Platinum (Pt) as principal constituent

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H01L2224/85469

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/85469Platinum (Pt) as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Light emitting device and light emitting module
- Patent number 10,297,716
- Issue date May 21, 2019
- LG Innotek Co., Ltd
- Shuhei Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, semiconductor package, and electronic device...
- Patent number 10,083,136
- Issue date Sep 25, 2018
- Samsung Electronics Co., Ltd.
- Nam-ho Song
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
LED leadframe or LED substrate, semiconductor device, and method fo...
- Patent number 9,966,517
- Issue date May 8, 2018
- Dai Nippon Printing Co., Ltd.
- Kazunori Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED leadframe or LED substrate, semiconductor device, and method fo...
- Patent number 9,887,331
- Issue date Feb 6, 2018
- Dai Nippon Printing Co., Ltd.
- Kazunori Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED leadframe or LED substrate, semiconductor device, and method fo...
- Patent number 9,263,315
- Issue date Feb 16, 2016
- Dai Nippon Printing Co., Ltd.
- Kazunori Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor packages and assembly thereof
- Patent number 8,836,101
- Issue date Sep 16, 2014
- Infineon Technologies AG
- Chooi Mei Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the semiconductor...
- Patent number 8,759,987
- Issue date Jun 24, 2014
- Nichia Corporation
- Ryota Seno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grounding system and apparatus
- Patent number 8,735,955
- Issue date May 27, 2014
- Johnson Controls Technology Company
- Konstantin Borisov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit device having die bonded to the polymer side of...
- Patent number 8,456,021
- Issue date Jun 4, 2013
- Texas Instruments Incorporated
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing an LTCC substrate
- Patent number 8,250,748
- Issue date Aug 28, 2012
- Biotronik CRM Patent AG
- Dieter Schwanke
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods using die attach paddle for mounting integrated circuit die
- Patent number 7,678,618
- Issue date Mar 16, 2010
- Atmel Corporation
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach paddle for mounting integrated circuit die
- Patent number 7,638,862
- Issue date Dec 29, 2009
- Atmel Corporation
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach paddle for mounting integrated circuit die
- Patent number 7,323,765
- Issue date Jan 29, 2008
- Atmel Corporation
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Board for manufacturing a BGA and method of manufacturing semicondu...
- Patent number 7,138,296
- Issue date Nov 21, 2006
- Sanyo Electric Co., LTD
- Noriaki Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Board for manufacturing a BGA and method of manufacturing semicondu...
- Patent number 6,975,022
- Issue date Dec 13, 2005
- Sanyo Electric Co., LTD
- Noriaki Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with double nickel-plated leadframe
- Patent number 6,828,660
- Issue date Dec 7, 2004
- Texas Instruments Incorporated
- Donald C. Abbott
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device sealed with molded resin
- Patent number 5,717,232
- Issue date Feb 10, 1998
- Kabushiki Kaisha Toshiba
- Kazuhiko Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor structure for thick film electrical device
- Patent number 4,546,283
- Issue date Oct 8, 1985
- The United States of America as represented by the Secretary of the Air Force
- Michael D. Adamo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A MULTI-CHANNEL AND A RELATED ELECTRON...
- Publication number 20140252640
- Publication date Sep 11, 2014
- Samsung Electronics Co., Ltd.
- Min-Keun Kwak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD CARRIER WITH THERMALLY FUSED PACKAGE COMPONENTS
- Publication number 20130001761
- Publication date Jan 3, 2013
- Philip E. Rogren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED LEADFRAME OR LED SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD FO...
- Publication number 20120313131
- Publication date Dec 13, 2012
- DAI NIPPON PRINTING CO., LTD.
- Kazunori Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20120193791
- Publication date Aug 2, 2012
- Ryota Seno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE HAVING DIE BONDED TO THE POLYMER SIDE OF...
- Publication number 20120126418
- Publication date May 24, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip Semiconductor Packages and Assembly Thereof
- Publication number 20120074546
- Publication date Mar 29, 2012
- Chooi Mei Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUNDING SYSTEM AND APPARATUS
- Publication number 20110101907
- Publication date May 5, 2011
- Johnson Controls Technology Company
- Konstantin Borisov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LTCC SUBSTRATE STRUCTURE AND METHOD FOR THE PRODUCTION THEREOF
- Publication number 20100059255
- Publication date Mar 11, 2010
- Dieter SCHWANKE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE ATTACH PADDLE FOR MOUNTING INTEGRATED CIRCUIT DIE
- Publication number 20080064145
- Publication date Mar 13, 2008
- ATMEL CORPORATION
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH PADDLE FOR MOUNTING INTEGRATED CIRCUIT DIE
- Publication number 20080061416
- Publication date Mar 13, 2008
- ATMEL CORPORATION
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die attach paddle for mounting integrated circuit die
- Publication number 20060076657
- Publication date Apr 13, 2006
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Board for manufacturing a BGA and method of manufacturing semicondu...
- Publication number 20040214374
- Publication date Oct 28, 2004
- SANYO ELECTRIC CO., LTD.
- Noriaki Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with double nickel-plated leadframe
- Publication number 20040140539
- Publication date Jul 22, 2004
- Donald C. Abbott
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Board for manufacturing a BGA and method of manufacturing semicondu...
- Publication number 20010045625
- Publication date Nov 29, 2001
- Noriaki Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS

Platinum (Pt) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Light emitting device and light emitting module

Electronic component, semiconductor package, and electronic device...

LED leadframe or LED substrate, semiconductor device, and method fo...

LED leadframe or LED substrate, semiconductor device, and method fo...

LED leadframe or LED substrate, semiconductor device, and method fo...

Multi-chip semiconductor packages and assembly thereof

Semiconductor device and method of manufacturing the semiconductor...

Grounding system and apparatus

Integrated circuit device having die bonded to the polymer side of...

Method for producing an LTCC substrate

Methods using die attach paddle for mounting integrated circuit die

Die attach paddle for mounting integrated circuit die

Die attach paddle for mounting integrated circuit die

Board for manufacturing a BGA and method of manufacturing semicondu...

Board for manufacturing a BGA and method of manufacturing semicondu...

Semiconductor device with double nickel-plated leadframe

Semiconductor device sealed with molded resin

Conductor structure for thick film electrical device

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE HAVING A MULTI-CHANNEL AND A RELATED ELECTRON...

LEAD CARRIER WITH THERMALLY FUSED PACKAGE COMPONENTS

LED LEADFRAME OR LED SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD FO...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

INTEGRATED CIRCUIT DEVICE HAVING DIE BONDED TO THE POLYMER SIDE OF...

Multi-chip Semiconductor Packages and Assembly Thereof

GROUNDING SYSTEM AND APPARATUS

LTCC SUBSTRATE STRUCTURE AND METHOD FOR THE PRODUCTION THEREOF

DIE ATTACH PADDLE FOR MOUNTING INTEGRATED CIRCUIT DIE

DIE ATTACH PADDLE FOR MOUNTING INTEGRATED CIRCUIT DIE

Die attach paddle for mounting integrated circuit die

Board for manufacturing a BGA and method of manufacturing semicondu...

Semiconductor device with double nickel-plated leadframe

Board for manufacturing a BGA and method of manufacturing semicondu...