Polyimide

Industry

CPC
H05K2201/0154

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0154Polyimide

Industries

Patents Grantslast 30 patents

Information Patent Grant
Systems, devices, and methods for robotic end effectors
- Patent number 12,162,138
- Issue date Dec 10, 2024
- Sanctuary Cognitive Systems Corporation
- Connor Richard Shannon
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Film-closure apparatus for plastic film material, printed circuit b...
- Patent number 12,145,324
- Issue date Nov 19, 2024
- Green Light Packaging Limited
- Mark Bonning
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Printed circuits with embedded resistive thermal devices
- Patent number 12,135,592
- Issue date Nov 5, 2024
- Apple Inc.
- Anne M. Mason
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Resin composition and article made therefrom
- Patent number 12,134,682
- Issue date Nov 5, 2024
- ELITE MATERIAL CO., LTD.
- Tse-Hung Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, resin sheet, multilayer printed wiring board, an...
- Patent number 12,133,339
- Issue date Oct 29, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Yune Kumazawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulated circuit substrate manufacturing method
- Patent number 12,133,338
- Issue date Oct 29, 2024
- Mitsubishi Materials Corporation
- Yoshiaki Sakaniwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reel mechanism and winding device for flexible copper clad laminate
- Patent number 12,120,828
- Issue date Oct 15, 2024
- AAC Technologies (Nanjing) Co., Ltd.
- Rui Pan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aerosol generating device and method for controlling same
- Patent number 12,108,802
- Issue date Oct 8, 2024
- KT & G Corporation
- Hun Il Lim
- A24 - TOBACCO CIGARS CIGARETTES SMOKERS' REQUISITES
Information Patent Grant
Circuit board and electronic device
- Patent number 12,108,521
- Issue date Oct 1, 2024
- GUANGZHOU FANGBANG ELECTRONICS CO., LTD
- Zhi Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bent laminated printed circuit board
- Patent number 12,108,524
- Issue date Oct 1, 2024
- Murata Manufacturing Co., Ltd.
- Toshikazu Harada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board
- Patent number 12,101,879
- Issue date Sep 24, 2024
- LG Innotek Co., Ltd
- Jun Young Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Trans-vacuum printed flexible wiring apparatus
- Patent number 12,096,551
- Issue date Sep 17, 2024
- EQUAL 1 LABORATORIES IRELAND LIMITED
- Hans Haenlein
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Superconducting flex circuit boards having metal structures for imp...
- Patent number 12,082,335
- Issue date Sep 3, 2024
- Google LLC
- John Martinis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for manufacturing microelectrode film
- Patent number 12,063,749
- Issue date Aug 13, 2024
- BOE Technology Group Co., Ltd.
- Fan Li
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Substrate for a printed wiring board
- Patent number 12,058,812
- Issue date Aug 6, 2024
- Sumitomo Electric Industries, Ltd.
- Takuto Hidani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical module and aerosol generation device comprising same
- Patent number 12,048,328
- Issue date Jul 30, 2024
- KT & G Corporation
- Hwi Kyeong An
- F21 - LIGHTING
Information Patent Grant
Rigid flexible printed circuit board and electronic device includin...
- Patent number 12,041,717
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Hyunmo Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit structure
- Patent number 12,035,467
- Issue date Jul 9, 2024
- Ticona LLC
- Young Shin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming flexible interconnect circuits
- Patent number 12,035,459
- Issue date Jul 9, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aerosol generating device and heater assembly for aerosol generatin...
- Patent number 12,016,390
- Issue date Jun 25, 2024
- KT & G Corporation
- Tae Hun Kim
- A24 - TOBACCO CIGARS CIGARETTES SMOKERS' REQUISITES
Information Patent Grant
Boron nitride nanotube coated substrates for sintering of metallic...
- Patent number 11,993,719
- Issue date May 28, 2024
- National Research Council of Canada
- Chantal Paquet
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Protection tape for printed circuit board and display device includ...
- Patent number 11,987,031
- Issue date May 21, 2024
- Samsung Display Co., Ltd.
- Jun Namkung
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of fabricating a substrate with metal reflection layer
- Patent number 11,979,980
- Issue date May 7, 2024
- UNIFLEX Technology Inc.
- Cheng-I Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polyimide resin precursor, polyimide resin, metal-clad laminated bo...
- Patent number 11,976,171
- Issue date May 7, 2024
- Arisawa Mfg. Co., Ltd.
- Yoshinori Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 11,979,981
- Issue date May 7, 2024
- Kyocera Corporation
- Takayuki Umemoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuits with embedded resistive thermal devices
- Patent number 11,971,760
- Issue date Apr 30, 2024
- Apple Inc.
- Anne M. Mason
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flexible printed circuit board assembly
- Patent number 11,956,894
- Issue date Apr 9, 2024
- SIGNIFY HOLDING, B.V.
- Pieter Joseph Clara Van Der Wel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display panel and display device including the same
- Patent number 11,956,899
- Issue date Apr 9, 2024
- Samsung Display Co., Ltd.
- Joo-nyung Jang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring member having bending property and electronic device compris...
- Patent number 11,943,888
- Issue date Mar 26, 2024
- Samsung Electronics Co., Ltd.
- Eunseok Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a substrate structure with high reflectance
- Patent number 11,937,370
- Issue date Mar 19, 2024
- UNIFLEX Technology Inc.
- Cheng-I Tu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20240414842
