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CPC
H01L2224/13075

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13075Plural core members

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Interconnect structures for stacked dies, including penetrating str...
- Patent number 9,165,888
- Issue date Oct 20, 2015
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip hybridization of microelectronic components by local heat...
- Patent number 9,111,924
- Issue date Aug 18, 2015
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Abdelkader Aliane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure including nano-wires and a body connecting ends of t...
- Patent number 9,076,881
- Issue date Jul 7, 2015
- Samsung Electronics Co., Ltd.
- Yun-Hyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 8,703,533
- Issue date Apr 22, 2014
- SK Hynix Inc.
- Si Han Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for stacked dies, including penetrating str...
- Patent number 8,680,654
- Issue date Mar 25, 2014
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure including nano-wires and a body connecting ends of t...
- Patent number 8,643,179
- Issue date Feb 4, 2014
- Samsung Electronics Co., Ltd.
- Yun-Hyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for stacked dies, including penetrating str...
- Patent number 8,435,836
- Issue date May 7, 2013
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for stacked dies, including penetrating str...
- Patent number 7,872,332
- Issue date Jan 18, 2011
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Harvested Reconstitution Bumping
- Publication number 20230245988
- Publication date Aug 3, 2023
- Kwan-Yu Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160111388
- Publication date Apr 21, 2016
- RENESAS ELECTRONICS CORPORATION
- Shinji Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP HYBRIDIZATION OF MICROELECTRONIC COMPONENTS BY LOCAL HEAT...
- Publication number 20140210076
- Publication date Jul 31, 2014
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Abdelkader ALIANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...
- Publication number 20140206145
- Publication date Jul 24, 2014
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE INCLUDING NANO-WIRES AND A BODY CONNECTING ENDS OF T...
- Publication number 20140147974
- Publication date May 29, 2014
- Samsung Electronics Co., Ltd.
- Yun-Hyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140008798
- Publication date Jan 9, 2014
- Shinji Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...
- Publication number 20130234296
- Publication date Sep 12, 2013
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120205796
- Publication date Aug 16, 2012
- Hynix Semiconductor Inc.
- Si Han KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE AND SEMICONDUCTOR PACKAGE HAVING THE BUMP STRUCTURE
- Publication number 20120119359
- Publication date May 17, 2012
- Samsung Electronics Co., Ltd.
- Yun-Hyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...
- Publication number 20110111561
- Publication date May 12, 2011
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...
- Publication number 20100059897
- Publication date Mar 11, 2010
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS, LOW-TEMPERATURE METAL-METAL COMPOSITE FLIP CHIP INTERCO...
- Publication number 20090242121
- Publication date Oct 1, 2009
- Daewoong Suh
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Plural core members

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Interconnect structures for stacked dies, including penetrating str...

Flip-chip hybridization of microelectronic components by local heat...

Bump structure including nano-wires and a body connecting ends of t...

Semiconductor package and method for manufacturing the same

Interconnect structures for stacked dies, including penetrating str...

Bump structure including nano-wires and a body connecting ends of t...

Interconnect structures for stacked dies, including penetrating str...

Interconnect structures for stacked dies, including penetrating str...

Patents Applicationslast 30 patents

Harvested Reconstitution Bumping

SEMICONDUCTOR DEVICE

FLIP-CHIP HYBRIDIZATION OF MICROELECTRONIC COMPONENTS BY LOCAL HEAT...

INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...

BUMP STRUCTURE INCLUDING NANO-WIRES AND A BODY CONNECTING ENDS OF T...

SEMICONDUCTOR DEVICE

INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

BUMP STRUCTURE AND SEMICONDUCTOR PACKAGE HAVING THE BUMP STRUCTURE

INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...

INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...

LOW STRESS, LOW-TEMPERATURE METAL-METAL COMPOSITE FLIP CHIP INTERCO...