Plated through-hole for surface mounting on PCB

Industry

CPC
H05K2201/10666

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10666Plated through-hole for surface mounting on PCB

Industries

Patents Grantslast 30 patents

Information Patent Grant
PCB production by laser systems
- Patent number 11,877,398
- Issue date Jan 16, 2024
- IO Tech Group Ltd.
- Michael Zenou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and communications device
- Patent number 11,019,724
- Issue date May 25, 2021
- Huawei Technologies Co., Ltd.
- Feng Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector devices, systems, and related methods for light emitter c...
- Patent number 9,215,792
- Issue date Dec 15, 2015
- Cree, Inc.
- Christopher P. Hussell
- F21 - LIGHTING
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,030,007
- Issue date May 12, 2015
- Fujitsu Limited
- Daisuke Mizutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit solder connections
- Patent number 8,969,730
- Issue date Mar 3, 2015
- Apple Inc.
- Anthony S. Montevirgen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for stacking integrated circuits
- Patent number 8,686,572
- Issue date Apr 1, 2014
- Stec, Inc.
- Mark Moshayedi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive structure
- Patent number 8,514,587
- Issue date Aug 20, 2013
- Innocom Technology (Shenzhen) Co., Ltd.
- Jun-Yong Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive reinforced open hole interconnect
- Patent number 8,354,595
- Issue date Jan 15, 2013
- Raytheon Company
- Kevin C. Rolston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting structure for circuit board and connecting method using...
- Patent number 8,350,162
- Issue date Jan 8, 2013
- Samsung Electronics Co., Ltd.
- Hyun Tae Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package module and method of the same
- Patent number 8,344,500
- Issue date Jan 1, 2013
- Mutual-Pak Technology Co., Ltd.
- Lu-Chen Hwan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for stacking integrated circuits
- Patent number 8,344,518
- Issue date Jan 1, 2013
- Stec, Inc.
- Mark Moshayedi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connection between piezoelectric actuator and head suspe...
- Patent number 8,248,731
- Issue date Aug 21, 2012
- NHK Spring Co., Ltd.
- Hideki Fuchino
- G11 - INFORMATION STORAGE
Information Patent Grant
Wiring connecting structure for piezoelectric element, wiring conne...
- Patent number 8,149,542
- Issue date Apr 3, 2012
- NHK Spring Co., Ltd.
- Toshiki Ando
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of manufacturing a wired circuit board
- Patent number 8,146,246
- Issue date Apr 3, 2012
- Nitto Denko Corporation
- Hitoki Kanagawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package having solder ball which has double connectio...
- Patent number 8,143,709
- Issue date Mar 27, 2012
- Samsung Electronics Co., Ltd.
- Hye-Jin Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit
- Patent number 8,030,574
- Issue date Oct 4, 2011
- Innocom Technology (Shenzhen) Co., Ltd.
- Wen-Bin Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package, module, system having solder ball coupled to...
- Patent number 8,026,584
- Issue date Sep 27, 2011
- Samsung Electronics Co., Ltd.
- Hye-jin Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a wired circuit board
- Patent number 8,015,703
- Issue date Sep 13, 2011
- Nitto Denko Corporation
- Hitoki Kanagawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Termination apparatus and method for planar components on printed c...
- Patent number 7,944,710
- Issue date May 17, 2011
- Battery-Biz Inc.
- Victor Marten
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for stacking integrated circuits
- Patent number 7,902,651
- Issue date Mar 8, 2011
- Stec, Inc.
- Mark Moshayedi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wired circuit board
- Patent number 7,732,900
- Issue date Jun 8, 2010
- Nitto Denko Corporation
- Hitoki Kanagawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Electronic parts packaging structure and method of manufacturing th...
- Patent number 7,718,900
- Issue date May 18, 2010
- Shinko Electric Industries Co., Ltd.
- Eiji Takaike
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor sheet and electronic circuit board
- Patent number 7,709,929
- Issue date May 4, 2010
- Fujitsu Limited
- Kouichi Kuramitsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Monoblock RF resonator/filter having a conductive transmission line...
- Patent number 7,619,496
- Issue date Nov 17, 2009
- CTS Corporation
- Alexandre Rogozine
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and forming method thereof
- Patent number 7,615,707
- Issue date Nov 10, 2009
- Lite-On Technology Corp.
- Yung-Jen Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Visually inspectable surface mount device pad
- Patent number 7,612,296
- Issue date Nov 3, 2009
- Synergy Microwave Corporation
- Meta Rohde
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package and electronic apparatus using the same
- Patent number 7,605,467
- Issue date Oct 20, 2009
- Mitsubishi Electric Corporation
- Yoshio Fujii
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus for venting an electronic control module
- Patent number 7,570,492
- Issue date Aug 4, 2009
- Temic Automotive of North America, Inc.
- Thomas P. Gall
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-stacked package and method of manufacturing the same
- Patent number 7,566,961
- Issue date Jul 28, 2009
- Samsung Electronics Co., Ltd.
- Yeoung-Jun Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer module and method of manufacturing the same
- Patent number 7,532,485
- Issue date May 12, 2009
- Panasonic Corporation
- Junichi Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PCB PRODUCTION BY LASER SYSTEMS
- Publication number 20240064897
- Publication date Feb 22, 2024
- IO Tech Group Ltd.
- Michael Zenou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Module and Method for Producing an Electronic Module
- Publication number 20230094926
- Publication date Mar 30, 2023
- Rogers Germany GmbH
- Andreas Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB PRODUCTION BY LASER SYSTEMS
- Publication number 20220256698
- Publication date Aug 11, 2022
- IO TECH GROUP LTD.
- Michael Zenou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTOR DEVICES, SYSTEMS, AND RELATED METHODS FOR LIGHT EMITTER C...
- Publication number 20140265809
- Publication date Sep 18, 2014
- Christopher P. Hussell
- F21 - LIGHTING
Information Patent Application
Printed Circuit Solder Connections
- Publication number 20140048310
- Publication date Feb 20, 2014
- Apple Inc.
- Anthony S. Montevirgen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR STACKING INTEGRATED CIRCUITS
- Publication number 20130107468
- Publication date May 2, 2013
- STEC, Inc.
- Mark MOSHAYEDI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKING OF TRANSFER CARRIERS WITH APERTURE ARRAYS AS INTERCONNECTI...
- Publication number 20110278725
- Publication date Nov 17, 2011
- NICHEPAC TECHNOLOGY INC.
- Cheng-Lien CHIANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE REINFORCED OPEN HOLE INTERCONNECT
- Publication number 20110261539
- Publication date Oct 27, 2011
- Kevin C. Rolston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wired circuit board
- Publication number 20110119911
- Publication date May 26, 2011
- Nitto Denko Corporation
- Hitoki Kanagawa
- G11 - INFORMATION STORAGE
Information Patent Application
CONDUCTIVE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110083882
- Publication date Apr 14, 2011
- INNOCOM TECHNOLOGY (SHENZHEN) CO., LTD.
- JUN-YONG ZHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20110084383
- Publication date Apr 14, 2011
- FUJITSU LIMITED
- Daisuke Mizutani
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
APPARATUS AND METHOD FOR STACKING INTEGRATED CIRCUITS
- Publication number 20100327436
- Publication date Dec 30, 2010
- STEC, Inc.
- Mark MOSHAYEDI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Connecting structure for circuit board and connecting method using...
- Publication number 20100243309
- Publication date Sep 30, 2010
- SAMSUNG ELECTRONICS CO., LTD.
- Hyun Tae Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING STRUCTURE AND ELECTRONIC COMPONENT MO...
- Publication number 20100214741
- Publication date Aug 26, 2010
- Fujitsu Limited
- Rie Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONNECTING STRUCTURE AND ELECTRICAL CONNECTING METHOD FO...
- Publication number 20100165516
- Publication date Jul 1, 2010
- NHK Spring Co., Ltd.
- Hideki FUCHINO
- G11 - INFORMATION STORAGE
Information Patent Application
WIRING CONNECTING STRUCTURE FOR PIEZOELECTRIC ELEMENT, WIRING CONNE...
- Publication number 20100165515
- Publication date Jul 1, 2010
- NHK Spring Co., Ltd.
- Toshiki ANDO
- G11 - INFORMATION STORAGE
Information Patent Application
TERMINATION APPARATUS AND METHOD FOR PLANAR COMPONENTS ON PRINTED C...
- Publication number 20100118505
- Publication date May 13, 2010
- BATTERY-BIZ® INC.
- Victor Marten
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING SOLDER BALL WHICH HAS DOUBLE CONNECTIO...
- Publication number 20100090324
- Publication date Apr 15, 2010
- Samsung Electronics Co., Ltd.
- Hye-Jin KIM
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
INTEGRATED CIRCUIT PACKAGE MODULE AND METHOD OF THE SAME
- Publication number 20090294953
- Publication date Dec 3, 2009
- MUTUAL PAK TECHNOLOGY CO., LTD.
- Lu-Chen Hwan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package and associated methods
- Publication number 20090257209
- Publication date Oct 15, 2009
- Seong-Chan Han
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
STACKING OF TRANSFER CARRIERS WITH APERTURE ARRAYS AS INTERCONNECTI...
- Publication number 20090206481
- Publication date Aug 20, 2009
- NICHEPAC TECHNOLOGY INC.
- Cheng-Lien Chiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANTI-BREAKAGE STRUCTURE FOR TRANSMITTING END FORMED ON FLEXIBLE PRI...
- Publication number 20090178829
- Publication date Jul 16, 2009
- WINTEX CORPORATION
- Tsui-Chuan WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE, MODULE, SYSTEM HAVING SOLDER BALL COUPLED TO...
- Publication number 20090102037
- Publication date Apr 23, 2009
- Samsung Electronics Co., Ltd.
- Hye-jin KIM
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
LED Multidimensional Printed Wiring Board Using Standoff Boards
- Publication number 20090073713
- Publication date Mar 19, 2009
- Andrew Z. Glovatsky
- F21 - LIGHTING
Information Patent Application
Flexible printed circuit
- Publication number 20080277145
- Publication date Nov 13, 2008
- INNOCOM TECHNOLOGY (SHENZHEN) CO., LTD. INNOLUX DISPLAY CORP.
- Wen-Bin Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wired circuit board
- Publication number 20080277142
- Publication date Nov 13, 2008
- Nitto Denko Corporation
- Hitoki Kanagawa
- G11 - INFORMATION STORAGE
Information Patent Application
Connection for Flex Circuit and Rigid Circuit Board
- Publication number 20080254653
- Publication date Oct 16, 2008
- Harshad K. Uka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKING OF TRANSFER CARRIERS WITH APERTURE ARRAYS AS INTERCONNECTI...
- Publication number 20080179721
- Publication date Jul 31, 2008
- Cheng-Lien Chiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD CONNECTION
- Publication number 20080146048
- Publication date Jun 19, 2008
- Hubert Nestler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION FOR FLEX CIRCUIT AND RIGID CIRCUIT BOARD
- Publication number 20080139011
- Publication date Jun 12, 2008
- Harshad K. Uka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Plated through-hole for surface mounting on PCB

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

PCB production by laser systems

Printed circuit board and communications device

Connector devices, systems, and related methods for light emitter c...

Semiconductor device and manufacturing method thereof

Printed circuit solder connections

Apparatus for stacking integrated circuits

Conductive structure

Adhesive reinforced open hole interconnect

Connecting structure for circuit board and connecting method using...

Integrated circuit package module and method of the same

Apparatus for stacking integrated circuits

Electrical connection between piezoelectric actuator and head suspe...

Wiring connecting structure for piezoelectric element, wiring conne...

Method of manufacturing a wired circuit board

Semiconductor package having solder ball which has double connectio...

Flexible printed circuit

Semiconductor package, module, system having solder ball coupled to...

Method of manufacturing a wired circuit board

Termination apparatus and method for planar components on printed c...

Apparatus and method for stacking integrated circuits

Wired circuit board

Electronic parts packaging structure and method of manufacturing th...

Capacitor sheet and electronic circuit board

Monoblock RF resonator/filter having a conductive transmission line...

Printed circuit board and forming method thereof

Visually inspectable surface mount device pad

Package and electronic apparatus using the same

Apparatus for venting an electronic control module

Multi-stacked package and method of manufacturing the same

Multilayer module and method of manufacturing the same

Patents Applicationslast 30 patents

PCB PRODUCTION BY LASER SYSTEMS

Electronic Module and Method for Producing an Electronic Module

PCB PRODUCTION BY LASER SYSTEMS

CONNECTOR DEVICES, SYSTEMS, AND RELATED METHODS FOR LIGHT EMITTER C...

Printed Circuit Solder Connections

APPARATUS AND METHOD FOR STACKING INTEGRATED CIRCUITS

STACKING OF TRANSFER CARRIERS WITH APERTURE ARRAYS AS INTERCONNECTI...

ADHESIVE REINFORCED OPEN HOLE INTERCONNECT

Wired circuit board

CONDUCTIVE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

APPARATUS AND METHOD FOR STACKING INTEGRATED CIRCUITS

Connecting structure for circuit board and connecting method using...

ELECTRONIC COMPONENT MOUNTING STRUCTURE AND ELECTRONIC COMPONENT MO...

ELECTRICAL CONNECTING STRUCTURE AND ELECTRICAL CONNECTING METHOD FO...

WIRING CONNECTING STRUCTURE FOR PIEZOELECTRIC ELEMENT, WIRING CONNE...

TERMINATION APPARATUS AND METHOD FOR PLANAR COMPONENTS ON PRINTED C...

SEMICONDUCTOR PACKAGE HAVING SOLDER BALL WHICH HAS DOUBLE CONNECTIO...

INTEGRATED CIRCUIT PACKAGE MODULE AND METHOD OF THE SAME

Semiconductor package and associated methods

STACKING OF TRANSFER CARRIERS WITH APERTURE ARRAYS AS INTERCONNECTI...

ANTI-BREAKAGE STRUCTURE FOR TRANSMITTING END FORMED ON FLEXIBLE PRI...

SEMICONDUCTOR PACKAGE, MODULE, SYSTEM HAVING SOLDER BALL COUPLED TO...

LED Multidimensional Printed Wiring Board Using Standoff Boards

Flexible printed circuit

Wired circuit board

Connection for Flex Circuit and Rigid Circuit Board

STACKING OF TRANSFER CARRIERS WITH APERTURE ARRAYS AS INTERCONNECTI...

PRINTED CIRCUIT BOARD CONNECTION

CONNECTION FOR FLEX CIRCUIT AND RIGID CIRCUIT BOARD