Plating

Industry

CPC
H05K2203/0703

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0703Plating

Industries

Patents Grantslast 30 patents

Information Patent Grant
Resin substrate and electronic device
- Patent number 11,291,110
- Issue date Mar 29, 2022
- Murata Manufacturing Co., Ltd.
- Yusuke Kamitsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit forming method using selective etching of electrically cond...
- Patent number 11,160,171
- Issue date Oct 26, 2021
- InkTee Co., Ltd.
- Kwang-Choon Chung
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Plating methods for modular and/or ganged waveguides for automatic...
- Patent number 10,944,148
- Issue date Mar 9, 2021
- Advantest Corporation
- Don Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Creating in-via routing with a light pipe
- Patent number 10,834,830
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Mark J. Jeanson
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Composite circuit board
- Patent number 10,638,606
- Issue date Apr 28, 2020
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Xian-Qin Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sleeved coaxial printed circuit board vias
- Patent number 10,375,838
- Issue date Aug 6, 2019
- Massachusetts Institute of Technology
- Glenn A. Brigham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for printed circuit board, printed circuit board, and met...
- Patent number 10,292,265
- Issue date May 14, 2019
- Sumitomo Electric Industries, Ltd.
- Takashi Kasuga
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Composite circuit board and method of manufacturing the same
- Patent number 10,159,149
- Issue date Dec 18, 2018
- HongQiSheng Precision Electronics (QinHuangDao) Co
- Xian-Qin Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of removing soluble material layer by dissolving, method of...
- Patent number 9,686,868
- Issue date Jun 20, 2017
- Alps Electric Co., Ltd.
- Hiroyuki Kanno
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic module
- Patent number 9,655,265
- Issue date May 16, 2017
- Infineon Technologies AG
- Tiam Meng Pon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for ejecting molten metals
- Patent number 9,593,403
- Issue date Mar 14, 2017
- Oce-Technologies B.V.
- Hendrikus J. H. Rheiter
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Component-embedded substrate manufacturing method
- Patent number 9,526,182
- Issue date Dec 20, 2016
- MEIKO ELECTRONICS CO., LTD.
- Ryoichi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extended landing pad substrate package structure and method
- Patent number 9,462,704
- Issue date Oct 4, 2016
- Amkor Technology, Inc.
- David Jon Hiner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip pad geometry for an IC package substrate
- Patent number 9,373,576
- Issue date Jun 21, 2016
- Broadcom Corporation
- Kwok Cheung Tsang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method of miniaturizing the size of a printed circuit...
- Patent number 9,198,278
- Issue date Nov 24, 2015
- Motorola Solutions, Inc.
- Khai Loke Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING CIRCUIT BOARD AND PRODUCING METHOD THEREOF
- Publication number 20220386459
- Publication date Dec 1, 2022
- Nitto Denko Corporation
- Rihito FUKUSHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20210014962
- Publication date Jan 14, 2021
- Murata Manufacturing Co., Ltd.
- Yusuke KAMITSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT FORMING METHOD USING SELECTIVE ETCHING OF ELECTRICALLY COND...
- Publication number 20200389979
- Publication date Dec 10, 2020
- INKTEC CO., LTD.
- Kwang-Choon CHUNG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CREATING IN-VIA ROUTING WITH A LIGHT PIPE
- Publication number 20200260594
- Publication date Aug 13, 2020
- International Business Machines Corporation
- MARK J. JEANSON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20190198433
- Publication date Jun 27, 2019
- Shinko Electric Industries Co., Ltd.
- Natsuko KITAJO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE CIRCUIT BOARD
- Publication number 20190069406
- Publication date Feb 28, 2019
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- XIAN-QIN HU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180192516
- Publication date Jul 5, 2018
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- XIAN-QIN HU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...
- Publication number 20170290150
- Publication date Oct 5, 2017
- Sumitomo Electric Industries, Ltd.
- Takashi KASUGA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Sleeved Coaxial Printed Circuit Board Vias
- Publication number 20170208695
- Publication date Jul 20, 2017
- Massachusetts Institute of Technology
- Glenn A. Brigham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING ORGANIC COATING ON NICKEL SURFACE
- Publication number 20170181292
- Publication date Jun 22, 2017
- Rohm and Haas Electronic Materials L.L.C.
- Qin Tang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF REMOVING SOLUBLE MATERIAL LAYER BY DISSOLVING, METHOD OF...
- Publication number 20160338208
- Publication date Nov 17, 2016
- Alps Electric Co., Ltd.
- Hiroyuki Kanno
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electronic module and method of manufacturing the same
- Publication number 20150342073
- Publication date Nov 26, 2015
- INFINEON TECHNOLOGIES AG
- Tiam Meng PON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR EJECTING MOLTEN METALS
- Publication number 20150299839
- Publication date Oct 22, 2015
- OCE-TECHNOLOGIES B.V.
- Hendrikus J.H. RHEITER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS AND METHOD OF MINIATURIZING THE SIZE OF A PRINTED CIRCUIT...
- Publication number 20150245467
- Publication date Aug 27, 2015
- MOTOROLA SOLUTIONS, INC.
- KHAI LOKE LIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP PAD GEOMETRY FOR AN IC PACKAGE SUBSTRATE
- Publication number 20150194378
- Publication date Jul 9, 2015
- BROADCOM CORPORATION
- Kwok Cheung TSANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20150163908
- Publication date Jun 11, 2015
- Subtron Technology Co., Ltd.
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20150136459
- Publication date May 21, 2015
- IBIDEN CO., LTD.
- Masatoshi KUNIEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150129293
- Publication date May 14, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Suk Hyeon CHO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT-EMBEDDED SUBSTRATE MANUFACTURING METHOD AND COMPONENT-EMB...
- Publication number 20140347835
- Publication date Nov 27, 2014
- Meiko Electronics Co., Ltd.
- Ryoichi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Resin substrate and electronic device

Circuit forming method using selective etching of electrically cond...

Plating methods for modular and/or ganged waveguides for automatic...

Creating in-via routing with a light pipe

Composite circuit board

Sleeved coaxial printed circuit board vias

Substrate for printed circuit board, printed circuit board, and met...

Composite circuit board and method of manufacturing the same

Method of removing soluble material layer by dissolving, method of...

Electronic module

Method for ejecting molten metals

Component-embedded substrate manufacturing method

Extended landing pad substrate package structure and method

Flip chip pad geometry for an IC package substrate

Apparatus and method of miniaturizing the size of a printed circuit...

Patents Applicationslast 30 patents

WIRING CIRCUIT BOARD AND PRODUCING METHOD THEREOF

RESIN SUBSTRATE AND ELECTRONIC DEVICE

CIRCUIT FORMING METHOD USING SELECTIVE ETCHING OF ELECTRICALLY COND...

CREATING IN-VIA ROUTING WITH A LIGHT PIPE

WIRING SUBSTRATE

COMPOSITE CIRCUIT BOARD

COMPOSITE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...

Sleeved Coaxial Printed Circuit Board Vias

METHOD FOR FORMING ORGANIC COATING ON NICKEL SURFACE

METHOD OF REMOVING SOLUBLE MATERIAL LAYER BY DISSOLVING, METHOD OF...

Electronic module and method of manufacturing the same

METHOD FOR EJECTING MOLTEN METALS

APPARATUS AND METHOD OF MINIATURIZING THE SIZE OF A PRINTED CIRCUIT...

FLIP CHIP PAD GEOMETRY FOR AN IC PACKAGE SUBSTRATE

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

COMPONENT-EMBEDDED SUBSTRATE MANUFACTURING METHOD AND COMPONENT-EMB...