Polycarbonate

Industry

CPC
H01L2924/068

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/068Polycarbonate

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device manufacturing method
- Patent number 11,710,731
- Issue date Jul 25, 2023
- Daicel Corporation
- Naoko Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 11,676,956
- Issue date Jun 13, 2023
- Daicel Corporation
- Naoko Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 11,646,304
- Issue date May 9, 2023
- Daicel Corporation
- Naoko Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temporary bonding scheme
- Patent number 11,328,972
- Issue date May 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond materials with enhanced plasma resistant characteristics and a...
- Patent number 10,727,195
- Issue date Jul 28, 2020
- Technetics Group LLC
- Jason Wright
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal bonding sheet and thermal bonding sheet with dicing tape
- Patent number 10,707,184
- Issue date Jul 7, 2020
- Nitto Denko Corporation
- Yuki Sugo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive composition and electronic parts using the same
- Patent number 10,541,222
- Issue date Jan 21, 2020
- NAMICS CORPORATION
- Koji Sasaki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Temporary bonding scheme
- Patent number 10,170,387
- Issue date Jan 1, 2019
- Taiwan Semiconductor Manufacturing Company
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded composite enclosure for integrated circuit assembly
- Patent number 10,056,308
- Issue date Aug 21, 2018
- Intel Corporation
- Paul J. Gwin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Molded composite enclosure for integrated circuit assembly
- Patent number 9,607,914
- Issue date Mar 28, 2017
- Intel Corporation
- Paul J. Gwin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Temporary bonding scheme
- Patent number 9,202,799
- Issue date Dec 1, 2015
- Taiwan Semiconductor Manufactruing Company, Ltd.
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE INCLUDING SAME
- Publication number 20230290751
- Publication date Sep 14, 2023
- SAMSUNG DISPLAY CO., LTD.
- Joo Nyung JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATION MATERIAL, LAMINATED SHEET, CURED PRODUCT, SEMICONDUCT...
- Publication number 20220115285
- Publication date Apr 14, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- Kazunari TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20210384183
- Publication date Dec 9, 2021
- DAICEL CORPORATION
- Naoko TSUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Temporary Bonding Scheme
- Publication number 20190139850
- Publication date May 9, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND MATERIALS WITH ENHANCED PLASMA RESISTANT CHARACTERISTICS AND A...
- Publication number 20190088613
- Publication date Mar 21, 2019
- TECHNETICS GROUP LLC
- Jason Wright
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Thermal Bonding Sheet and Thermal Bonding Sheet with Dicing Tape
- Publication number 20180269175
- Publication date Sep 20, 2018
- NITTO DENKO CORPORATION
- Yuki Sugo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CONDUCTIVE COMPOSITION AND ELECTRONIC PARTS USING THE SAME
- Publication number 20170243849
- Publication date Aug 24, 2017
- NAMICS CORPORATION
- Koji SASAKI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MOLDED COMPOSITE ENCLOSURE FOR INTEGRATED CIRCUIT ASSEMBLY
- Publication number 20170170085
- Publication date Jun 15, 2017
- Intel Corporation
- Paul J. Gwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURE A POWER ELECTRONIC SWITCHING DEVICE AND POWE...
- Publication number 20170092574
- Publication date Mar 30, 2017
- SEMIKRON Elektronik GmbH & Co., KG
- Florian WAGNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FOR SEMICONDUCTOR BACK SURFACE AND ITS USE
- Publication number 20160351432
- Publication date Dec 1, 2016
- Nitto Denko Corporation
- Naohide TAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED COMPOSITE ENCLOSURE FOR INTEGRATED CIRCUIT ASSEMBLY
- Publication number 20160268178
- Publication date Sep 15, 2016
- Paul J. Gwin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Systems and Methods Utilizing Anisotropic Conductive Adhesives
- Publication number 20160254244
- Publication date Sep 1, 2016
- SunRay Scientific, LLC
- S. Kumar Khanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTOR DEVICE
- Publication number 20160075920
- Publication date Mar 17, 2016
- Samsung SDI Co., Ltd.
- Dong Seon UH
- B32 - LAYERED PRODUCTS
Information Patent Application
Temporary Bonding Scheme
- Publication number 20150155260
- Publication date Jun 4, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTOR DEVICE
- Publication number 20120141786
- Publication date Jun 7, 2012
- Dong Seon UH
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Polycarbonate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device manufacturing method

Semiconductor device manufacturing method

Semiconductor device manufacturing method

Temporary bonding scheme

Bond materials with enhanced plasma resistant characteristics and a...

Thermal bonding sheet and thermal bonding sheet with dicing tape

Conductive composition and electronic parts using the same

Temporary bonding scheme

Molded composite enclosure for integrated circuit assembly

Molded composite enclosure for integrated circuit assembly

Temporary bonding scheme

Patents Applicationslast 30 patents

ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE INCLUDING SAME

ENCAPSULATION MATERIAL, LAMINATED SHEET, CURED PRODUCT, SEMICONDUCT...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Temporary Bonding Scheme

BOND MATERIALS WITH ENHANCED PLASMA RESISTANT CHARACTERISTICS AND A...

Thermal Bonding Sheet and Thermal Bonding Sheet with Dicing Tape

CONDUCTIVE COMPOSITION AND ELECTRONIC PARTS USING THE SAME

MOLDED COMPOSITE ENCLOSURE FOR INTEGRATED CIRCUIT ASSEMBLY

METHOD FOR MANUFACTURE A POWER ELECTRONIC SWITCHING DEVICE AND POWE...

FILM FOR SEMICONDUCTOR BACK SURFACE AND ITS USE

MOLDED COMPOSITE ENCLOSURE FOR INTEGRATED CIRCUIT ASSEMBLY

Systems and Methods Utilizing Anisotropic Conductive Adhesives

ADHESIVE FILM FOR SEMICONDUCTOR DEVICE

Temporary Bonding Scheme

ADHESIVE FILM FOR SEMICONDUCTOR DEVICE