Platinum [Pt] as principal constituent

Industry

CPC
H01L2224/29669

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29669Platinum [Pt] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for multi-color LED pixel unit with vertical li...
- Patent number 12,074,151
- Issue date Aug 27, 2024
- Jade Bird Display (Shanghai) Limited
- Qunchao Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for multi-color LED pixel unit with vertical li...
- Patent number 12,027,509
- Issue date Jul 2, 2024
- Jade Bird Display (Shanghai) Limited
- Qunchao Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for multi-color LED pixel unit with horizontal...
- Patent number 11,967,589
- Issue date Apr 23, 2024
- Jade Bird Display (Shanghai) Limited
- Qunchao Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump package and methods of formation thereof
- Patent number 9,373,609
- Issue date Jun 21, 2016
- Infineon Technologies AG
- Meng Tong Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder, solder joint structure and method of forming solder joint s...
- Patent number 9,308,603
- Issue date Apr 12, 2016
- Industrial Technology Research Institute
- Kuo-Shu Kao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding pad for thermocompression bonding, process for producing a...
- Patent number 9,281,280
- Issue date Mar 8, 2016
- Robert Bosch GmbH
- Christoph Schelling
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS FOR MULTI-COLOR LED PIXEL UNIT WITH HORIZONTAL...
- Publication number 20240258294
- Publication date Aug 1, 2024
- Jade Bird Display (Shanghai) Limited
- Qunchao XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION LAYER FOR FORMING SEMICONDUCTOR BONDING STRUCTURE, SPUT...
- Publication number 20240145421
- Publication date May 2, 2024
- SOLAR APPLIED MATERIALS TECHNOLOGY CORP.
- Kuan-Neng CHEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEMS AND METHODS FOR MULTI-COLOR LED PIXEL UNIT WITH HORIZONTAL...
- Publication number 20210384182
- Publication date Dec 9, 2021
- Jade Bird Display (Shanghai) Limited
- Qunchao XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR MULTI-COLOR LED PIXEL UNIT WITH VERTICAL LI...
- Publication number 20210384181
- Publication date Dec 9, 2021
- Jade Bird Display (Shanghai) Limited
- Qunchao XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER, SOLDER JOINT STRUCTURE AND METHOD OF FORMING SOLDER JOINT S...
- Publication number 20140134459
- Publication date May 15, 2014
- Industrial Technology Research Institute
- Kuo-Shu Kao
- B32 - LAYERED PRODUCTS
Information Patent Application
Bump Package and Methods of Formation Thereof
- Publication number 20140110835
- Publication date Apr 24, 2014
- INFINEON TECHNOLOGIES AG
- Meng Tong Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD FOR THERMOCOMPRESSION BONDING, PROCESS FOR PRODUCING A...
- Publication number 20140035168
- Publication date Feb 6, 2014
- ROBERT BOSCH GmbH
- Christoph Schelling
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Platinum [Pt] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Systems and methods for multi-color LED pixel unit with vertical li...

Systems and methods for multi-color LED pixel unit with vertical li...

Systems and methods for multi-color LED pixel unit with horizontal...

Bump package and methods of formation thereof

Solder, solder joint structure and method of forming solder joint s...

Bonding pad for thermocompression bonding, process for producing a...

Patents Applicationslast 30 patents

SYSTEMS AND METHODS FOR MULTI-COLOR LED PIXEL UNIT WITH HORIZONTAL...

PASSIVATION LAYER FOR FORMING SEMICONDUCTOR BONDING STRUCTURE, SPUT...

SYSTEMS AND METHODS FOR MULTI-COLOR LED PIXEL UNIT WITH HORIZONTAL...

SYSTEMS AND METHODS FOR MULTI-COLOR LED PIXEL UNIT WITH VERTICAL LI...

SOLDER, SOLDER JOINT STRUCTURE AND METHOD OF FORMING SOLDER JOINT S...

Bump Package and Methods of Formation Thereof

BONDING PAD FOR THERMOCOMPRESSION BONDING, PROCESS FOR PRODUCING A...