Platinum [Pt] as principal constituent

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CPC
H01L2224/05169

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05169Platinum [Pt] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Process flow for fabrication of cap metal over top metal with sinte...
- Patent number 12,159,846
- Issue date Dec 3, 2024
- Texas Instruments Incorporated
- Richard Allen Faust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with encapsulant deposited along sides and sur...
- Patent number 12,094,729
- Issue date Sep 17, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with redundant thru-silicon-vias
- Patent number 12,094,853
- Issue date Sep 17, 2024
- Advanced Micro Devices, Inc.
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method to minimize stress on stack via
- Patent number 12,080,600
- Issue date Sep 3, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Method for producing a connection between component parts, and comp...
- Patent number 11,961,820
- Issue date Apr 16, 2024
- OSRAM OLED GmbH
- Simeon Katz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon photonic interposer with two metal redistribution layers
- Patent number 11,923,327
- Issue date Mar 5, 2024
- Rockley Photonics Limited
- Michael Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor components having conductive vias with aligned back s...
- Patent number 11,869,809
- Issue date Jan 9, 2024
- Micron Technology, Inc.
- Jin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder based hybrid bonding for fine pitch and thin BLT interconnec...
- Patent number 11,810,882
- Issue date Nov 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, semiconductor packages, and methods of manuf...
- Patent number 11,728,297
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode containing a grating and methods of making the...
- Patent number 11,695,100
- Issue date Jul 4, 2023
- Nanosys, Inc.
- Zhen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly employing metal-semiconductor bonding and metal-met...
- Patent number 11,562,975
- Issue date Jan 24, 2023
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor device
- Patent number 11,521,892
- Issue date Dec 6, 2022
- NANYA TECHNOLOGY CORPORATION
- Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 11,476,291
- Issue date Oct 18, 2022
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with redundant thru-silicon-vias
- Patent number 11,469,212
- Issue date Oct 11, 2022
- Advanced Micro Devices, Inc.
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad layer system, gas sensor and method for manufacturing a...
- Patent number 11,407,635
- Issue date Aug 9, 2022
- Robert Bosch GmbH
- Andreas Scheurle
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonding pad structure for memory device and method of manufacturing...
- Patent number 11,342,292
- Issue date May 24, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising getter layers and methods of makin...
- Patent number 11,315,845
- Issue date Apr 26, 2022
- Monolith Semiconductor, Inc.
- Kevin Matocha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,251,143
- Issue date Feb 15, 2022
- Sumitomo Electric Industries, Ltd.
- Masataka Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with encapsulant deposited along sides and sur...
- Patent number 11,222,793
- Issue date Jan 11, 2022
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry etch process landing on metal oxide etch stop layer over metal...
- Patent number 11,195,725
- Issue date Dec 7, 2021
- Texas Instruments Incorporated
- Sebastian Meier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,152,334
- Issue date Oct 19, 2021
- TOSHIBA MEMORY CORPORATION
- Yusuke Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,101,229
- Issue date Aug 24, 2021
- NANYA TECHNOLOGY CORPORATION
- Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, semiconductor packages, and methods of manuf...
- Patent number 11,018,101
- Issue date May 25, 2021
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 10,818,620
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method to minimize stress on stack via
- Patent number 10,804,153
- Issue date Oct 13, 2020
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising getter layers and methods of makin...
- Patent number 10,804,175
- Issue date Oct 13, 2020
- Monolith Semiconductor, Inc.
- Kevin Matocha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry etch process landing on metal oxide etch stop layer over metal...
- Patent number 10,707,089
- Issue date Jul 7, 2020
- Texas Instruments Incorporated
- Sebastian Meier
- G01 - MEASURING TESTING
Information Patent Grant
Method of making fully molded peripheral package on package device
- Patent number 10,672,624
- Issue date Jun 2, 2020
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 10,658,272
- Issue date May 19, 2020
- Kabushiki Kaisha Toshiba
- Hiroaki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND STRUCTURES FOR LOW TEMPERATURE HYBRID BONDING
- Publication number 20250006674
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE...
- Publication number 20240321679
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Youngjoon KOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20240290737
- Publication date Aug 29, 2024
- MEDIATEK INC.
- Hung-Pin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240234354
- Publication date Jul 11, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CHIP WITH UBM-TYPE METALLIZATION
- Publication number 20240113054
- Publication date Apr 4, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Clément Lobre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20240071973
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230389339
- Publication date Nov 30, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Chao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DELAMINATION/CRACKING IMPROVEMENT AT SOLDER JOINTS IN MICROELECTRON...
- Publication number 20230326899
- Publication date Oct 12, 2023
- Qorvo US, Inc.
- Yinbao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20230282605
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH DISSOLVABLE METAL LAYER
- Publication number 20230187390
- Publication date Jun 15, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sebastian MEIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS
- Publication number 20230031099
- Publication date Feb 2, 2023
- ADVANCED MICRO DEVICES, INC.
- BRYAN BLACK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230015243
- Publication date Jan 19, 2023
- SAMSUNG DISPLAY CO., LTD.
- Chungi You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20230005979
- Publication date Jan 5, 2023
- SONY GROUP CORPORATION
- Satoru WAKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY EMPLOYING METAL-SEMICONDUCTOR BONDING AND METAL-MET...
- Publication number 20220352104
- Publication date Nov 3, 2022
- SANDISK TECHNOLOGIES LLC
- Lin HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON PHOTONIC INTERPOSER WITH TWO METAL REDISTRIBUTION LAYERS
- Publication number 20220310540
- Publication date Sep 29, 2022
- ROCKLEY PHOTONICS LIMITED
- Michael LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220189895
- Publication date Jun 16, 2022
- Fujitsu Limited
- Masaru Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Encapsulant Deposited Along Sides and Sur...
- Publication number 20220093417
- Publication date Mar 24, 2022
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR DEVICE
- Publication number 20210288007
- Publication date Sep 16, 2021
- NANYA TECHNOLOGY CORPORATION
- Ping HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES, SEMICONDUCTOR PACKAGES, AND METHODS OF MANUF...
- Publication number 20210272918
- Publication date Sep 2, 2021
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE CONTAINING A GRATING AND METHODS OF MAKING THE...
- Publication number 20210226107
- Publication date Jul 22, 2021
- GLO AB
- Zhen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20210082843
- Publication date Mar 18, 2021
- NANYA TECHNOLOGY CORPORATION
- Ping HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FLOW FOR FABRICATION OF CAP METAL OVER TOP METAL WITH SINTE...
- Publication number 20210005560
- Publication date Jan 7, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Richard Allen Faust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD STRUCTURE FOR MEMORY DEVICE AND METHOD OF MANUFACTURING...
- Publication number 20200411457
- Publication date Dec 31, 2020
- Changxin Memory Technologies, Inc.
- Chih Cheng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method to Minimize Stress on Stack Via
- Publication number 20200402855
- Publication date Dec 24, 2020
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY ETCH PROCESS LANDING ON METAL OXIDE ETCH STOP LAYER OVER METAL...
- Publication number 20200303202
- Publication date Sep 24, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sebastian Meier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Connection Between Component Parts, and Comp...
- Publication number 20200294962
- Publication date Sep 17, 2020
- OSRAM OLED GmbH
- Simeon Katz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200294971
- Publication date Sep 17, 2020
- Toshiba Memory Corporation
- Yusuke TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD LAYER SYSTEM, GAS SENSOR AND METHOD FOR MANUFACTURING A...
- Publication number 20200140261
- Publication date May 7, 2020
- ROBERT BOSCH GmbH
- Andreas Scheurle
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200105691
- Publication date Apr 2, 2020
- Sumitomo Electric Industries, Ltd.
- Masataka Watanabe
- G02 - OPTICS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200091044
- Publication date Mar 19, 2020
- Kabushiki Kaisha Toshiba
- Hiroaki TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS

Platinum [Pt] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Process flow for fabrication of cap metal over top metal with sinte...

Semiconductor device with encapsulant deposited along sides and sur...

Semiconductor chip with redundant thru-silicon-vias

Semiconductor device and method to minimize stress on stack via

Multiple plated via arrays of different wire heights on a same subs...

Method for producing a connection between component parts, and comp...

Silicon photonic interposer with two metal redistribution layers

Semiconductor components having conductive vias with aligned back s...

Solder based hybrid bonding for fine pitch and thin BLT interconnec...

Semiconductor devices, semiconductor packages, and methods of manuf...

Light emitting diode containing a grating and methods of making the...

Bonded assembly employing metal-semiconductor bonding and metal-met...

Method for fabricating a semiconductor device

Semiconductor device and method of manufacturing thereof

Semiconductor chip with redundant thru-silicon-vias

Bonding pad layer system, gas sensor and method for manufacturing a...

Bonding pad structure for memory device and method of manufacturing...

Semiconductor devices comprising getter layers and methods of makin...

Semiconductor device and method of manufacturing the same

Semiconductor device with encapsulant deposited along sides and sur...

Dry etch process landing on metal oxide etch stop layer over metal...

Semiconductor device and method of manufacturing the same

Semiconductor device and method for fabricating the same

Semiconductor devices, semiconductor packages, and methods of manuf...

Semiconductor integrated circuit device

Semiconductor device and method to minimize stress on stack via

Semiconductor devices comprising getter layers and methods of makin...

Dry etch process landing on metal oxide etch stop layer over metal...

Method of making fully molded peripheral package on package device

Method for manufacturing semiconductor device

Patents Applicationslast 30 patents

METHODS AND STRUCTURES FOR LOW TEMPERATURE HYBRID BONDING

HEAT DISSIPATION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE...

BUMP STRUCTURE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC CHIP WITH UBM-TYPE METALLIZATION

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

DELAMINATION/CRACKING IMPROVEMENT AT SOLDER JOINTS IN MICROELECTRON...

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

SEMICONDUCTOR DIE WITH DISSOLVABLE METAL LAYER

SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS

DISPLAY DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

BONDED ASSEMBLY EMPLOYING METAL-SEMICONDUCTOR BONDING AND METAL-MET...

SILICON PHOTONIC INTERPOSER WITH TWO METAL REDISTRIBUTION LAYERS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor Device with Encapsulant Deposited Along Sides and Sur...

METHOD OF FABRICATING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES, SEMICONDUCTOR PACKAGES, AND METHODS OF MANUF...

LIGHT EMITTING DIODE CONTAINING A GRATING AND METHODS OF MAKING THE...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

PROCESS FLOW FOR FABRICATION OF CAP METAL OVER TOP METAL WITH SINTE...

BONDING PAD STRUCTURE FOR MEMORY DEVICE AND METHOD OF MANUFACTURING...

Semiconductor Device and Method to Minimize Stress on Stack Via

DRY ETCH PROCESS LANDING ON METAL OXIDE ETCH STOP LAYER OVER METAL...

Method for Producing a Connection Between Component Parts, and Comp...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

BONDING PAD LAYER SYSTEM, GAS SENSOR AND METHOD FOR MANUFACTURING A...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE