Platinum [Pt] as principal constituent

Industry

CPC
H01L2224/29369

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29369Platinum [Pt] as principal constituent

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Solder material and method for die attachment
- Patent number 11,842,974
- Issue date Dec 12, 2023
- Alpha Assembly Solutions Inc.
- Angelo Gulino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for attachment and devices produced using the methods
- Patent number 11,699,632
- Issue date Jul 11, 2023
- Alpha Assembly Solutions Inc.
- Monnir Boureghda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternative compositions for high temperature soldering applications
- Patent number 11,440,142
- Issue date Sep 13, 2022
- Ormet Circuits, Inc.
- Catherine A Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Member connection method and adhesive tape
- Patent number 11,342,303
- Issue date May 24, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Tetsuyuki Shirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for attachment and devices produced using the methods
- Patent number 10,905,041
- Issue date Jan 26, 2021
- Alpha Assembly Solutions Inc.
- Monnir Boureghda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering pastes with high metal loading for semiconductor die atta...
- Patent number 10,727,193
- Issue date Jul 28, 2020
- Ormet Circuits, Inc.
- Catherine Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor device and method for manufacturing power semic...
- Patent number 10,727,167
- Issue date Jul 28, 2020
- Mitsubishi Electric Corporation
- Takayuki Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curing a heat-curable material in an embedded curing zone
- Patent number 10,717,236
- Issue date Jul 21, 2020
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Jeroen van den Brand
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Conductive paste for bonding
- Patent number 10,696,875
- Issue date Jun 30, 2020
- E. I. Du Pont de Nemours and Company
- Yumi Matsuura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a connecting medium on an assembly partner, me...
- Patent number 10,615,138
- Issue date Apr 7, 2020
- Infineon Technologies AG
- Nicolas Heuck
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packages and methods of fabrication thereof
- Patent number 10,325,834
- Issue date Jun 18, 2019
- Infineon Technologies Dresden GmbH
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connecting member and manufacturing method of same
- Patent number 10,177,079
- Issue date Jan 8, 2019
- Furukawa Electric Co., Ltd.
- Hideo Nishikubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metallic particle paste, cured product using same, and semiconducto...
- Patent number 10,086,478
- Issue date Oct 2, 2018
- Kabushiki Kaisha Toshiba
- Daisuke Hiratsuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Paste for joining components of electronic modules, system and meth...
- Patent number 9,815,146
- Issue date Nov 14, 2017
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Hermann Oppermann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packages and methods of fabrication thereof
- Patent number 9,773,719
- Issue date Sep 26, 2017
- Infineon Technologies Dresden GmbH
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method for manufacturing the same
- Patent number 9,698,078
- Issue date Jul 4, 2017
- Mitsubishi Electric Corporation
- Yasunari Hino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Miniaturized SMD diode package and process for producing the same
- Patent number 9,691,736
- Issue date Jun 27, 2017
- SFI ELECTRONICS TECHNOLOGY INC.
- Ching-Hohn Lien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Miniaturized SMD diode package and process for producing the same
- Patent number 9,691,735
- Issue date Jun 27, 2017
- SFI Electronics Technology Inc.
- Ching-Hohn Lien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a material-bonding connection between a semico...
- Patent number 9,659,793
- Issue date May 23, 2017
- Infineon Technologies AG
- Nicolas Heuck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,583,413
- Issue date Feb 28, 2017
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging containing sintering die-attach material
- Patent number 9,583,453
- Issue date Feb 28, 2017
- Ormet Circuits, Inc.
- Catherine Shearer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joint material, and jointed body
- Patent number 9,543,265
- Issue date Jan 10, 2017
- Hitachi, Ltd.
- Motomune Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive die attach film for large die semiconductor packages and...
- Patent number 9,449,938
- Issue date Sep 20, 2016
- Henkel IP & Holding GmbH
- Pukun Zhu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit component and method of making the same
- Patent number 9,019,714
- Issue date Apr 28, 2015
- Hitachi Chemical Company, Ltd.
- Kazuya Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal paste with oxidizing agents
- Patent number 8,950,652
- Issue date Feb 10, 2015
- Heraeus Materials Technology GmbH & Co. KG
- Michael Schäfer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contacting means and method for contacting electrical components
- Patent number 8,925,789
- Issue date Jan 6, 2015
- Heraeus Materials Technology GmbH & Co. KG
- Michael Schäfer
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Electrically conductive bonding material, method of bonding with th...
- Patent number 8,840,811
- Issue date Sep 23, 2014
- Hitachi Chemical Company, Ltd.
- Yuusuke Yasuda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Low temperature bonding material comprising coated metal nanopartic...
- Patent number 8,821,676
- Issue date Sep 2, 2014
- Hitachi, Ltd.
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and method for display device
- Patent number 8,796,051
- Issue date Aug 5, 2014
- Samsung Display Co., Ltd.
- Deok-Jun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer backside coating process with pulsed UV light source
- Patent number 8,791,033
- Issue date Jul 29, 2014
- Henkel IP & Holding GmbH
- Jeffrey Gasa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE
- Publication number 20220246510
- Publication date Aug 4, 2022
- HYPERTAC S.P.A.
- Alessandro Bosca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR ATTACHMENT AND DEVICES PRODUCED USING THE METHODS
- Publication number 20210289680
- Publication date Sep 16, 2021
- Alpha Assembly Solutions Inc.
- Monnir Boureghda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMBER CONNECTION METHOD AND ADHESIVE TAPE
- Publication number 20210074674
- Publication date Mar 11, 2021
- Hitachi Chemical Company, Ltd.
- Tetsuyuki SHIRAKAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE
- Publication number 20200248040
- Publication date Aug 6, 2020
- DUPONT ELECTRONICS, INC.
- Yumi Matsuura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER MATERIAL AND METHOD FOR DIE ATTACHMENT
- Publication number 20200203304
- Publication date Jun 25, 2020
- Alpha Assembly Solutions Inc.
- Angelo GULINO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Packages and Methods of Fabrication Thereof
- Publication number 20170365539
- Publication date Dec 21, 2017
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE DIE ATTACH FILM FOR LARGE DIE SEMICONDUCTOR PACKAGES AND...
- Publication number 20160148894
- Publication date May 26, 2016
- Henkel IP & Holding GmbH
- Pukun Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR BONDING
- Publication number 20140312285
- Publication date Oct 23, 2014
- BANDO CHEMICAL INDUSTRIES, LTD.
- Masafumi Takesue
- B82 - NANO-TECHNOLOGY
Information Patent Application
Joint Material, and Jointed Body
- Publication number 20140287227
- Publication date Sep 25, 2014
- Hitachi, Ltd
- Motomune KODAMA
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
Semiconductor Modules and Methods of Formation Thereof
- Publication number 20140232015
- Publication date Aug 21, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC CONTACTS FOR ELECTRONICS APPLICATIONS
- Publication number 20140205851
- Publication date Jul 24, 2014
- Ravindranath V. MAHAJAN
- B32 - LAYERED PRODUCTS
Information Patent Application
METHODS FOR ATTACHMENT AND DEVICES PRODUCED USING THE METHODS
- Publication number 20140153203
- Publication date Jun 5, 2014
- ALPHA METALS, INC.
- Monnir Boureghda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semicondutor Packages and Methods of Fabrication Thereof
- Publication number 20140145319
- Publication date May 29, 2014
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING CONTAINING SINTERING DIE-ATTACH MATERIAL
- Publication number 20140131898
- Publication date May 15, 2014
- Catherine Shearer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FILM ADHESIVE
- Publication number 20140120356
- Publication date May 1, 2014
- ORMET CIRCUITS, INC.
- Catherine Shearer
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
BONDING APPARATUS AND METHOD FOR DISPLAY DEVICE
- Publication number 20140106484
- Publication date Apr 17, 2014
- SAMSUNG DISPLAY CO., LTD.
- Deok-Jun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASTE FOR JOINING COMPONENTS OF ELECTRONIC MODULES, SYSTEM AND METH...
- Publication number 20140079472
- Publication date Mar 20, 2014
- Fraunhofer Gesellschaft zur Foederung der Angewandten Forschung e.V.
- Hermann Oppermann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE...
- Publication number 20130292168
- Publication date Nov 7, 2013
- ROBERT BOSCH GmbH
- Daniel Wolde-Giorgis
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE...
- Publication number 20130216847
- Publication date Aug 22, 2013
- ROBERT BOSCH GmbH
- Daniel Wolde-Giorgis
- B32 - LAYERED PRODUCTS
Information Patent Application
CIRCUIT COMPONENT AND METHOD OF MAKING THE SAME
- Publication number 20130120948
- Publication date May 16, 2013
- HITACHI CHEMICAL CO., Ltd.
- Kazuya Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE SINTERED LAYER FORMING COMPOSITION
- Publication number 20130119322
- Publication date May 16, 2013
- Hitachi Ltd.
- Eiichi Ide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BACKSIDE COATING PROCESS WITH PULSED UV LIGHT SOURCE
- Publication number 20130099396
- Publication date Apr 25, 2013
- Henkel Corporation
- Jeffrey Gasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME
- Publication number 20130001775
- Publication date Jan 3, 2013
- Hideo Nishikubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120211764
- Publication date Aug 23, 2012
- Fujitsu Limited,
- Keishiro OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PASTE WITH OXIDIZING AGENTS
- Publication number 20120153011
- Publication date Jun 21, 2012
- HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
- Michael Schäfer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD
- Publication number 20120104618
- Publication date May 3, 2012
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANISOTROPIC ELECTRICALLY AND THERMALLY CONDUCTIVE ADHESIVE WITH MAG...
- Publication number 20120106111
- Publication date May 3, 2012
- JOSEPH MAZZOCHETTE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANISOTROPIC CONDUCTIVE PARTICLES
- Publication number 20120097902
- Publication date Apr 26, 2012
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor apparatus and the method of manufacturing the same
- Publication number 20120074563
- Publication date Mar 29, 2012
- Fuji Electric Co., Ltd.
- Yuji Iizuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANTI-TAMPER MICROCHIP PACKAGE BASED ON THERMAL NANOFLUIDS OR FLUIDS
- Publication number 20120068326
- Publication date Mar 22, 2012
- Endicott Interconnect Technologies, Inc.
- Rabindra N. Das
- H01 - BASIC ELECTRIC ELEMENTS

Platinum [Pt] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solder material and method for die attachment

Methods for attachment and devices produced using the methods

Alternative compositions for high temperature soldering applications

Member connection method and adhesive tape

Methods for attachment and devices produced using the methods

Sintering pastes with high metal loading for semiconductor die atta...

Power semiconductor device and method for manufacturing power semic...

Curing a heat-curable material in an embedded curing zone

Conductive paste for bonding

Method for producing a connecting medium on an assembly partner, me...

Semiconductor packages and methods of fabrication thereof

Conductive connecting member and manufacturing method of same

Metallic particle paste, cured product using same, and semiconducto...

Paste for joining components of electronic modules, system and meth...

Semiconductor packages and methods of fabrication thereof

Semiconductor module and method for manufacturing the same

Miniaturized SMD diode package and process for producing the same

Miniaturized SMD diode package and process for producing the same

Method for producing a material-bonding connection between a semico...

Semiconductor device

Semiconductor packaging containing sintering die-attach material

Joint material, and jointed body

Conductive die attach film for large die semiconductor packages and...

Circuit component and method of making the same

Metal paste with oxidizing agents

Contacting means and method for contacting electrical components

Electrically conductive bonding material, method of bonding with th...

Low temperature bonding material comprising coated metal nanopartic...

Bonding apparatus and method for display device

Wafer backside coating process with pulsed UV light source

Patents Applicationslast 30 patents

OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE

METHODS FOR ATTACHMENT AND DEVICES PRODUCED USING THE METHODS

MEMBER CONNECTION METHOD AND ADHESIVE TAPE

METHOD OF MANUFACTURING AN ELECTRONIC DEVICE

SOLDER MATERIAL AND METHOD FOR DIE ATTACHMENT

Semiconductor Packages and Methods of Fabrication Thereof

CONDUCTIVE DIE ATTACH FILM FOR LARGE DIE SEMICONDUCTOR PACKAGES AND...

COMPOSITION FOR BONDING

Joint Material, and Jointed Body

Semiconductor Modules and Methods of Formation Thereof

MAGNETIC CONTACTS FOR ELECTRONICS APPLICATIONS

METHODS FOR ATTACHMENT AND DEVICES PRODUCED USING THE METHODS

Semicondutor Packages and Methods of Fabrication Thereof

SEMICONDUCTOR PACKAGING CONTAINING SINTERING DIE-ATTACH MATERIAL

CONDUCTIVE FILM ADHESIVE

BONDING APPARATUS AND METHOD FOR DISPLAY DEVICE

PASTE FOR JOINING COMPONENTS OF ELECTRONIC MODULES, SYSTEM AND METH...

STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE...

STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE...

CIRCUIT COMPONENT AND METHOD OF MAKING THE SAME

CONDUCTIVE SINTERED LAYER FORMING COMPOSITION

WAFER BACKSIDE COATING PROCESS WITH PULSED UV LIGHT SOURCE

CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METAL PASTE WITH OXIDIZING AGENTS

LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD

ANISOTROPIC ELECTRICALLY AND THERMALLY CONDUCTIVE ADHESIVE WITH MAG...

ANISOTROPIC CONDUCTIVE PARTICLES

Semiconductor apparatus and the method of manufacturing the same

ANTI-TAMPER MICROCHIP PACKAGE BASED ON THERMAL NANOFLUIDS OR FLUIDS