Platinum (Pt) as principal constituent

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H01L2224/48669

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48669Platinum (Pt) as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor component support and semiconductor device
- Patent number 10,068,821
- Issue date Sep 4, 2018
- Nichia Corporation
- Takeaki Shirase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for high-speed signal line
- Patent number 9,972,595
- Issue date May 15, 2018
- Tanaka Denshi Kogyo K.K.
- Yuki Antoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED leadframe or LED substrate, semiconductor device, and method fo...
- Patent number 9,966,517
- Issue date May 8, 2018
- Dai Nippon Printing Co., Ltd.
- Kazunori Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED leadframe or LED substrate, semiconductor device, and method fo...
- Patent number 9,887,331
- Issue date Feb 6, 2018
- Dai Nippon Printing Co., Ltd.
- Kazunori Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip using top post-passivation technology and b...
- Patent number 9,612,615
- Issue date Apr 4, 2017
- QUALCOMM Incorporated
- Mou-Shiung Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,449,937
- Issue date Sep 20, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Koji Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 9,437,478
- Issue date Sep 6, 2016
- Xintec Inc.
- Yen-Shih Ho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip package
- Patent number 9,425,134
- Issue date Aug 23, 2016
- Xintec Inc.
- Yen-Shih Ho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Sensor package
- Patent number 9,379,033
- Issue date Jun 28, 2016
- Infineon Technologies AG
- Ralf Wombacher
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip package and method for forming the same
- Patent number 9,355,975
- Issue date May 31, 2016
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized alloying for improved bond reliability
- Patent number 9,331,050
- Issue date May 3, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including a semiconductor chip and wires
- Patent number 9,305,876
- Issue date Apr 5, 2016
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED leadframe or LED substrate, semiconductor device, and method fo...
- Patent number 9,263,315
- Issue date Feb 16, 2016
- Dai Nippon Printing Co., Ltd.
- Kazunori Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Submount, encapsulated semiconductor element, and methods of manufa...
- Patent number 9,263,411
- Issue date Feb 16, 2016
- Advanced Photonics, Inc.
- Xueliang Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a contact clip having protrusions an...
- Patent number 8,987,879
- Issue date Mar 24, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing electronic device having contact elements with a spec...
- Patent number 8,871,630
- Issue date Oct 28, 2014
- Infineon Technologies AG
- Ralf Otremba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the semiconductor...
- Patent number 8,759,987
- Issue date Jun 24, 2014
- Nichia Corporation
- Ryota Seno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package
- Patent number 8,674,462
- Issue date Mar 18, 2014
- Infineon Technologies AG
- Ralf Wombacher
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Power semiconductor chip having two metal layers on one face
- Patent number 8,643,176
- Issue date Feb 4, 2014
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post passivation structure for a semiconductor device and packaging...
- Patent number 8,558,383
- Issue date Oct 15, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a stacked structure
- Patent number 8,487,452
- Issue date Jul 16, 2013
- Samsung Electronics Co., Ltd.
- Jin-Yang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip using top post-passivation technology and b...
- Patent number 8,456,856
- Issue date Jun 4, 2013
- Megica Corporation
- Mou-Shiung Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor chip structure
- Patent number 8,421,227
- Issue date Apr 16, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal pad or metal bump over pad exposed by passivation layer
- Patent number 8,399,989
- Issue date Mar 19, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method for preventing polymer cracking
- Patent number 8,344,524
- Issue date Jan 1, 2013
- Megica Corporation
- Chiu-Ming Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layer structure for electrical contacting of semiconductor components
- Patent number 8,299,549
- Issue date Oct 30, 2012
- Robert Bosch GmbH
- Jochen Reinmuth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having contact elements with a specified cross se...
- Patent number 8,227,908
- Issue date Jul 24, 2012
- Infineon Technologies AG
- Ralf Otremba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip and method for fabricating the same
- Patent number 8,168,527
- Issue date May 1, 2012
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packages
- Patent number 8,159,070
- Issue date Apr 17, 2012
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer and semiconductor package
- Patent number 8,110,931
- Issue date Feb 7, 2012
- Advanced Semiconductor Engineering, Inc.
- Hsiao Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140332983
- Publication date Nov 13, 2014
- Yen-Shih HO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140332969
- Publication date Nov 13, 2014
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20140332968
- Publication date Nov 13, 2014
- Yen-Shih HO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140332908
- Publication date Nov 13, 2014
- Yen-Shih HO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BONDING WIRE FOR HIGH-SPEED SIGNAL LINE
- Publication number 20140302317
- Publication date Oct 9, 2014
- TANAKA DENSHI KOGYO K.K.
- Yuki ANTOKU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPLEMENTING WIRE BONDS
- Publication number 20140264952
- Publication date Sep 18, 2014
- Power Integrations, Inc.
- Jayson M. DENNING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A MULTI-CHANNEL AND A RELATED ELECTRON...
- Publication number 20140252640
- Publication date Sep 11, 2014
- Samsung Electronics Co., Ltd.
- Min-Keun Kwak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device Including a Semiconductor Chip and Wires
- Publication number 20140218885
- Publication date Aug 7, 2014
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE
- Publication number 20140197503
- Publication date Jul 17, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Wombacher
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WIRE BONDS AND LIGHT EMITTER DEVICES AND RELATED METHODS
- Publication number 20140070235
- Publication date Mar 13, 2014
- Peter Scott Andrews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A METAL PAD STRUCTURE OF A DIE, A METHOD F...
- Publication number 20140054800
- Publication date Feb 27, 2014
- INFINEON TECHNOLOGIES AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT SUPPORT AND SEMICONDUCTOR DEVICE
- Publication number 20140021595
- Publication date Jan 23, 2014
- Takeaki SHIRASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP USING TOP POST-PASSIVATION TECHNOLOGY AND B...
- Publication number 20130242500
- Publication date Sep 19, 2013
- MEGICA Corporation
- Mou-Shiung Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING VOLTAGE CONVERTER CIRCUIT, AND METHO...
- Publication number 20130193590
- Publication date Aug 1, 2013
- Elpida Memory, Inc.
- Simone Bartoli
- G11 - INFORMATION STORAGE
Information Patent Application
Power Semiconductor Chip Having Two Metal Layers on One Face
- Publication number 20130027113
- Publication date Jan 31, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Including a Contact Clip Having Protrusions an...
- Publication number 20130009295
- Publication date Jan 10, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD CARRIER WITH THERMALLY FUSED PACKAGE COMPONENTS
- Publication number 20130001761
- Publication date Jan 3, 2013
- Philip E. Rogren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED LEADFRAME OR LED SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD FO...
- Publication number 20120313131
- Publication date Dec 13, 2012
- DAI NIPPON PRINTING CO., LTD.
- Kazunori Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING THEREOF
- Publication number 20120286293
- Publication date Nov 15, 2012
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20120193791
- Publication date Aug 2, 2012
- Ryota Seno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED ALLOYING FOR IMPROVED BOND RELIABILITY
- Publication number 20120153464
- Publication date Jun 21, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip Semiconductor Packages and Assembly Thereof
- Publication number 20120074546
- Publication date Mar 29, 2012
- Chooi Mei Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A STACKED STRUCTURE
- Publication number 20120001347
- Publication date Jan 5, 2012
- Samsung Electronics Co., Ltd.
- Jin-Yang LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYER STRUCTURE FOR ELECTRICAL CONTACTING OF SEMICONDUCTOR COMPONENTS
- Publication number 20110127674
- Publication date Jun 2, 2011
- Jochen Reinmuth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP USING TOP POST-PASSIVATION TECHNOLOGY AND B...
- Publication number 20100246152
- Publication date Sep 30, 2010
- MEGICA Corporation
- Mou-Shiung Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP PACKAGES
- Publication number 20100244263
- Publication date Sep 30, 2010
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE USING THE SAME
- Publication number 20100200974
- Publication date Aug 12, 2010
- Chao-Fu Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER AND SEMICONDUCTOR PACKAGE
- Publication number 20100007004
- Publication date Jan 14, 2010
- Advanced Semiconductor Engineering, Inc.
- Hsiao Chuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING THEREOF
- Publication number 20100001291
- Publication date Jan 7, 2010
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR CHIP AND METHOD FOR FABRICATING THE SAME
- Publication number 20090291554
- Publication date Nov 26, 2009
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS

Platinum (Pt) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor component support and semiconductor device

Bonding wire for high-speed signal line

LED leadframe or LED substrate, semiconductor device, and method fo...

LED leadframe or LED substrate, semiconductor device, and method fo...

Integrated circuit chip using top post-passivation technology and b...

Semiconductor device and method for manufacturing the same

Chip package and method for forming the same

Chip package

Sensor package

Chip package and method for forming the same

Localized alloying for improved bond reliability

Device including a semiconductor chip and wires

LED leadframe or LED substrate, semiconductor device, and method fo...

Submount, encapsulated semiconductor element, and methods of manufa...

Semiconductor device including a contact clip having protrusions an...

Manufacturing electronic device having contact elements with a spec...

Semiconductor device and method of manufacturing the semiconductor...

Sensor package

Power semiconductor chip having two metal layers on one face

Post passivation structure for a semiconductor device and packaging...

Semiconductor package having a stacked structure

Integrated circuit chip using top post-passivation technology and b...

Semiconductor chip structure

Metal pad or metal bump over pad exposed by passivation layer

Wire bonding method for preventing polymer cracking

Layer structure for electrical contacting of semiconductor components

Electronic device having contact elements with a specified cross se...

Semiconductor chip and method for fabricating the same

Chip packages

Wafer and semiconductor package

Patents Applicationslast 30 patents

STACKED CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

BONDING WIRE FOR HIGH-SPEED SIGNAL LINE

SUPPLEMENTING WIRE BONDS

SEMICONDUCTOR PACKAGE HAVING A MULTI-CHANNEL AND A RELATED ELECTRON...

Device Including a Semiconductor Chip and Wires

SENSOR PACKAGE

WIRE BONDS AND LIGHT EMITTER DEVICES AND RELATED METHODS

METHOD FOR MANUFACTURING A METAL PAD STRUCTURE OF A DIE, A METHOD F...

SEMICONDUCTOR COMPONENT SUPPORT AND SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT CHIP USING TOP POST-PASSIVATION TECHNOLOGY AND B...

SEMICONDUCTOR DEVICE INCLUDING VOLTAGE CONVERTER CIRCUIT, AND METHO...

Power Semiconductor Chip Having Two Metal Layers on One Face

Semiconductor Device Including a Contact Clip Having Protrusions an...

LEAD CARRIER WITH THERMALLY FUSED PACKAGE COMPONENTS

LED LEADFRAME OR LED SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD FO...

ELECTRONIC DEVICE AND MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

LOCALIZED ALLOYING FOR IMPROVED BOND RELIABILITY

Multi-chip Semiconductor Packages and Assembly Thereof

SEMICONDUCTOR PACKAGE HAVING A STACKED STRUCTURE

LAYER STRUCTURE FOR ELECTRICAL CONTACTING OF SEMICONDUCTOR COMPONENTS

INTEGRATED CIRCUIT CHIP USING TOP POST-PASSIVATION TECHNOLOGY AND B...

CHIP PACKAGES

SEMICONDUCTOR PACKAGE STRUCTURE USING THE SAME

WAFER AND SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE AND MANUFACTURING THEREOF

SEMICONDUCTOR CHIP AND METHOD FOR FABRICATING THE SAME