Plug-in assemblages of components

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CPC
H05K7/10

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/10Plug-in assemblages of components

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Connector including signal pins shielded by buried ground vias
- Patent number 12,224,510
- Issue date Feb 11, 2025
- NEOCONIX, INC
- Woody Maynard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processor load plate for two-phase liquid immersion cooling
- Patent number 12,213,278
- Issue date Jan 28, 2025
- Dell Products L.P.
- Robert B. Curtis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mobile memory module for electrical transfer switch
- Patent number 12,199,468
- Issue date Jan 14, 2025
- ASCO Power Technologies, L.P.
- Victor Bonachea
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Compression mounted technology (CMT) socket system retention mechan...
- Patent number 12,176,643
- Issue date Dec 24, 2024
- Intel Corporation
- Thomas Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SSD card adapter bracket and circuit board assembly
- Patent number 12,150,265
- Issue date Nov 19, 2024
- Hong Fu Jin Precision Industry (WuHan) Co., Ltd.
- Zhao-Li Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stiffener ring combined with ASIC power delivery
- Patent number 12,142,578
- Issue date Nov 12, 2024
- Cisco Technology, Inc.
- Xiaohong Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-fixing device for a socket
- Patent number 12,142,868
- Issue date Nov 12, 2024
- CHROMA ATE INC.
- Hui-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compression mounted technology (CMT) socket retention mechanisms to...
- Patent number 12,127,363
- Issue date Oct 22, 2024
- Intel Corporation
- Feifei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module for vehicle and motor driving apparatus including the...
- Patent number 12,122,244
- Issue date Oct 22, 2024
- Myung Ill You
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Communication systems having pluggable optical modules
- Patent number 12,101,904
- Issue date Sep 24, 2024
- Nubis Communications, Inc.
- Christopher Robert Cole
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Assembly method of electronic device
- Patent number 12,096,568
- Issue date Sep 17, 2024
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- I-Kai Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly including cable modules
- Patent number 12,089,357
- Issue date Sep 10, 2024
- TE CONNECTIVITY SOLUTIONS GmbH
- Christopher William Blackburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cable management system
- Patent number 12,088,972
- Issue date Sep 10, 2024
- Reichle & De-Massari AG
- Nadejda Zidarova
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Motherboard with shockproof, shakeproof and waterproof functions, e...
- Patent number 12,075,562
- Issue date Aug 27, 2024
- SHENZHEN WEIBU INFORMATION CO., LTD.
- Yongbo Ding
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Shielded electronic component package
- Patent number 12,040,305
- Issue date Jul 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Ok Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and architecture of non-volatile memory module in paralle...
- Patent number 12,014,078
- Issue date Jun 18, 2024
- Entrantech Inc.
- Kong-Chen Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device, expansion card assembly, server device and manag...
- Patent number 11,985,780
- Issue date May 14, 2024
- HANGZHOU HIKVISION DIGITAL TECHNOLOGY CO., LTD
- Honghai Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector including signal pins shielded by buried ground vias
- Patent number 11,967,782
- Issue date Apr 23, 2024
- NEOCONIX, INC
- Woody Maynard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly including a compression assembly for cable conn...
- Patent number 11,943,886
- Issue date Mar 26, 2024
- TE CONNECTIVITY SOLUTIONS GmbH
- Christopher William Blackburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assembly and system for communication to an access po...
- Patent number 11,937,393
- Issue date Mar 19, 2024
- ARINC Incorporated
- Curtis Wicks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket having solder balls
- Patent number 11,916,328
- Issue date Feb 27, 2024
- Tyco Electronics Japan G.K.
- Naoki Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back plate assembly and electronic device
- Patent number 11,894,285
- Issue date Feb 6, 2024
- Tyco Electronics (Shanghai) Co., Ltd.
- Jiefeng Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air conditioner, and method of replacing functional component
- Patent number 11,879,646
- Issue date Jan 23, 2024
- Daikin Industries, Ltd.
- Kazunari Fukagawa
- F24 - HEATING RANGES VENTILATING
Information Patent Grant
Information processing system
- Patent number 11,844,184
- Issue date Dec 12, 2023
- Fulian Precision Electronics (Tianjin) Co., LTD.
- Tung-Ho Shih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Socket connector for a power connector system
- Patent number 11,812,576
- Issue date Nov 7, 2023
- TE CONNECTIVITY SOLUTIONS GmbH
- Michael James Horning
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compression-loaded printed circuit assembly for solder defect mitig...
- Patent number 11,791,231
- Issue date Oct 17, 2023
- Google LLC
- Sue Yun Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket connector having array of socket contacts
- Patent number 11,777,244
- Issue date Oct 3, 2023
- TE CONNECTIVITY SOLUTIONS GmbH
- Brian Patrick Costello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with Si-substrate-free interposer and method forming same
- Patent number 11,769,718
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal jig for charging and discharging secondary battery cell
- Patent number 11,770,014
- Issue date Sep 26, 2023
- WONIKPNE
- Sock Jun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Folding device stand for portable devices
- Patent number 11,758,676
- Issue date Sep 12, 2023
- Micron Technology, Inc.
- Sophia Hoem
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
PROTRUSIONS OF SOCKET BODIES HAVING METAL
- Publication number 20250024622
- Publication date Jan 16, 2025
- Intel Corporation
- Richard Canham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMALL FORM FACTOR SHUNTED SOCKET PINS AND CONFIGURATION FOR IMPROVE...
- Publication number 20250015527
- Publication date Jan 9, 2025
- Intel Corporation
- Landon HANKS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEMS AND METHODS FOR TEST SOCKETS HAVING SCRUBBING CONTACTS
- Publication number 20240393364
- Publication date Nov 28, 2024
- Smiths Interconnect Americas, Inc.
- Jiachun Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AUTOMATION FIELD DEVICE
- Publication number 20240365496
- Publication date Oct 31, 2024
- Endress+Hauser SE+Co. KG
- Raphael Schonhardt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FRAME FOR COUPLING OF A THERMAL MANAGEMENT DEVICE TO A PRINTED CIRC...
- Publication number 20240314934
- Publication date Sep 19, 2024
- ADVANCED MICRO DEVICES, INC.
- Gamal REFAI-AHMED
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTOR ASSEMBLY WITH INTEGRATED DATA AND BACKUP ENERGY CONNECTIONS
- Publication number 20240305026
- Publication date Sep 12, 2024
- Micron Technology, Inc.
- Mark A. Tverdy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REUSABLE MEMBER FOR RETAINING ELECTRONIC CARD
- Publication number 20240268050
- Publication date Aug 8, 2024
- Amphenol Commercial Products (ChengDu) Co., LTD.
- Peng Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ORTHOGONAL SYSTEM ARCHITECTURE AND NETWORK DEVICE
- Publication number 20240260218
- Publication date Aug 1, 2024
- Huawei Technologies Co., Ltd
- Jinhua Ye
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ACTUATING HEATSINK FOR PLUGGABLE MODULES
- Publication number 20240206127
- Publication date Jun 20, 2024
- Juniper Networks, Inc.
- Jimmy Chun-Chuen LEUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power Conversion Device
- Publication number 20240195307
- Publication date Jun 13, 2024
- MITSUBISHI ELECTRIC CORPORATION
- Mikito HIRATA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CONNECTOR INCLUDING SIGNAL PINS SHIELDED BY BURIED GROUND VIAS
- Publication number 20240170867