- Publication date Dec 12, 2024
- LG Innotek Co., Ltd.
- Jun Young LIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GRAPHENE INTEGRATED CORE AND ASSOCIATED METHODS FOR THERMAL MANAGEM...
- Publication number 20240397604
- Publication date Nov 28, 2024
- NVIDIA Corporation
- Oren STEINBERG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE AND FLEXIBLE METAL FILM STRUCTURES
- Publication number 20240389225
- Publication date Nov 21, 2024
- Liquid Wire Inc.
- Trevor Antonio Rivera
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD HAVING OVERCURRENT PROTECTION FUNCTION
- Publication number 20240357735
- Publication date Oct 24, 2024
- LG ENERGY SOLUTION, LTD.
- Young Joong KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POLYAMIC ACID, POLYAMIC ACID COMPOSITION, POLYIMIDE, POLYIMIDE FILM...
- Publication number 20240343866
- Publication date Oct 17, 2024
- TAMURA CORPORATION
- Taiki ENDO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE BOARD MATERIAL AND FLEXIBLE PRINTED CIRCUIT
- Publication number 20240341031
- Publication date Oct 10, 2024
- AAC MICROTECH (CHANGZHOU) CO., LTD.
- Guohui Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RE...
- Publication number 20240329525
- Publication date Oct 3, 2024
- Asahi Kasei Kabushiki Kaisha
- Tomohiro YORISUE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PHOTOIMAGABLE DIELECTRICS
- Publication number 20240317940
- Publication date Sep 26, 2024
- Rohm and Haas Electronic Materials L.L.C.
- Nora Sabina Radu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROTECTION TAPE FOR PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUD...
- Publication number 20240300208
- Publication date Sep 12, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jun NAMKUNG
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AN...
- Publication number 20240287347
- Publication date Aug 29, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Yune KUMAZAWA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Flexible printed circuit
- Publication number 20240292526
- Publication date Aug 29, 2024
- AAC MICROTECH (CHANGZHOU) CO., LTD.
- Zhigao Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible printed circuit
- Publication number 20240292525
- Publication date Aug 29, 2024
- AAC MICROTECH (CHANGZHOU) CO., LTD.
- Zhigao Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BISMALEIMIDE COMPOSITION, CURED PRODUCT, SHEET, LAMINATED BODY, AND...
- Publication number 20240278536
- Publication date Aug 22, 2024
- Resonac Corporation
- Kitaru SATO
- B32 - LAYERED PRODUCTS
Information Patent Application
Method for preparing novel material layer structure of circuit boar...
- Publication number 20240284599
- Publication date Aug 22, 2024
- LongKai LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POLYIMIDE RESIN PRECURSOR, POLYIMIDE RESIN, METAL-CLAD LAMINATED BO...
- Publication number 20240270907
- Publication date Aug 15, 2024
- Arisawa Mfg. Co., Ltd.
- Yoshinori Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnect Circuit Methods And Devices
- Publication number 20240276632
- Publication date Aug 15, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE INCLUDING STAGGERED SEMICONDUCTOR MEMO...
- Publication number 20240260194
- Publication date Aug 1, 2024
- Western Digital Technologies, Inc.
- Fu Xing Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240251508
- Publication date Jul 25, 2024
- Sumitomo Electric Industries, Ltd.
- Masamichi YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RE...
- Publication number 20240210827
- Publication date Jun 27, 2024
- Asahi Kasei Kabushiki Kaisha
- Tomohiro YORISUE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY PANEL AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20240206065
- Publication date Jun 20, 2024
- SAMSUNG DISPLAY CO., LTD.
- Joo-nyung JANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING POLYIMIDE RESIN POWDER
- Publication number 20240199810
- Publication date Jun 20, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Yuuki SATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW-DIELECTRIC BOARD MATERIAL
- Publication number 20240206059
- Publication date Jun 20, 2024
- NITTO DENKO CORPORATION
- Taku IMAIZUMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, CURED OBJECT, RESIN SHEET, PREPREG, METAL-CLAD L...
- Publication number 20240191030
- Publication date Jun 13, 2024
- Nippon Kayaku Kabushiki-Kaisha
- Kazuyoshi YAMAMOTO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RESIN COMPOSITION, RESIN SHEET, MULTILAYERED PRINTED WIRING BOARD,...
- Publication number 20240174809
- Publication date May 30, 2024
- Nippon Kayaku Kabushiki-Kaisha
- Kazuyoshi YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED BOARD AND FLEXIBLE PRINTED BOARD CONNECTION STRUCTURE
- Publication number 20240179840
- Publication date May 30, 2024
- NIPPON MEKTRON, LTD.
- Masanori HIRATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Neurotrophic Electrode Array
- Publication number 20240156385
- Publication date May 16, 2024
- Neural Logistics LLC
- Philip R. Kennedy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRUCTURE CONNECTED ON BASIS OF SOLDER BALL AND ELASTIC BODY
- Publication number 20240147619
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Jongwan SHIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TECHNOLOGIES FOR A FLEXIBLE 3D POWER PLANE IN A CHASSIS
- Publication number 20240130068
- Publication date Apr 18, 2024
- Intel Corporation
- Nan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYIMIDE RESIN COMPOSITION AND METAL BASE SUBSTRATE
- Publication number 20240117119
- Publication date Apr 11, 2024
- MITSUBISHI MATERIALS CORPORATION
- Shintaro Hara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR PRODUCING LAYERED BODY, LAYERED BODY, AND MULTILAYERED BODY
- Publication number 20240096774
- Publication date Mar 21, 2024
- Toyobo Co., Ltd.
- Tetsuo OKUYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Systems, devices, and methods for robotic end effectors

