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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Patents Grants
last 30 patents
Information
Patent Grant
Electronic device with multi-layer contact and system
Patent number
12,255,168
Issue date
Mar 18, 2025
Infineon Technologies AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor device and structure with metal layers and memory...
Patent number
12,243,765
Issue date
Mar 4, 2025
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Grant
Semiconductor device and a method of manufacturing the same
Patent number
12,154,823
Issue date
Nov 26, 2024
Renesas Electronics Corporation
Katsuhiko Hotta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for producing a 3D semiconductor memory device and structure
Patent number
12,154,817
Issue date
Nov 26, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor device and structure with single-crystal layers
Patent number
12,136,562
Issue date
Nov 5, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor device and structure with metal layers and memory...
Patent number
12,125,737
Issue date
Oct 22, 2024
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Grant
Method for permanent connection of two metal surfaces
Patent number
12,107,057
Issue date
Oct 1, 2024
EV Group E. Thallner GmbH
Viorel Dragoi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for producing a 3D semiconductor device and structure with...
Patent number
12,100,611
Issue date
Sep 24, 2024
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Grant
Semiconductor chip with redundant thru-silicon-vias
Patent number
12,094,853
Issue date
Sep 17, 2024
Advanced Micro Devices, Inc.
Bryan Black
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged integrated circuit devices with through-body conductive vi...
Patent number
12,087,738
Issue date
Sep 10, 2024
Tongbi Jiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die contact structure and method
Patent number
12,074,127
Issue date
Aug 27, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chung-Shi Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor device and structure with bonding and DRAM memory...
Patent number
12,068,187
Issue date
Aug 20, 2024
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Grant
Methods for producing a 3D semiconductor device and structure with...
Patent number
12,033,884
Issue date
Jul 9, 2024
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Grant
Manufacturing method and electronic module with new routing possibi...
Patent number
RE49970
Issue date
May 14, 2024
IMBERATEK, LLC
Antti Kivikero
Information
Patent Grant
Single-package wireless communication device
Patent number
11,942,676
Issue date
Mar 26, 2024
Tahoe Research, LTD.
Mohamed A. Megahed
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of manufacturing an integrated circuit having stress tuning...
Patent number
11,935,842
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Shin-Puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor device and structure with bonding
Patent number
11,923,230
Issue date
Mar 5, 2024
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Grant
Method for fabricating semiconductor device with graphene layers
Patent number
11,908,816
Issue date
Feb 20, 2024
NANYA TECHNOLOGY CORPORATION
Tse-Yao Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor device and structure with memory
Patent number
11,901,210
Issue date
Feb 13, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor device and structure with single-crystal layers
Patent number
11,876,011
Issue date
Jan 16, 2024
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Grant
Semiconductor components having conductive vias with aligned back s...
Patent number
11,869,809
Issue date
Jan 9, 2024
Micron Technology, Inc.
Jin Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for producing a 3D semiconductor device and structure with m...
Patent number
11,862,503
Issue date
Jan 2, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming a semiconductor device having TSV formed through...
Patent number
11,854,990
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsien-Pin Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for producing a 3D semiconductor device and structure with...
Patent number
11,854,857
Issue date
Dec 26, 2023
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device with multi-layer contact and system
Patent number
11,842,975
Issue date
Dec 12, 2023
Infineon Technologies AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder material and method for die attachment
Patent number
11,842,974
Issue date
Dec 12, 2023
Alpha Assembly Solutions Inc.
Angelo Gulino
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
3D semiconductor device and structure with bonding
Patent number
11,830,757
Issue date
Nov 28, 2023
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Grant
Semiconductor device and method for fabricating a semiconductor device
Patent number
11,817,417
Issue date
Nov 14, 2023
Infineon Technologies Austria AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for producing a 3D semiconductor device and structure with...
