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H01L2924/0655
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2924/00
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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H01L2924/0655
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Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HEAT-SPREADING LID
Publication number
20250201668
Publication date
Jun 19, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Ching Wang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Publication number
20210358884
Publication date
Nov 18, 2021
DAICEL CORPORATION
Naoko TSUJI
H01 - BASIC ELECTRIC ELEMENTS