Polymers

Industry

CPC
H01L2924/364

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/364Polymers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Display apparatus
- Patent number 11,705,546
- Issue date Jul 18, 2023
- Samsung Display Co., Ltd.
- Junhee Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 11,605,601
- Issue date Mar 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting die
- Patent number 11,069,651
- Issue date Jul 20, 2021
- Shinkawa Ltd.
- Osamu Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 10,985,116
- Issue date Apr 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for improved delamination characteristics in a...
- Patent number 10,763,130
- Issue date Sep 1, 2020
- Microchip Technology Incorporated
- Taweesak Laevohan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconducter device with filler to suppress generation of air bubb...
- Patent number 10,727,145
- Issue date Jul 28, 2020
- Mitsubishi Electric Corporation
- Hiroyuki Harada
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
A-staged thermoplastic-polyimide (TPI) adhesive compound and method...
- Patent number 10,550,299
- Issue date Feb 4, 2020
- FRAIVILLIG TECHNOGIES COMPANY
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
A-staged thermoplastic-polyimide (TPI) adhesive compound containing...
- Patent number 10,435,603
- Issue date Oct 8, 2019
- Fravillig Technologies Company
- James B. Fraivillig
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,340,237
- Issue date Jul 2, 2019
- Kokusai Electric Corporation
- Hideharu Itatani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device manufacturing method and underfill film
- Patent number 10,280,347
- Issue date May 7, 2019
- Dexerials Corporation
- Kenji Kubota
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,147,691
- Issue date Dec 4, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding interface layer
- Patent number 10,079,471
- Issue date Sep 18, 2018
- Hewlett Packard Enterprise Development LP
- Xue Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component support and semiconductor device
- Patent number 10,068,821
- Issue date Sep 4, 2018
- Nichia Corporation
- Takeaki Shirase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
A-staged thermoplastic-polyimide (TPI) adhesive compound and method...
- Patent number 10,035,936
- Issue date Jul 31, 2018
- James B. Fraivillig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the semiconductor...
- Patent number 9,793,228
- Issue date Oct 17, 2017
- RENESAS ELECTRONICS CORPORATION
- Akira Yajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for packaging integrated circuits
- Patent number 9,748,197
- Issue date Aug 29, 2017
- Altera Corporation
- Loon Kwang Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized sealing of interconnect structures in small gaps
- Patent number 9,685,420
- Issue date Jun 20, 2017
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having semiconductor chip affixed to substrate...
- Patent number 9,524,949
- Issue date Dec 20, 2016
- Dexerials Corporation
- Kazunori Hamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package with conductive clip
- Patent number 9,118,126
- Issue date Aug 25, 2015
- International Rectifier Corporation
- Hsueh-Rong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isocyanurate compound for forming organic anti-reflective layer and...
- Patent number 9,063,424
- Issue date Jun 23, 2015
- Dongjin Semichem Co., Ltd.
- Hyo-Jung Roh
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Semiconductor package having gap-filler injection-friendly structure
- Patent number 8,946,909
- Issue date Feb 3, 2015
- Samsung Electronics Co., Ltd.
- Yun-rae Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package manufacturing method
- Patent number 8,936,968
- Issue date Jan 20, 2015
- Ableprint Technology Co., Ltd.
- Horng Chih Horng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,574,963
- Issue date Nov 5, 2013
- Renesas Electronics Corporation
- Hiroshi Kuroda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing chip elements equipped with wire insertion gro...
- Patent number 8,445,328
- Issue date May 21, 2013
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IGBT power semiconductor package having a conductive clip
- Patent number 8,354,733
- Issue date Jan 15, 2013
- International Rectifier Corporation
- Hsueh-Rong Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE WITH SOLDER MASK
- Publication number 20240170438
- Publication date May 23, 2024
- NXP USA, Inc.
- Aznita Abdul Aziz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION
- Publication number 20240038649
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ting KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION, MULTILAYER BODY AND METHOD FOR PRODUCING MULTILAYER BODY
- Publication number 20230275057
- Publication date Aug 31, 2023
- Mitsui Chemicals, Inc.
- Yuzo NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230197639
- Publication date Jun 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20210242140