Patent number
11,804,396
Issue date
Oct 31, 2023
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
Patent number
11,792,941
Issue date
Oct 17, 2023
IMBERATEK, LLC
Risto Tuominen
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
Publication number
20250046653
Publication date
Feb 6, 2025
RENESAS ELECTRONICS CORPORATION
Katsuhiko HOTTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
Publication number
20250006544
Publication date
Jan 2, 2025
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS
Publication number
20240429086
Publication date
Dec 26, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...
Publication number
20240421131
Publication date
Dec 19, 2024
Lodestar Licensing Group LLC
Tongbi Jiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES
Publication number
20240421109
Publication date
Dec 19, 2024
EV GROUP E. THALLNER GMBH
Viorel Dragio
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPTOELECTRONIC SYSTEM
Publication number
20240421266
Publication date
Dec 19, 2024
EPISTAR CORPORATION
Min-Hsun HSIEH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240404904
Publication date
Dec 5, 2024
InnoLux Corporation
Ker-Yih KAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY CELLS AND MULTIPL...
Publication number
20240404866
Publication date
Dec 5, 2024
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Application
METHODS FOR PRODUCING A 3D SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE
Publication number
20240395592
Publication date
Nov 28, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for Forming a Semiconductor Device Having TSV Formed Through...
Publication number
20240387393
Publication date
Nov 21, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Hsien-Pin Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
Publication number
20240363385
Publication date
Oct 31, 2024
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Application
Lead-Free Solder Ball
Publication number
20240363571
Publication date
Oct 31, 2024
SENJU METAL INDUSTRY CO., LTD.
Yoshie Yamanaka
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
AI BONDING WIRE FOR SEMICONDUCTOR DEVICES
Publication number
20240312946
Publication date
Sep 19, 2024
Tetsuya OYAMADA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH BONDING AND DRAM MEMORY...
Publication number
20240213073
Publication date
Jun 27, 2024
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Application
REVERSABLE ATTACHMENT SYSTEM
Publication number
20240213212
Publication date
Jun 27, 2024
The Boeing Company
Peter D. Brewer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH...
Publication number
20240178040
Publication date
May 30, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY
Publication number
20240170319
Publication date
May 23, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR COMPONENTS HAVING CONDUCTIVE VIAS WITH ALIGNED BACK S...
Publication number
20240145305
Publication date
May 2, 2024
Micron Technology, Inc.
Jin Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM
Publication number
20240088087
Publication date
Mar 14, 2024
INFINEON TECHNOLOGIES AG
Alexander HEINRICH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method for Fabricating a Semiconductor Device
Publication number
20240038714
Publication date
Feb 1, 2024
Infineon Technologies Austria AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...
Publication number
20230197690
Publication date
Jun 22, 2023
Micron Technology, Inc.
Tongbi Jiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
Publication number
20230187275
Publication date
Jun 15, 2023
RENESAS ELECTRONICS CORPORATION
Katsuhiko HOTTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Die Contact Structure and Method
Publication number
20230085696
Publication date
Mar 23, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chung-Shi Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS
Publication number
20230031099
Publication date
Feb 2, 2023
ADVANCED MICRO DEVICES, INC.
BRYAN BLACK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
Publication number
20230018430
Publication date
Jan 19, 2023
NIPPON MICROMETAL CORPORATION
Daizo ODA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
EMBEDDED SEMICONDUCTIVE CHIPS IN RECONSTITUTED WAFERS, AND SYSTEMS...
Publication number
20220336229
Publication date
Oct 20, 2022
Intel Corporation
Robert L. Sankman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MICROSTRUCTURE MODIFICATION OF CONDUCTING LINES
Publication number
20220293467
Publication date
Sep 15, 2022
YUAN ZE UNIVERSITY
Cheng EN HO
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...
Publication number
20220285325
Publication date
Sep 8, 2022
Micron Technology, Inc.
Tongbi Jiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20220231061
Publication date
Jul 21, 2022
SONY GROUP CORPORATION
Yoshihiro Nabe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING A SOLDER COMPOUND CONTAINING A COMPO...
Publication number
20220216173
Publication date
Jul 7, 2022
INFINEON TECHNOLOGIES AG
Thomas Behrens
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR