TREA

Platinum [Pt] as principal constituent

Follow

Industry

  • CPC
  • H01L2224/13469
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13469Platinum [Pt] as principal constituent
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Sintering materials and attachment methods using same
    • Patent number 11,389,865
    • Issue date Jul 19, 2022
    • Alpha Assembly Solutions Inc.
    • Shamik Ghoshal
    • B22 - CASTING POWDER METALLURGY
  • Information Patent Grant

    Magnetic contacts
    • Patent number 9,601,468
    • Issue date Mar 21, 2017
    • Intel Corporation
    • Michael P. Skinner
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Magnetic contacts
    • Patent number 9,343,389
    • Issue date May 17, 2016
    • Intel Corporation
    • Michael P. Skinner
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents