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Platinum [Pt] as principal constituent
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CPC
H01L2224/83669
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/83669
Platinum [Pt] as principal constituent
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last 30 patents
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Patent Grant
Electronic device
Patent number
8,217,403
Issue date
Jul 10, 2012
Napra Co., Ltd
Shigenobu Sekine
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR