Platinum [Pt] as principal constituent

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H01L2224/83469

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83469Platinum [Pt] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 11,842,975
- Issue date Dec 12, 2023
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering a conductor to an aluminum layer
- Patent number 11,424,217
- Issue date Aug 23, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for creating a bond between objects based on f...
- Patent number 10,923,454
- Issue date Feb 16, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste for bonding
- Patent number 10,756,047
- Issue date Aug 25, 2020
- E I du Pont de Nemours and Company
- Takuya Konno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip assembly
- Patent number 10,636,766
- Issue date Apr 28, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vibrator device, oscillator, electronic device, and vehicle
- Patent number 10,615,747
- Issue date Apr 7, 2020
- Seiko Epson Corporation
- Hisahiro Ito
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for producing electronic device with multi-layer contact
- Patent number 10,475,761
- Issue date Nov 12, 2019
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and light emitting module
- Patent number 10,297,716
- Issue date May 21, 2019
- LG Innotek Co., Ltd
- Shuhei Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-transfer printing with volatile adhesive layer
- Patent number 10,157,880
- Issue date Dec 18, 2018
- X-CELEPRINT LIMITED
- Salvatore Bonafede
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for producing an electronic device
- Patent number 10,147,696
- Issue date Dec 4, 2018
- Osram Opto Semiconductors GmbH
- Andreas Ploessl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, method for producing a plurality of semiconduct...
- Patent number 10,134,943
- Issue date Nov 20, 2018
- Osram Opto Semiconductors GmbH
- Bernd Barchmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic particle paste, cured product using same, and semiconducto...
- Patent number 10,086,478
- Issue date Oct 2, 2018
- Kabushiki Kaisha Toshiba
- Daisuke Hiratsuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a chip assembly with a die attach liquid
- Patent number 9,837,381
- Issue date Dec 5, 2017
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite substrate with alternating pattern of diamond and metal o...
- Patent number 9,812,375
- Issue date Nov 7, 2017
- II-VI Incorporated
- Wen-Qing Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame construct for lead-free solder connections
- Patent number 9,520,347
- Issue date Dec 13, 2016
- Honeywell International Inc.
- Jianxing Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact
- Patent number 9,490,193
- Issue date Nov 8, 2016
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device using diffusion soldering
- Patent number 8,975,117
- Issue date Mar 10, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contacting means and method for contacting electrical components
- Patent number 8,925,789
- Issue date Jan 6, 2015
- Heraeus Materials Technology GmbH & Co. KG
- Michael Schäfer
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Chip package and a method for manufacturing a chip package
- Patent number 8,841,768
- Issue date Sep 23, 2014
- Infineon Technologies AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding with metal germanium silicon material
- Patent number 8,592,926
- Issue date Nov 26, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrate bonding with metal germanium silicon material
- Patent number 8,058,143
- Issue date Nov 15, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM
- Publication number 20240088087
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Alexander HEINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...
- Publication number 20210167035
- Publication date Jun 3, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY
- Publication number 20200219848
- Publication date Jul 9, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device with Multi-Layer Contact and System
- Publication number 20200075530
- Publication date Mar 5, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Electronic Device With Multi-Layer Contact
- Publication number 20190006311
- Publication date Jan 3, 2019
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Paste For Bonding
- Publication number 20180102341
- Publication date Apr 12, 2018
- E I DU PONT DE NEMOURS AND COMPANY
- Takuya Konno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO-TRANSFER PRINTING WITH VOLATILE ADHESIVE LAYER
- Publication number 20180096964
- Publication date Apr 5, 2018
- X-Celeprint Limited
- Salvatore Bonafede
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device and Method for Producing an Electronic Device
- Publication number 20170271295
- Publication date Sep 21, 2017
- Osram Opto Semiconductors GmbH
- Andreas Ploessl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140021610
- Publication date Jan 23, 2014
- INFINEON TECHNOLOGIES AG
- Carsten VON KOBLINSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Using Diffusion Soldering
- Publication number 20130200532
- Publication date Aug 8, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device and a Method for Fabricating an Electronic Device
- Publication number 20130140685
- Publication date Jun 6, 2013
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL
- Publication number 20120068325
- Publication date Mar 22, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Contacting Means and Method for Contacting Electrical Components
- Publication number 20120055978
- Publication date Mar 8, 2012
- HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
- Michael SCHÄFER
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL
- Publication number 20100181676
- Publication date Jul 22, 2010
- RUBEN B. MONTEZ
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Platinum [Pt] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device with multi-layer contact and system

Chip assembly

Soldering a conductor to an aluminum layer

Method and apparatus for creating a bond between objects based on f...

Conductive paste for bonding

Chip assembly

Vibrator device, oscillator, electronic device, and vehicle

Method for producing electronic device with multi-layer contact

Light emitting device and light emitting module

Micro-transfer printing with volatile adhesive layer

Electronic device and method for producing an electronic device

Semiconductor chip, method for producing a plurality of semiconduct...

Metallic particle paste, cured product using same, and semiconducto...

Method of forming a chip assembly with a die attach liquid

Composite substrate with alternating pattern of diamond and metal o...

Lead frame construct for lead-free solder connections

Electronic device with multi-layer contact

Semiconductor device using diffusion soldering

Contacting means and method for contacting electrical components

Chip package and a method for manufacturing a chip package

Substrate bonding with metal germanium silicon material

Substrate bonding with metal germanium silicon material

Patents Applicationslast 30 patents

ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM

METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...

METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY

Electronic Device with Multi-Layer Contact and System

Method for Producing Electronic Device With Multi-Layer Contact

Conductive Paste For Bonding

MICRO-TRANSFER PRINTING WITH VOLATILE ADHESIVE LAYER

Electronic Device and Method for Producing an Electronic Device

CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE

Semiconductor Device Using Diffusion Soldering

Electronic Device and a Method for Fabricating an Electronic Device

SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL

Contacting Means and Method for Contacting Electrical Components

SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL