Platinum (Pt) as principal constituent

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H01L2224/48869

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48869Platinum (Pt) as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Sensor package
- Patent number 9,379,033
- Issue date Jun 28, 2016
- Infineon Technologies AG
- Ralf Wombacher
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device including a semiconductor chip and wires
- Patent number 9,305,876
- Issue date Apr 5, 2016
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Submount, encapsulated semiconductor element, and methods of manufa...
- Patent number 9,263,411
- Issue date Feb 16, 2016
- Advanced Photonics, Inc.
- Xueliang Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,147,645
- Issue date Sep 29, 2015
- Sumitomo Bakelite Co., Ltd.
- Shingo Itoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the semiconductor...
- Patent number 8,759,987
- Issue date Jun 24, 2014
- Nichia Corporation
- Ryota Seno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package
- Patent number 8,674,462
- Issue date Mar 18, 2014
- Infineon Technologies AG
- Ralf Wombacher
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Power semiconductor chip having two metal layers on one face
- Patent number 8,643,176
- Issue date Feb 4, 2014
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods using die attach paddle for mounting integrated circuit die
- Patent number 7,678,618
- Issue date Mar 16, 2010
- Atmel Corporation
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach paddle for mounting integrated circuit die
- Patent number 7,638,862
- Issue date Dec 29, 2009
- Atmel Corporation
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnection with conductive polymer layer and method of...
- Patent number 7,538,434
- Issue date May 26, 2009
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsueh Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure with redistribution traces
- Patent number 7,425,767
- Issue date Sep 16, 2008
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach paddle for mounting integrated circuit die
- Patent number 7,323,765
- Issue date Jan 29, 2008
- Atmel Corporation
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a multilayer wiring structure and pad e...
- Patent number 6,890,857
- Issue date May 10, 2005
- Renesas Technology Corp.
- Shigeru Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a multilayer wiring structure and pad e...
- Patent number 6,476,491
- Issue date Nov 5, 2002
- Mitsubishi Denki Kabushiki Kaihsa
- Shigeru Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing a conductive pad for electrical connection and...
- Patent number 6,335,104
- Issue date Jan 1, 2002
- International Business Machines Corporation
- Carlos J. Sambucetti
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wire bonding apparatus
- Patent number 6,112,969
- Issue date Sep 5, 2000
- Mitsubishi Denki Kabushiki Kaisha
- Hiroshi Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method, wire bonding apparatus and semiconductor devic...
- Patent number 6,105,848
- Issue date Aug 22, 2000
- Mitsubishi Denki Kabushki Kaisha
- Hiroshi Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method, wire bonding apparatus and semiconductor devic...
- Patent number 5,838,071
- Issue date Nov 17, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Hiroshi Horibe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...
- Publication number 20140327018
- Publication date Nov 6, 2014
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPLEMENTING WIRE BONDS
- Publication number 20140264952
- Publication date Sep 18, 2014
- Power Integrations, Inc.
- Jayson M. DENNING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device Including a Semiconductor Chip and Wires
- Publication number 20140218885
- Publication date Aug 7, 2014
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE
- Publication number 20140197503
- Publication date Jul 17, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Wombacher
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WIRE BONDS AND LIGHT EMITTER DEVICES AND RELATED METHODS
- Publication number 20140070235
- Publication date Mar 13, 2014
- Peter Scott Andrews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A METAL PAD STRUCTURE OF A DIE, A METHOD F...
- Publication number 20140054800
- Publication date Feb 27, 2014
- INFINEON TECHNOLOGIES AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Chip Having Two Metal Layers on One Face
- Publication number 20130027113
- Publication date Jan 31, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Including a Contact Clip Having Protrusions an...
- Publication number 20130009295
- Publication date Jan 10, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD CARRIER WITH THERMALLY FUSED PACKAGE COMPONENTS
- Publication number 20130001761
- Publication date Jan 3, 2013
- Philip E. Rogren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20120193791
- Publication date Aug 2, 2012
- Ryota Seno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip Semiconductor Packages and Assembly Thereof
- Publication number 20120074546
- Publication date Mar 29, 2012
- Chooi Mei Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE
- Publication number 20090026560
- Publication date Jan 29, 2009
- INFINEON TECHNOLOGIES AG
- Ralf Wombacher
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIE ATTACH PADDLE FOR MOUNTING INTEGRATED CIRCUIT DIE
- Publication number 20080064145
- Publication date Mar 13, 2008
- ATMEL CORPORATION
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH PADDLE FOR MOUNTING INTEGRATED CIRCUIT DIE
- Publication number 20080061416
- Publication date Mar 13, 2008
- ATMEL CORPORATION
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE WITH REDISTRIBUTION TRACES
- Publication number 20080012132
- Publication date Jan 17, 2008
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper interconnection with conductive polymer layer and method of...
- Publication number 20060202346
- Publication date Sep 14, 2006
- Chien-Hsueh Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die attach paddle for mounting integrated circuit die
- Publication number 20060076657
- Publication date Apr 13, 2006
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a multilayer wiring structure and pad e...
- Publication number 20030052339
- Publication date Mar 20, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Shigeru Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same and appara...
- Publication number 20010008311
- Publication date Jul 19, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Shigeru Harada
- H01 - BASIC ELECTRIC ELEMENTS

Platinum (Pt) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Sensor package

Device including a semiconductor chip and wires

Submount, encapsulated semiconductor element, and methods of manufa...

Semiconductor device

Semiconductor device and method of manufacturing the semiconductor...

Sensor package

Power semiconductor chip having two metal layers on one face

Methods using die attach paddle for mounting integrated circuit die

Die attach paddle for mounting integrated circuit die

Copper interconnection with conductive polymer layer and method of...

Chip structure with redistribution traces

Die attach paddle for mounting integrated circuit die

Semiconductor device having a multilayer wiring structure and pad e...

Semiconductor device having a multilayer wiring structure and pad e...

Method for preparing a conductive pad for electrical connection and...

Wire bonding apparatus

Wire bonding method, wire bonding apparatus and semiconductor devic...

Wire bonding method, wire bonding apparatus and semiconductor devic...

Patents Applicationslast 30 patents

POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...

SUPPLEMENTING WIRE BONDS

Device Including a Semiconductor Chip and Wires

SENSOR PACKAGE

WIRE BONDS AND LIGHT EMITTER DEVICES AND RELATED METHODS

METHOD FOR MANUFACTURING A METAL PAD STRUCTURE OF A DIE, A METHOD F...

Power Semiconductor Chip Having Two Metal Layers on One Face

Semiconductor Device Including a Contact Clip Having Protrusions an...

LEAD CARRIER WITH THERMALLY FUSED PACKAGE COMPONENTS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

Multi-chip Semiconductor Packages and Assembly Thereof

SENSOR PACKAGE

DIE ATTACH PADDLE FOR MOUNTING INTEGRATED CIRCUIT DIE

DIE ATTACH PADDLE FOR MOUNTING INTEGRATED CIRCUIT DIE

CHIP STRUCTURE WITH REDISTRIBUTION TRACES

Copper interconnection with conductive polymer layer and method of...

Die attach paddle for mounting integrated circuit die

Semiconductor device having a multilayer wiring structure and pad e...

Semiconductor device and method for fabricating the same and appara...