TREA

Pneumatic conveyor

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Industry

  • CPC
  • H01L2224/75654
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75654Pneumatic conveyor
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Method of mounting die
    • Patent number 11,069,651
    • Issue date Jul 20, 2021
    • Shinkawa Ltd.
    • Osamu Watanabe
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD OF MOUNTING DIE
    • Publication number 20200321311
    • Publication date Oct 8, 2020
    • SHINKAWA LTD.
    • Osamu WATANABE
    • H01 - BASIC ELECTRIC ELEMENTS