THE SAME

DOPED DIAMOND-LIKE CARBON

SEMICONDUCTOR WAFER PROCESSING METHOD

FORMATION OF ANTIREFLECTIVE SURFACES

Method For Forming Resist Underlayer Film And Patterning Process

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

METHODS FOR SEPARATING SEMICONDUCTOR DEVICES USING SINGULATION GROO...

SELECTIVE ETCHING BETWEEN SILICON-AND-GERMANIUM-CONTAINING MATERIAL...

WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH

PLASMA ETCHING PROCESSES

METHOD FOR ADJUSTING LINEWIDTH DUE TO PATTERN LOAD EFFECT IN SADP M...

GAS CLUSTER ASSISTED PLASMA PROCESSING

CYCLIC ETCH OF SILICON OXIDE AND SILICON NITRIDE

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING

SURFACE TREATMENT METHOD

METHOD FOR PROTECTING ACTIVE LAYERS OF ELECTRONIC CHIPS

METHOD FOR STACKING INTEGRATED CIRCUIT WAFERS AND DIES

ETCHING METHOD

STACKED MULTI-GATE DEVICE WITH REDUCED CONTACT RESISTANCE AND METHO...

Plasma Etching Method and Apparatus

INTEGRATED CIRCUIT STRUCTURES WITH REMOVED SUB-FIN