Polyamides or polyimides

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CPC
G03F7/0387

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Parent Industries

GPHYSICS G03Photography G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES G03F7/00Photomechanical

Current Industry

G03F7/0387Polyamides or polyimides

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Resin composition, resin sheet, cured film, method for producing cu...
- Patent number 12,210,285
- Issue date Jan 28, 2025
- Toray Industries, Inc.
- Keika Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Negative photosensitive resin composition, patterning process, meth...
- Patent number 12,197,127
- Issue date Jan 14, 2025
- Shin-Etsu Chemical Co., Ltd.
- Masashi Iio
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Negative photosensitive resin composition, production method for po...
- Patent number 12,174,539
- Issue date Dec 24, 2024
- Asahi Kasei Kabushiki Kaisha
- Takeki Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive resin composition, pattern forming method, cured fil...
- Patent number 12,078,929
- Issue date Sep 3, 2024
- FUJIFILM Corporation
- Toshihide Aoshima
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Photosensitive resin composition, film, and electronic device
- Patent number 12,019,373
- Issue date Jun 25, 2024
- DUKSAN TECHOPIA CO. LTD.
- Dae Won Lee
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Branched copolymer, and photosensitive resin composition, photosens...
- Patent number 11,981,775
- Issue date May 14, 2024
- LG Chem, Ltd.
- Bethy Kim
- G02 - OPTICS
Information Patent Grant
Photoresist composition and method of forming photoresist pattern
- Patent number 11,971,659
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Chih Ho
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Photosensitive composition, negative photosensitive composition, pi...
- Patent number 11,940,729
- Issue date Mar 26, 2024
- Toray Industries, Inc.
- Akihiro Ishikawa
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Manufacturing method for cured substance, manufacturing method for...
- Patent number 11,934,102
- Issue date Mar 19, 2024
- FUJIFILM Corporation
- Atsuyasu Nozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive polyimide compositions
- Patent number 11,899,364
- Issue date Feb 13, 2024
- Fujifilm Electronic Materials U.S.A., Inc.
- Binod B. De
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer layer in semiconductor device and method of manufacture
- Patent number 11,868,047
- Issue date Jan 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sih-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive resin composition, polyimide production method, and...
- Patent number 11,809,079
- Issue date Nov 7, 2023
- Asahi Kasei Kabushiki Kaisha
- Tomohiro Yorisue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing polyimide precursor, method for producing phot...
- Patent number 11,807,721
- Issue date Nov 7, 2023
- HD MICROSYSTEMS, LTD.
- Satoshi Yoneda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photosensitive polyimide compositions
- Patent number 11,782,344
- Issue date Oct 10, 2023
- Fujifilm Electronic Materials U.S.A., Inc.
- Sanjay Malik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crosslinking agent compound, photosensitive composition comprising...
- Patent number 11,754,921
- Issue date Sep 12, 2023
- LG Chem, Ltd.
- Kichul Koo
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Resin composition, method for producing heat-resistant resin film,...
- Patent number 11,640,110
- Issue date May 2, 2023
- Toray Industries, Inc.
- Keika Hashimoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Photosensitive resin composition and method for producing cured rel...
- Patent number 11,640,112
- Issue date May 2, 2023
- Asahi Kasei Kabushiki Kaisha
- Tomohiro Yorisue
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Photosensitive resin composition and cured film
- Patent number 11,624,982
- Issue date Apr 11, 2023
- LG Chem, Ltd.
- Seung Yeon Hwang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Compound, polyimide resin and method of producing the same, photose...
- Patent number 11,572,442
- Issue date Feb 7, 2023
- International Business Machines Corporation
- Dmitry Zubarev
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Negative photosensitive resin composition, cured film, element prov...
- Patent number 11,561,470
- Issue date Jan 24, 2023
- Toray Industries, Inc.
- Yugo Tanigaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reactive end group containing polyimides and polyamic acids and pho...
- Patent number 11,535,709
- Issue date Dec 27, 2022
- PROMERUS, LLC
- Pramod Kandanarachchi
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Resin composition, resin sheet, cured film, organic el display devi...
- Patent number 11,512,199
- Issue date Nov 29, 2022
- Toray Industries, Inc.
- Yusuke Komori
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Photosensitive resin composition, cured film, laminate, method for...
- Patent number 11,480,876
- Issue date Oct 25, 2022
- FUJIFILM Corporation
- Kei Fukuhara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer, photosensitive resin composition, patterning method, metho...
- Patent number 11,333,975
- Issue date May 17, 2022
- International Business Machines Corporation
- Dmitry Zubarev
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Precursor for polyimide and use thereof
- Patent number 11,319,410
- Issue date May 3, 2022
- Eternal Materials Co., Ltd.
- Po-Yu Huang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Chain extenders and formulations thereof for improving elongation i...
- Patent number 11,294,281
- Issue date Apr 5, 2022
- Hutchinson Technology Incorporated
- Andrew R. Dick
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Photosensitive resin composition, photosensitive resin laminate, an...
- Patent number 11,294,283
- Issue date Apr 5, 2022
- Shin-Etsu Chemical Co., Ltd.
- Yoichiro Ichioka
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Alkali-soluble resin, photosensitive resin composition, photosensit...
- Patent number 11,279,802
- Issue date Mar 22, 2022
- Toray Industries, Inc.
- Yutaro Koyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photosensitive resin composition, cured pattern production method,...
