Plating catalyst as filler in insulating material

Industry

CPC
H05K2201/0236

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0236Plating catalyst as filler in insulating material

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electroless and electrolytic deposition process for forming traces...
- Patent number 11,653,453
- Issue date May 16, 2023
- CATLAM, LLC
- Kenneth S Bahl
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Catalytic laminate with conductive traces formed during lamination
- Patent number 11,477,893
- Issue date Oct 18, 2022
- CATLAM, LLC
- Kenneth S Bahl
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Molded interconnect device
- Patent number 11,357,112
- Issue date Jun 7, 2022
- Molex, LLC
- Tsuey Choo Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermosetting resin composition for LDS, resin molded article, and...
- Patent number 11,174,402
- Issue date Nov 16, 2021
- Sumitomo Bakelite Co., Ltd.
- Toru Meura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for forming traces on a catalytic laminate
- Patent number 10,849,233
- Issue date Nov 24, 2020
- CATLAM, LLC
- Kenneth S Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Catalytic laminate with conductive traces formed during lamination
- Patent number 10,827,624
- Issue date Nov 3, 2020
- CATLAM, LLC
- Kenneth S Bahl
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Embedded circuit patterning feature selective electroless
- Patent number 10,586,715
- Issue date Mar 10, 2020
- Intel Corporation
- Yonggang Yong Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Component carrier and method for manufacturing the same
- Patent number 10,424,541
- Issue date Sep 24, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Hannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition and method for forming conductive pattern, and resin st...
- Patent number 10,349,527
- Issue date Jul 9, 2019
- LG Chem, Ltd.
- Chee-Sung Park
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Composition for forming conductive pattern and resin structure havi...
- Patent number 10,297,363
- Issue date May 21, 2019
- LG Chem, Ltd.
- Shin Hee Jun
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Selective metallization of an integrated circuit (IC) substrate
- Patent number 10,290,557
- Issue date May 14, 2019
- Intel Corporation
- Brandon C. Marin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure and manufacturing method of package structure
- Patent number 10,256,180
- Issue date Apr 9, 2019
- IBIS Innotech Inc.
- Wen-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer product and method for selectively metallizing polymer subs...
- Patent number 10,161,044
- Issue date Dec 25, 2018
- BYD Company Limited
- Wei Zhou
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor structure
- Patent number 10,090,256
- Issue date Oct 2, 2018
- IBIS Innotech Inc.
- Wen-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal compound, method for preparing the same, selective metallizat...
- Patent number 10,059,852
- Issue date Aug 28, 2018
- Shenzhen BYD Auto R&D Company Limited
- Qing Gong
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Composition and method for forming conductive pattern, and resin st...
- Patent number 9,967,974
- Issue date May 8, 2018
- LG Chem, Ltd.
- Chee-Sung Park
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Light source unit
- Patent number 9,967,981
- Issue date May 8, 2018
- Koito Manufacturing Co., Ltd.
- Yoshiaki Aiso
- B60 - VEHICLES IN GENERAL
Information Patent Grant
High modulus laser direct structuring polycarbonate composites with...
- Patent number 9,944,768
- Issue date Apr 17, 2018
- SABIC GLOBAL TECHNOLOGIES B.V.
- Yunan Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser activatable polymer composition
- Patent number 9,896,566
- Issue date Feb 20, 2018
- Ticona LLC
- Paul C. Yung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Doped tin oxide and method for selective metallization of insulatin...
- Patent number 9,869,025
- Issue date Jan 16, 2018
- BYD Company Limited
- Qing Gong
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Package structure
- Patent number 9,801,282
- Issue date Oct 24, 2017
- IBIS Innotech Inc.
- Wen-Chun Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via in a printed circuit board
- Patent number 9,706,667
- Issue date Jul 11, 2017
- Sierra Circuits, Inc.
- Konstantine Karavakis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Core-shell composite inorganic metal oxides and method of preparing...
- Patent number 9,676,927
- Issue date Jun 13, 2017
- The Shepherd Color Company
- Michael D. Musick
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Via in a printed circuit board
- Patent number 9,674,967
- Issue date Jun 6, 2017
- Sierra Circuits, Inc.
- Konstantine Karavakis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composition and method for forming conductive pattern, and resin st...
- Patent number 9,668,342
- Issue date May 30, 2017
- LG Chem, Ltd.
- Shin Hee Jun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Embedded circuit patterning feature selective electroless copper pl...
- Patent number 9,646,854
- Issue date May 9, 2017
- Intel Corporation
- Yonggang Yong Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for forming embedded traces
- Patent number 9,631,279
- Issue date Apr 25, 2017
- Sierra Circuits, Inc.
- Kenneth S. Bahl
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Thermoplastic resin composition, resin molded article, and method f...
- Patent number 9,587,316
- Issue date Mar 7, 2017
- Mitsubishi Engineering-Plastics Corporation
- Takahiro Takano
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for electroless copper deposition on laser-direct structure...
- Patent number 9,538,665
- Issue date Jan 3, 2017
- Edwin W. Bastenbeck
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Package structure
- Patent number 9,508,634
- Issue date Nov 29, 2016
- IBIS Innotech Inc.
- Wen-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MAKING A MOLDED INTERCONNECT DEVICE
- Publication number 20220279656
- Publication date Sep 1, 2022
- Molex, LLC
- Tsuey Choo CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Catalytic Laminate with Conductive Traces formed during Lamination
- Publication number 20210022252
- Publication date Jan 21, 2021
- CATLAM LLC
- Kenneth S BAHL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THERMOSETTING RESIN COMPOSITION FOR LDS, RESIN MOLDED ARTICLE, AND...
- Publication number 20190292386
- Publication date Sep 26, 2019
- SUMITOMO BAKELITE CO., LTD.
- Toru MEURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Catalytic Laminate with Conductive Traces formed during Lamination
- Publication number 20190274221
- Publication date Sep 5, 2019
- SIERRA CIRCUITS, INC.
- Kenneth S. BAHL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MOLDED INTERCONNECT DEVICE AND METHOD OF MAKING SAME
- Publication number 20190166698
- Publication date May 30, 2019
- Molex, LLC
- Tsuey Choo CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VIA IN A PRINTED CIRCUIT BOARD
- Publication number 20160295708
- Publication date Oct 6, 2016
- SIERRA CIRCUITS, INC.
- Konstantine Karavakis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POLYMER ARTICLE AND METHOD FOR SELECTIVE METALLIZATION OF THE SAME
- Publication number 20140349030
- Publication date Nov 27, 2014
- SHENZHEN BYD AUTO R&D COMPANY LIMITED
- Qing GONG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METAL COMPOUND, METHOD FOR PREPARING THE SAME, SELECTIVE METALLIZAT...
- Publication number 20140290530
- Publication date Oct 2, 2014
- BYD COMPANY LIMITED
- Qing GONG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGH MODULUS LASER DIRECT STRUCTURING POLYCARBONATE COMPOSITES WITH...
- Publication number 20140296410
- Publication date Oct 2, 2014
- Yunan Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH MODULUS LASER DIRECT STRUCTURING COMPOSITES
- Publication number 20140296411
- Publication date Oct 2, 2014
- SABIC INNOVATIVE PLASTICS IP BV
- Yunan Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING THREE-DIMENSIONAL INTEGRATED CIRCUIT
- Publication number 20140284849
- Publication date Sep 25, 2014
- Dongsheng LIU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
AQUEOUS ACTIVATOR SOLUTION AND PROCESS FOR ELECTROLESS COPPER DEPOS...
- Publication number 20140255600
- Publication date Sep 11, 2014
- Enthone Inc.
- Edwin W. Bastenbeck
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
PLUG AND METHOD FOR PRODUCING SAME
- Publication number 20140199890
- Publication date Jul 17, 2014
- REICHLE & DE-MASSARI AG
- Dominik Schweizer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR LASER DIRECT STRUCTURING AND LASER DIRECT STRUCTURI...
- Publication number 20140159285
- Publication date Jun 12, 2014
- DIGITAL GRAPHICS INCORPORATION
- Kwan Soo Choi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Photopatterning
- Publication number 20140004320
- Publication date Jan 2, 2014
- Conductive Inkjet Technology Limited
- Philip Gareth Bentley
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THERMOPLASTIC RESIN COMPOSITION, RESIN MOLDED ARTICLE, AND METHOD O...
- Publication number 20140002311
- Publication date Jan 2, 2014
- MITSUBISHI ENGINEERING-PLASTICS CORPORATION
- Takahiro Takano
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
ELECTRONIC DEVICE HOUSING AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130321988
- Publication date Dec 5, 2013
- PO-FENG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Improving Plating on Non-Conductive Substrates
- Publication number 20130136869
- Publication date May 30, 2013
- MACDERMID ACUMEN, INC.
- Robert Hamilton
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
CIRCUIT BOARD AND FABRICATION METHOD THEREOF
- Publication number 20130040071
- Publication date Feb 14, 2013
- Unimicron Technology Corp.
- Cheng-Po Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED WIRING BOARD AND A MANUFACTURING METHOD THEREOF
- Publication number 20120231179
- Publication date Sep 13, 2012
- Unimicron Technology Corp.
- Cheng-Po Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SELECTIVELY METALLIZING A SUBSTRATE AND INTERCONNECT DEV...
- Publication number 20120183793
- Publication date Jul 19, 2012
- LPKF Laser & Electronics AG
- Wolfgang John
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
EMBEDDED STRUCTURE OF CIRCUIT BOARD
- Publication number 20120160551
- Publication date Jun 28, 2012
- Yi-Chun Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Molded Interconnect Device (MID) with Thermal Conductive Property a...
- Publication number 20120134631
- Publication date May 31, 2012
- KUANG HONG PRECISION CO., LTD.
- Cheng-Feng Chiang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Manufacturing Method for Forming Circuit Structure on Non-Conductiv...
- Publication number 20120074094
- Publication date Mar 29, 2012
- KUANG HONG PRECISION CO., LTD.
- Cheng-Feng Chiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FABRICATING CIRCUIT BOARD STRUCTURE
- Publication number 20120060368
- Publication date Mar 15, 2012
- Cheng-Po Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITIONS AND METHODS FOR CREATING ELECTRONIC CIRCUITRY
- Publication number 20110302778
- Publication date Dec 15, 2011
- E.I. du Pont de Nemours and Company
- YUEH-LING LEE
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR ELECTRIC CIRCUIT DEPOSITION
- Publication number 20110292622
- Publication date Dec 1, 2011
- Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO
- Arjan Hovestad
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTILAYER THREE-DIMENSIONAL CIRCUIT STRUCTURE
- Publication number 20110253435
- Publication date Oct 20, 2011
- Unimicron Technology Corp.
- Han-Pei Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Improving Plating on Non-Conductive Substrates
- Publication number 20110183082
- Publication date Jul 28, 2011
- Robert Hamilton
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COMPOSITION WITH CATALYST PARTICLES
- Publication number 20110143922
- Publication date Jun 16, 2011
- Cheng-Hsien Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Plating catalyst as filler in insulating material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electroless and electrolytic deposition process for forming traces...

