Platinum [Pt] as principal constituent

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H01L2224/29469

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/29469Platinum [Pt] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Alternative compositions for high temperature soldering applications
- Patent number 11,440,142
- Issue date Sep 13, 2022
- Ormet Circuits, Inc.
- Catherine A Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Electroconductive microparticles, anisotropic electroconductive mat...
- Patent number 9,478,326
- Issue date Oct 25, 2016
- Sekisui Chemical Co., Ltd.
- Hiroya Ishida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit component and method of making the same
- Patent number 9,019,714
- Issue date Apr 28, 2015
- Hitachi Chemical Company, Ltd.
- Kazuya Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contacting means and method for contacting electrical components
- Patent number 8,925,789
- Issue date Jan 6, 2015
- Heraeus Materials Technology GmbH & Co. KG
- Michael Schäfer
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Adhesive for circuit connection, circuit connection method using th...
- Patent number 8,029,911
- Issue date Oct 4, 2011
- Hitachi Chemical Company, Ltd.
- Satoyuki Nomura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive for circuit connection, circuit connection method using th...
- Patent number 7,208,105
- Issue date Apr 24, 2007
- Hitachi Chemical Co., Ltd.
- Satoyuki Nomura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of production of semiconductor device
- Patent number 6,223,429
- Issue date May 1, 2001
- Hitachi Chemical Company, Ltd.
- Aizou Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing connection electrodes
- Patent number 5,034,245
- Issue date Jul 23, 1991
- Sharp Kabushiki Kaisha
- Hiroshi Matsubara
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE
- Publication number 20220246510
- Publication date Aug 4, 2022
- HYPERTAC S.P.A.
- Alessandro Bosca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIXED-ARRAY ANISOTROPIC CONDUCTIVE FILM USING CONDUCTIVE PARTICLES...
- Publication number 20170004901
- Publication date Jan 5, 2017
- TRILLION SCIENCE, INC.
- Rong-Chang Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STARTING MATERIAL AND PROCESS FOR PRODUCING A SINTERED JOIN
- Publication number 20130251447
- Publication date Sep 26, 2013
- ROBERT BOSCH GmbH
- Thomas Kalich
- B32 - LAYERED PRODUCTS
Information Patent Application
STARTING MATERIAL AND PROCESS FOR PRODUCING A SINTERED JOIN
- Publication number 20130216848
- Publication date Aug 22, 2013
- ROBERT BOSCH GmbH
- Thomas Kalich
- B32 - LAYERED PRODUCTS
Information Patent Application
CIRCUIT COMPONENT AND METHOD OF MAKING THE SAME
- Publication number 20130120948
- Publication date May 16, 2013
- HITACHI CHEMICAL CO., Ltd.
- Kazuya Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contacting Means and Method for Contacting Electrical Components
- Publication number 20120055978
- Publication date Mar 8, 2012
- HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
- Michael SCHÄFER
- B22 - CASTING POWDER METALLURGY
Information Patent Application
ADHESIVE FOR CIRCUIT CONNECTION, CIRCUIT CONNECTION METHOD USING TH...
- Publication number 20100294551
- Publication date Nov 25, 2010
- Satoyuki Nomura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CONDUCTIVE PARTICLE, ADHESIVE COMPOSITION, CIRCUIT-CONNECTING MATER...
- Publication number 20100065311
- Publication date Mar 18, 2010
- Hitachi Chemical Company, Ltd.
- Masaru Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adhesive for circuit connection, circuit connection method using th...
- Publication number 20070166549
- Publication date Jul 19, 2007
- Satoyuki Nomura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Method and materials for printing particle-enhanced electrical cont...
- Publication number 20040087128
- Publication date May 6, 2004
- Herbert J Neuhaus
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adhesive for circuit connection , circuit connection method using t...
- Publication number 20030141014
- Publication date Jul 31, 2003
- Nomura Satoyuki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Conductive fillers and conductive polymers made therefrom
- Publication number 20030113531
- Publication date Jun 19, 2003
- Karel Hajmrle
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Platinum [Pt] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Alternative compositions for high temperature soldering applications

Sintering materials and attachment methods using same

Electroconductive microparticles, anisotropic electroconductive mat...

Circuit component and method of making the same

Contacting means and method for contacting electrical components

Adhesive for circuit connection, circuit connection method using th...

Adhesive for circuit connection, circuit connection method using th...

Method of production of semiconductor device

Method of producing connection electrodes

Patents Applicationslast 30 patents

OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE

FIXED-ARRAY ANISOTROPIC CONDUCTIVE FILM USING CONDUCTIVE PARTICLES...

STARTING MATERIAL AND PROCESS FOR PRODUCING A SINTERED JOIN

STARTING MATERIAL AND PROCESS FOR PRODUCING A SINTERED JOIN

CIRCUIT COMPONENT AND METHOD OF MAKING THE SAME

Contacting Means and Method for Contacting Electrical Components

ADHESIVE FOR CIRCUIT CONNECTION, CIRCUIT CONNECTION METHOD USING TH...

CONDUCTIVE PARTICLE, ADHESIVE COMPOSITION, CIRCUIT-CONNECTING MATER...

Adhesive for circuit connection, circuit connection method using th...

Method and materials for printing particle-enhanced electrical cont...

Adhesive for circuit connection , circuit connection method using t...

Conductive fillers and conductive polymers made therefrom