- Patent number 11,226,560
- Issue date Jan 18, 2022
- HD MICROSYSTEMS, LTD.
- Nobuyuki Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition
- Patent number 11,199,776
- Issue date Dec 14, 2021
- Toray Industries, Inc.
- Yusuke Komori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTIL...
- Publication number 20240393686
- Publication date Nov 28, 2024
- Resonac Corporation
- Hideyuki KATAGI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTOSENSITIVE POLYAMIC ACID AND DIAZIRINE COMPOSITIONS
- Publication number 20240336599
- Publication date Oct 10, 2024
- PROMERUS, LLC
- PRAMOD KANDANARACHCHI
- C07 - ORGANIC CHEMISTRY
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RE...
- Publication number 20240329525
- Publication date Oct 3, 2024
- Asahi Kasei Kabushiki Kaisha
- Tomohiro YORISUE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIST COMPOSITION AND PATTERN FORMING PROCESS
- Publication number 20240329529
- Publication date Oct 3, 2024
- Shin-Etsu Chemical Co., Ltd.
- Jun Hatakeyama
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
NEGATIVE-TYPE PHOTOSENSITIVE POLYMER, POLYMER SOLUTION, NEGATIVE-TY...
- Publication number 20240301115
- Publication date Sep 12, 2024
- SUMITOMO BAKELITE CO., LTD.
- Keita IMAI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PHOTOSENSITIVE POLYIMIDE COMPOSITIONS
- Publication number 20240288770
- Publication date Aug 29, 2024
- PROMERUS, LLC
- PRAMOD KANDANARACHCHI
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RE...
- Publication number 20240210827
- Publication date Jun 27, 2024
- Asahi Kasei Kabushiki Kaisha
- Tomohiro YORISUE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIST COMPOSITION AND PATTERN FORMING PROCESS
- Publication number 20240118615
- Publication date Apr 11, 2024
- Shin-Etsu Chemical Co., Ltd.
- Jun Hatakeyama
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
POLYIMIDE PRECURSOR RESIN COMPOSITION AND METHOD FOR MANUFACTURING...
- Publication number 20240101761
- Publication date Mar 28, 2024
- Asahi Kasei Kabushiki Kaisha
- Kohei MURAKAMI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION, RESIN FILM, AND ELECTRO...
- Publication number 20240085789
- Publication date Mar 14, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Yumi SATO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR PRODUCING PATTERNED SUBSTRATE
- Publication number 20240027907
- Publication date Jan 25, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Daichi MIYAHARA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Polymer Layer in Semiconductor Device and Method of Manufacture
- Publication number 20230384672
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sih-Hao Liao
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT THEREOF AND MULTILA...
- Publication number 20230374186
- Publication date Nov 23, 2023
- Nippon Kayaku Kabushiki-Kaisha
- Kengo NISHIMURA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
UNDERLAYER COMPOUND FOR PHOTOLITHOGRAPHY, MULTILAYERED STRUCTURE FO...
- Publication number 20230375927
- Publication date Nov 23, 2023
- Inha University Research and Business Foundation
- Jinkyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR...
- Publication number 20230350305
- Publication date Nov 2, 2023
- FUJIFILM CORPORATION
- Atsuyasu NOZAKI
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Negative Photosensitive Resin Composition, Patterning Process, Inte...
- Publication number 20230350294
- Publication date Nov 2, 2023
- Shin-Etsu Chemical Co., Ltd.
- Katsuya TAKEMURA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20230282475
- Publication date Sep 7, 2023
- Samsung Electronics Co., Ltd.
- Eun Hyea KO
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD
- Publication number 20230284394
- Publication date Sep 7, 2023
- Nitto Denko Corporation
- Naoki SHIBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED REL...
- Publication number 20230221639
- Publication date Jul 13, 2023
- Asahi Kasei Kabushiki Kaisha
- Tomohiro YORISUE
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR...
- Publication number 20230213858
- Publication date Jul 6, 2023
- FUJIFILM CORPORATION
- Misaki TAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYPEPTIDE, PHOTORESIST COMPOSITION INCLUDING THE SAME, AND METHOD...
- Publication number 20230176480
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Jinha KIM
- C07 - ORGANIC CHEMISTRY
Information Patent Application
PHOTOSENSITIVE COMPOSITION, NEGATIVE PHOTOSENSITIVE COMPOSITION, PI...
- Publication number 20230127537
- Publication date Apr 27, 2023
- TORAY INDUSTRIES, INC.
- Akihiro ISHIKAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
LIQUID EJECTION HEAD, AND METHOD FOR PRODUCING LIQUID EJECTION HEAD
- Publication number 20230121773
- Publication date Apr 20, 2023
- Canon Kabushiki Kaisha
- Kazunari Ishizuka
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR MANUFACTUR...
- Publication number 20230110416
- Publication date Apr 13, 2023
- Asahi Kasei Kabushiki Kaisha
- Takanobu FUJIOKA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PHOTOSENSITIVE TRANSFER MATERIAL AND METHOD OF PRODUCING THE SAME,...
- Publication number 20230095251
- Publication date Mar 30, 2023
- FUJIFILM CORPORATION
- Kentaro TOYOOKA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PHOTORESIST COMPOSITION AND METHOD OF FORMING PHOTORESIST PATTERN
- Publication number 20230028673
- Publication date Jan 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Chih HO
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED MATERIAL AND ELEC...
- Publication number 20220382154
- Publication date Dec 1, 2022
- TAIYO HOLDINGS CO., LTD.
- Maho AKIMOTO
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METH...
- Publication number 20220317570
- Publication date Oct 6, 2022
- Shin-Etsu Chemical Co., Ltd.
- Masashi IIO
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR PO...
- Publication number 20220291585
- Publication date Sep 15, 2022
- Asahi Kasei Kabushiki Kaisha
- Takeki SHIMIZU
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
NEGATIVE RESIST COMPOSITION AND PATTERN FORMING PROCESS
- Publication number 20220260909
- Publication date Aug 18, 2022
- Shin-Etsu Chemical Co., Ltd.
- Jun Hatakeyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Polyamides or polyimides