Film-closure apparatus for plastic film material, printed circuit b...

Printed circuits with embedded resistive thermal devices

Resin composition and article made therefrom

Resin composition, resin sheet, multilayer printed wiring board, an...

Insulated circuit substrate manufacturing method

Reel mechanism and winding device for flexible copper clad laminate

Aerosol generating device and method for controlling same

Circuit board and electronic device

Bent laminated printed circuit board

Flexible circuit board

Trans-vacuum printed flexible wiring apparatus

Superconducting flex circuit boards having metal structures for imp...

Method for manufacturing microelectrode film

Substrate for a printed wiring board

Optical module and aerosol generation device comprising same

Rigid flexible printed circuit board and electronic device includin...

Circuit structure

Methods of forming flexible interconnect circuits

Aerosol generating device and heater assembly for aerosol generatin...

Boron nitride nanotube coated substrates for sintering of metallic...

Protection tape for printed circuit board and display device includ...

Method of fabricating a substrate with metal reflection layer

Polyimide resin precursor, polyimide resin, metal-clad laminated bo...

Wiring board

Printed circuits with embedded resistive thermal devices

Flexible printed circuit board assembly

Display panel and display device including the same

Wiring member having bending property and electronic device compris...

Method for manufacturing a substrate structure with high reflectance

Patents Applicationslast 30 patents

FLEXIBLE CIRCUIT BOARD

GRAPHENE INTEGRATED CORE AND ASSOCIATED METHODS FOR THERMAL MANAGEM...

STRETCHABLE AND FLEXIBLE METAL FILM STRUCTURES

FLEXIBLE PRINTED CIRCUIT BOARD HAVING OVERCURRENT PROTECTION FUNCTION

POLYAMIC ACID, POLYAMIC ACID COMPOSITION, POLYIMIDE, POLYIMIDE FILM...

COMPOSITE BOARD MATERIAL AND FLEXIBLE PRINTED CIRCUIT

PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RE...

PHOTOIMAGABLE DIELECTRICS

PROTECTION TAPE FOR PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUD...

RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AN...

Flexible printed circuit

Flexible printed circuit

BISMALEIMIDE COMPOSITION, CURED PRODUCT, SHEET, LAMINATED BODY, AND...

Method for preparing novel material layer structure of circuit boar...

POLYIMIDE RESIN PRECURSOR, POLYIMIDE RESIN, METAL-CLAD LAMINATED BO...

Interconnect Circuit Methods And Devices

SEMICONDUCTOR STORAGE DEVICE INCLUDING STAGGERED SEMICONDUCTOR MEMO...

PRINTED WIRING BOARD

PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RE...

DISPLAY PANEL AND DISPLAY DEVICE INCLUDING THE SAME

METHOD FOR PRODUCING POLYIMIDE RESIN POWDER

LOW-DIELECTRIC BOARD MATERIAL

RESIN COMPOSITION, CURED OBJECT, RESIN SHEET, PREPREG, METAL-CLAD L...

RESIN COMPOSITION, RESIN SHEET, MULTILAYERED PRINTED WIRING BOARD,...

FLEXIBLE PRINTED BOARD AND FLEXIBLE PRINTED BOARD CONNECTION STRUCTURE

Neurotrophic Electrode Array

SUBSTRATE STRUCTURE CONNECTED ON BASIS OF SOLDER BALL AND ELASTIC BODY

TECHNOLOGIES FOR A FLEXIBLE 3D POWER PLANE IN A CHASSIS

POLYIMIDE RESIN COMPOSITION AND METAL BASE SUBSTRATE

METHOD FOR PRODUCING LAYERED BODY, LAYERED BODY, AND MULTILAYERED BODY