Catalytic laminate with conductive traces formed during lamination

Molded interconnect device

Thermosetting resin composition for LDS, resin molded article, and...

Process for forming traces on a catalytic laminate

Catalytic laminate with conductive traces formed during lamination

Embedded circuit patterning feature selective electroless

Component carrier and method for manufacturing the same

Composition and method for forming conductive pattern, and resin st...

Composition for forming conductive pattern and resin structure havi...

Selective metallization of an integrated circuit (IC) substrate

Package structure and manufacturing method of package structure

Polymer product and method for selectively metallizing polymer subs...

Semiconductor structure

Metal compound, method for preparing the same, selective metallizat...

Composition and method for forming conductive pattern, and resin st...

Light source unit

High modulus laser direct structuring polycarbonate composites with...

Laser activatable polymer composition

Doped tin oxide and method for selective metallization of insulatin...

Package structure

Via in a printed circuit board

Core-shell composite inorganic metal oxides and method of preparing...

Via in a printed circuit board

Composition and method for forming conductive pattern, and resin st...

Embedded circuit patterning feature selective electroless copper pl...

Methods for forming embedded traces

Thermoplastic resin composition, resin molded article, and method f...

Process for electroless copper deposition on laser-direct structure...

Package structure

Patents Applicationslast 30 patents

METHOD OF MAKING A MOLDED INTERCONNECT DEVICE

Catalytic Laminate with Conductive Traces formed during Lamination

THERMOSETTING RESIN COMPOSITION FOR LDS, RESIN MOLDED ARTICLE, AND...

Catalytic Laminate with Conductive Traces formed during Lamination

MOLDED INTERCONNECT DEVICE AND METHOD OF MAKING SAME

VIA IN A PRINTED CIRCUIT BOARD

POLYMER ARTICLE AND METHOD FOR SELECTIVE METALLIZATION OF THE SAME

METAL COMPOUND, METHOD FOR PREPARING THE SAME, SELECTIVE METALLIZAT...

HIGH MODULUS LASER DIRECT STRUCTURING POLYCARBONATE COMPOSITES WITH...

HIGH MODULUS LASER DIRECT STRUCTURING COMPOSITES

METHOD FOR MANUFACTURING THREE-DIMENSIONAL INTEGRATED CIRCUIT

AQUEOUS ACTIVATOR SOLUTION AND PROCESS FOR ELECTROLESS COPPER DEPOS...

PLUG AND METHOD FOR PRODUCING SAME

COMPOSITION FOR LASER DIRECT STRUCTURING AND LASER DIRECT STRUCTURI...

Photopatterning

THERMOPLASTIC RESIN COMPOSITION, RESIN MOLDED ARTICLE, AND METHOD O...

ELECTRONIC DEVICE HOUSING AND METHOD FOR MANUFACTURING THE SAME

Method for Improving Plating on Non-Conductive Substrates

CIRCUIT BOARD AND FABRICATION METHOD THEREOF

EMBEDDED WIRING BOARD AND A MANUFACTURING METHOD THEREOF

METHOD FOR SELECTIVELY METALLIZING A SUBSTRATE AND INTERCONNECT DEV...

EMBEDDED STRUCTURE OF CIRCUIT BOARD

Molded Interconnect Device (MID) with Thermal Conductive Property a...

Manufacturing Method for Forming Circuit Structure on Non-Conductiv...

METHOD OF FABRICATING CIRCUIT BOARD STRUCTURE

COMPOSITIONS AND METHODS FOR CREATING ELECTRONIC CIRCUITRY

METHOD FOR ELECTRIC CIRCUIT DEPOSITION

MULTILAYER THREE-DIMENSIONAL CIRCUIT STRUCTURE

Method for Improving Plating on Non-Conductive Substrates

COMPOSITION WITH CATALYST PARTICLES