Plural coating layers

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CPC
H01L2224/29575

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29575Plural coating layers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bonded assembly containing different size opposing bonding pads and...
- Patent number 12,125,814
- Issue date Oct 22, 2024
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,057,426
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,955,451
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,955,452
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronic assemblies with solder layer and exterior coating,...
- Patent number 10,903,186
- Issue date Jan 26, 2021
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, mechanical quantity measuring device, and sem...
- Patent number 10,247,630
- Issue date Apr 2, 2019
- Hitachi Automotive Systems, Ltd.
- Hanae Shimokawa
- G01 - MEASURING TESTING
Information Patent Grant
Method of double patterning lithography process using plurality of...
- Patent number 10,170,306
- Issue date Jan 1, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ju Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240321811
- Publication date Sep 26, 2024
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240170441
- Publication date May 23, 2024
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230411339
- Publication date Dec 21, 2023
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230402421
- Publication date Dec 14, 2023
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING CONFINED GROWTH S/D CONTACT WITH SELECTIVE DEPOSI...
- Publication number 20230377998
- Publication date Nov 23, 2023
- TOKYO ELECTRON LIMITED
- Jeffrey SMITH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230307411
- Publication date Sep 28, 2023
- Rohm Co., Ltd.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY CONTAINING DIFFERENT SIZE OPPOSING BONDING PADS AND...
- Publication number 20230253353
- Publication date Aug 10, 2023
- SANDISK TECHNOLOGIES LLC
- Lin HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL JOINTED BODY, SEMICONDUCTOR DEVICE, WAVE GUIDE TUBE, AND METH...
- Publication number 20230054798
- Publication date Feb 23, 2023
- Mitsubishi Electric Corporation
- Takashi IJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER ELECTRONIC ASSEMBLIES WITH SOLDER LAYER AND EXTERIOR COATING,...
- Publication number 20200126944
- Publication date Apr 23, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MECHANICAL QUANTITY MEASURING DEVICE, AND SEM...
- Publication number 20180202883
- Publication date Jul 19, 2018
- Hitachi Automotive Systems, Ltd.
- Hanae SHIMOKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Double Patterning Lithography Process Using Plurality of...
- Publication number 20170221702
- Publication date Aug 3, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ju Lee
- H01 - BASIC ELECTRIC ELEMENTS

Plural coating layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonded assembly containing different size opposing bonding pads and...

Semiconductor module

Semiconductor module

Semiconductor module

Power electronic assemblies with solder layer and exterior coating,...

Semiconductor device, mechanical quantity measuring device, and sem...

Method of double patterning lithography process using plurality of...

Patents Applicationslast 30 patents

SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE

METHOD OF FORMING CONFINED GROWTH S/D CONTACT WITH SELECTIVE DEPOSI...

SEMICONDUCTOR MODULE

BONDED ASSEMBLY CONTAINING DIFFERENT SIZE OPPOSING BONDING PADS AND...

METAL JOINTED BODY, SEMICONDUCTOR DEVICE, WAVE GUIDE TUBE, AND METH...

POWER ELECTRONIC ASSEMBLIES WITH SOLDER LAYER AND EXTERIOR COATING,...

SEMICONDUCTOR DEVICE, MECHANICAL QUANTITY MEASURING DEVICE, AND SEM...

Method of Double Patterning Lithography Process Using Plurality of...