- Publication date May 23, 2024
- Neoconix, Inc.
- Woody Maynard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER MODULE FOR VEHICLE AND MOTOR DRIVING APPARATUS INCLUDING THE...
- Publication number 20240123835
- Publication date Apr 18, 2024
- Hyundai Motor Company
- Myung Ill YOU
- B60 - VEHICLES IN GENERAL
Information Patent Application
DIFFERENTIAL TRANSMISSION BOARD SET AND ASSEMBLY
- Publication number 20240079806
- Publication date Mar 7, 2024
- Japan Aviation Electronics Industry, Ltd.
- Kenta OONISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTING MODULE LOCKING DEVICES
- Publication number 20240074060
- Publication date Feb 29, 2024
- Hewlett-Packard Development Company, L.P.
- Derek Kyle Joseph Kanas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTOR WITH IMPROVED CONTACTS
- Publication number 20240072477
- Publication date Feb 29, 2024
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- SHUO-HSIU HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REVERSE CLAMPING COMPRESSION DEVICE FOR CPO OR NPO
- Publication number 20240061196
- Publication date Feb 22, 2024
- Celestica Technology Consultancy (Shanghai) Co. Ltd.
- Chao SUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSOR LOAD PLATE FOR TWO-PHASE LIQUID IMMERSION COOLING
- Publication number 20240032234
- Publication date Jan 25, 2024
- Dell Products L.P.
- Robert B. CURTIS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Standoff And Support Structures for Reliable Land Grid Array and Hy...
- Publication number 20240008208
- Publication date Jan 4, 2024
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFERENTIAL TRANSMISSION BOARD SET AND ASSEMBLY
- Publication number 20230397356
- Publication date Dec 7, 2023
- Japan Aviation Electronics Industry, Ltd.
- Kenta OONISHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AIR CONDITIONER, AND METHOD OF REPLACING FUNCTIONAL COMPONENT
- Publication number 20230349584
- Publication date Nov 2, 2023
- DAIKIN INDUSTRIES, LTD.
- Kazunari Fukagawa
- F24 - HEATING RANGES VENTILATING
Information Patent Application
COMMUNICATION SYSTEMS HAVING PLUGGABLE OPTICAL MODULES
- Publication number 20230354541
- Publication date Nov 2, 2023
- Nubis Communications, Inc.
- Christopher Robert Cole
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOBILE MEMORY MODULE FOR ELECTRICAL TRANSFER SWITCH
- Publication number 20230352971
- Publication date Nov 2, 2023
- ASCO Power Technologies, LP
- Victor Bonachea
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CARRIER MODULE APPARATUS FOR RETROFIT IN CONTROL CABINETS AND METHO...
- Publication number 20230320017
- Publication date Oct 5, 2023
- ABB Schweiz AG
- David Mielnik
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW PROFILE IMPEDANCE-TUNABLE AND CROSS-TALK CONTROLLED HIGH SPEED...
- Publication number 20230307856
- Publication date Sep 28, 2023
- Intel Corporation
- Emad S. AL-MOMANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFORMATION PROCESSING SYSTEM
- Publication number 20230309251
- Publication date Sep 28, 2023
- Fulian Precision Electronics (Tianjin) Co., LTD.
- TUNG-HO SHIH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHIELDED ELECTRONIC COMPONENT PACKAGE
- Publication number 20230275061
- Publication date Aug 31, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Ok Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SSD CARD ADAPTER BRACKET AND CIRCUIT BOARD ASSEMBLY
- Publication number 20230269897
- Publication date Aug 24, 2023
- HONG FU JIN PRECISION INDUSTRY (WUHAN) CO., LTD.
- ZHAO-LI ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE AND STRUCTURE WITH ELECTRONIC COMPONENT
- Publication number 20230247756
- Publication date Aug 3, 2023
- Murata Manufacturing Co., Ltd.
- Kazunori TSUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADAPTER FOR AIRCRAFT WIRELESS MODULE
- Publication number 20230156951
- Publication date May 18, 2023
- Curtis Wicks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIMM COOLING ASSEMBLY WITH HEAT SPREADER ANTI-ROTATION MECHANISM
- Publication number 20230092972
- Publication date Mar 23, 2023
- Intel Corporation
- Phil GENG
- H01 - BASIC ELECTRIC ELEMENTS

Plug-in assemblages of components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Connector including signal pins shielded by buried ground vias

Processor load plate for two-phase liquid immersion cooling

Mobile memory module for electrical transfer switch

Compression mounted technology (CMT) socket system retention mechan...

SSD card adapter bracket and circuit board assembly

Stiffener ring combined with ASIC power delivery

Chip-fixing device for a socket

Compression mounted technology (CMT) socket retention mechanisms to...

Power module for vehicle and motor driving apparatus including the...

Communication systems having pluggable optical modules

Assembly method of electronic device

Electronic assembly including cable modules

Cable management system

Motherboard with shockproof, shakeproof and waterproof functions, e...

Shielded electronic component package

Apparatus and architecture of non-volatile memory module in paralle...

Electronic device, expansion card assembly, server device and manag...

Connector including signal pins shielded by buried ground vias

Electronic assembly including a compression assembly for cable conn...

Circuit board assembly and system for communication to an access po...

Socket having solder balls

Back plate assembly and electronic device

Air conditioner, and method of replacing functional component

Information processing system

Socket connector for a power connector system

Compression-loaded printed circuit assembly for solder defect mitig...

Socket connector having array of socket contacts

Packages with Si-substrate-free interposer and method forming same

Universal jig for charging and discharging secondary battery cell

Folding device stand for portable devices

Patents Applicationslast 30 patents

PROTRUSIONS OF SOCKET BODIES HAVING METAL

SMALL FORM FACTOR SHUNTED SOCKET PINS AND CONFIGURATION FOR IMPROVE...

SYSTEMS AND METHODS FOR TEST SOCKETS HAVING SCRUBBING CONTACTS

AUTOMATION FIELD DEVICE

FRAME FOR COUPLING OF A THERMAL MANAGEMENT DEVICE TO A PRINTED CIRC...

CONNECTOR ASSEMBLY WITH INTEGRATED DATA AND BACKUP ENERGY CONNECTIONS

REUSABLE MEMBER FOR RETAINING ELECTRONIC CARD

ORTHOGONAL SYSTEM ARCHITECTURE AND NETWORK DEVICE

ACTUATING HEATSINK FOR PLUGGABLE MODULES

Power Conversion Device

CONNECTOR INCLUDING SIGNAL PINS SHIELDED BY BURIED GROUND VIAS

POWER MODULE FOR VEHICLE AND MOTOR DRIVING APPARATUS INCLUDING THE...

DIFFERENTIAL TRANSMISSION BOARD SET AND ASSEMBLY

COMPUTING MODULE LOCKING DEVICES

ELECTRICAL CONNECTOR WITH IMPROVED CONTACTS

REVERSE CLAMPING COMPRESSION DEVICE FOR CPO OR NPO

PROCESSOR LOAD PLATE FOR TWO-PHASE LIQUID IMMERSION COOLING

Standoff And Support Structures for Reliable Land Grid Array and Hy...

DIFFERENTIAL TRANSMISSION BOARD SET AND ASSEMBLY

AIR CONDITIONER, AND METHOD OF REPLACING FUNCTIONAL COMPONENT

COMMUNICATION SYSTEMS HAVING PLUGGABLE OPTICAL MODULES

MOBILE MEMORY MODULE FOR ELECTRICAL TRANSFER SWITCH

CARRIER MODULE APPARATUS FOR RETROFIT IN CONTROL CABINETS AND METHO...

LOW PROFILE IMPEDANCE-TUNABLE AND CROSS-TALK CONTROLLED HIGH SPEED...

INFORMATION PROCESSING SYSTEM

SHIELDED ELECTRONIC COMPONENT PACKAGE

SSD CARD ADAPTER BRACKET AND CIRCUIT BOARD ASSEMBLY

STRUCTURE AND STRUCTURE WITH ELECTRONIC COMPONENT

ADAPTER FOR AIRCRAFT WIRELESS MODULE

DIMM COOLING ASSEMBLY WITH HEAT SPREADER ANTI-ROTATION MECHANISM