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Resin composition, resin sheet, cured film, method for producing cu...

Negative photosensitive resin composition, patterning process, meth...

Negative photosensitive resin composition, production method for po...

Photosensitive resin composition, pattern forming method, cured fil...

Photosensitive resin composition, film, and electronic device

Branched copolymer, and photosensitive resin composition, photosens...

Photoresist composition and method of forming photoresist pattern

Photosensitive composition, negative photosensitive composition, pi...

Manufacturing method for cured substance, manufacturing method for...

Photosensitive polyimide compositions

Polymer layer in semiconductor device and method of manufacture

Photosensitive resin composition, polyimide production method, and...

Method for producing polyimide precursor, method for producing phot...

Photosensitive polyimide compositions

Crosslinking agent compound, photosensitive composition comprising...

Resin composition, method for producing heat-resistant resin film,...

Photosensitive resin composition and method for producing cured rel...

Photosensitive resin composition and cured film

Compound, polyimide resin and method of producing the same, photose...

Negative photosensitive resin composition, cured film, element prov...

Reactive end group containing polyimides and polyamic acids and pho...

Resin composition, resin sheet, cured film, organic el display devi...

Photosensitive resin composition, cured film, laminate, method for...

Polymer, photosensitive resin composition, patterning method, metho...

Precursor for polyimide and use thereof

Chain extenders and formulations thereof for improving elongation i...

Photosensitive resin composition, photosensitive resin laminate, an...

Alkali-soluble resin, photosensitive resin composition, photosensit...

Photosensitive resin composition, cured pattern production method,...

Resin composition

Patents Applicationslast 30 patents

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTIL...

PHOTOSENSITIVE POLYAMIC ACID AND DIAZIRINE COMPOSITIONS

PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RE...

RESIST COMPOSITION AND PATTERN FORMING PROCESS

NEGATIVE-TYPE PHOTOSENSITIVE POLYMER, POLYMER SOLUTION, NEGATIVE-TY...

PHOTOSENSITIVE POLYIMIDE COMPOSITIONS

PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RE...

RESIST COMPOSITION AND PATTERN FORMING PROCESS

POLYIMIDE PRECURSOR RESIN COMPOSITION AND METHOD FOR MANUFACTURING...

PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION, RESIN FILM, AND ELECTRO...

METHOD FOR PRODUCING PATTERNED SUBSTRATE

Polymer Layer in Semiconductor Device and Method of Manufacture

PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT THEREOF AND MULTILA...

UNDERLAYER COMPOUND FOR PHOTOLITHOGRAPHY, MULTILAYERED STRUCTURE FO...

MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR...

Negative Photosensitive Resin Composition, Patterning Process, Inte...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

METHOD FOR PRODUCING WIRING CIRCUIT BOARD

PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED REL...

MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR...

POLYPEPTIDE, PHOTORESIST COMPOSITION INCLUDING THE SAME, AND METHOD...

PHOTOSENSITIVE COMPOSITION, NEGATIVE PHOTOSENSITIVE COMPOSITION, PI...

LIQUID EJECTION HEAD, AND METHOD FOR PRODUCING LIQUID EJECTION HEAD

NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR MANUFACTUR...

PHOTOSENSITIVE TRANSFER MATERIAL AND METHOD OF PRODUCING THE SAME,...

PHOTORESIST COMPOSITION AND METHOD OF FORMING PHOTORESIST PATTERN

PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED MATERIAL AND ELEC...

NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METH...

NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR PO...

NEGATIVE RESIST COMPOSITION AND PATTERN FORMING PROCESS