Polychromatic or infrared lamp heating

Industry

CPC
H01L2224/8023

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8023Polychromatic or infrared lamp heating

Industries

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Information Patent Grant
Silicon carbide composite wafer and manufacturing method thereof
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Method for transferring electronic device
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Information Patent Grant
Implementation module for stacked connection between isolated circu...
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Information Patent Grant
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Information Patent Grant
Implementation method for stacked connection between isolated circu...
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Information Patent Grant
Chip-on-wafer bonding method and bonding device, and structure comp...
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- Issue date Sep 22, 2015
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- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF PROCESSING WAFER
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Information Patent Application
METHOD FOR TRANSFERRING ELECTRONIC DEVICE
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- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
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Information Patent Application
METHOD OF PROCESSING WAFER
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NEXT GENERATION BONDING LAYER FOR 3D HETEROGENEOUS INTEGRATION
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Information Patent Application
METHOD FOR TRANSFERRING ELECTRONIC DEVICE
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- Stroke Precision Advanced Engineering Co., Ltd.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPLEMENTATION METHOD FOR STACKED CONNECTION BETWEEN ISOLATED CIRCU...
- Publication number 20180124941
- Publication date May 3, 2018
- SHENZHEN XILONG TOY COMPANY LIMITED
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Information Patent Application
IMPLEMENTATION METHOD FOR STACKED CONNECTION BETWEEN ISOLATED CIRCU...
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- H01 - BASIC ELECTRIC ELEMENTS

Polychromatic or infrared lamp heating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for transferring electronic device

Silicon carbide composite wafer and manufacturing method thereof

Method for transferring electronic device

Implementation module for stacked connection between isolated circu...

Implementation method for stacked connection between isolated circu...

Implementation method for stacked connection between isolated circu...

Chip-on-wafer bonding method and bonding device, and structure comp...

Patents Applicationslast 30 patents

METHOD OF PROCESSING WAFER

METHOD FOR TRANSFERRING ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

METHOD OF PROCESSING WAFER

NEXT GENERATION BONDING LAYER FOR 3D HETEROGENEOUS INTEGRATION

PIEZOELECTRIC MATERIALS FOR ON-DIE THERMAL ENHANCEMENT OF HYBRID BO...

BONDING LAYER AND PROCESS OF MAKING

SILICON CARBIDE COMPOSITE WAFER AND MANUFACTURING METHOD THEREOF

METHOD FOR TRANSFERRING ELECTRONIC DEVICE

IMPLEMENTATION METHOD FOR STACKED CONNECTION BETWEEN ISOLATED CIRCU...

IMPLEMENTATION METHOD FOR STACKED CONNECTION BETWEEN ISOLATED CIRCU...