- Publication date Aug 5, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MOUNTING DIE
- Publication number 20200321311
- Publication date Oct 8, 2020
- SHINKAWA LTD.
- Osamu WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20200294937
- Publication date Sep 17, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRIC POWER CONVERTER
- Publication number 20190206751
- Publication date Jul 4, 2019
- MITSUBISHI ELECTRIC CORPORATION
- Hiroyuki HARADA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190081014
- Publication date Mar 14, 2019
- Hitachi Kokusai Electric Inc.
- Hideharu ITATANI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound Containing...
- Publication number 20190048238
- Publication date Feb 14, 2019
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound and Method...
- Publication number 20180346777
- Publication date Dec 6, 2018
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND UNDERFILL FILM
- Publication number 20180079939
- Publication date Mar 22, 2018
- DEXERIALS CORPORATION
- Kenji KUBOTA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
BONDING INTERFACE LAYER
- Publication number 20180013260
- Publication date Jan 11, 2018
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Xue Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20180005967
- Publication date Jan 4, 2018
- RENESAS ELECTRONICS CORPORATION
- Akira YAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERLAYER FILLER COMPOSITION FOR SEMICONDUCTOR DEVICE AND METHOD F...
- Publication number 20170287866
- Publication date Oct 5, 2017
- MITSUBISHI CHEMICAL CORPORATION
- Makoto IKEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170250149
- Publication date Aug 31, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- JIE CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR PROCESSING A SUBSTRATE
- Publication number 20170200695
- Publication date Jul 13, 2017
- Evatec AG
- Wolfgang Rietzler
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20170062361
- Publication date Mar 2, 2017
- RENESAS ELECTRONICS CORPORATION
- Akira YAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound and Method...
- Publication number 20160333238
- Publication date Nov 17, 2016
- James B. Fraivillig
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHODS FOR PACKAGING INTEGRATED CIRCUITS
- Publication number 20160307868
- Publication date Oct 20, 2016
- Altera Corporation
- Loon Kwang Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160260683
- Publication date Sep 8, 2016
- DEXERIALS CORPORATION
- Kazunori HAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Localized sealing of interconnect structures in small gaps
- Publication number 20160247778
- Publication date Aug 25, 2016
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A MICRO-FABRICATED WAFER LEVEL INTEGRATED I...
- Publication number 20150340422
- Publication date Nov 26, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Dok Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140197549
- Publication date Jul 17, 2014
- Samsung Electronics Co., Ltd.
- Seok-Won JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT SUPPORT AND SEMICONDUCTOR DEVICE
- Publication number 20140021595
- Publication date Jan 23, 2014
- Takeaki SHIRASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20130157415
- Publication date Jun 20, 2013
- Nitto Denko Corporation
- Kosuke Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Package with Conductive Clip
- Publication number 20130140602
- Publication date Jun 6, 2013
- International Rectifier Corporation
- Hsueh-Rong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE MANUFACTURING METHOD
- Publication number 20130065362
- Publication date Mar 14, 2013
- ABLEPRINT TECHNOLOGY CO., LTD.
- HORNG CHIH HORNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IGBT Power Semiconductor Package Having a Conductive Clip
- Publication number 20120223415
- Publication date Sep 6, 2012
- INTERNATIONAL RECTIFIER CORPORATION
- Hsueh-Rong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOCYANURATE COMPOUND FOR FORMING ORGANIC ANTI-REFLECTIVE LAYER AND...
- Publication number 20120164338
- Publication date Jun 28, 2012
- DONGJIN SEMICHEM CO., LTD.
- Hyo-Jung Roh
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display apparatus

Semiconductor package and method of forming the same

Method of mounting die

Semiconductor package and method of forming the same

Systems and methods for improved delamination characteristics in a...

Semiconducter device with filler to suppress generation of air bubb...

A-staged thermoplastic-polyimide (TPI) adhesive compound and method...

A-staged thermoplastic-polyimide (TPI) adhesive compound containing...

Method of manufacturing semiconductor device

Semiconductor device manufacturing method and underfill film

Semiconductor structure and manufacturing method thereof

Bonding interface layer

Semiconductor component support and semiconductor device

A-staged thermoplastic-polyimide (TPI) adhesive compound and method...

Semiconductor device and method of manufacturing the semiconductor...

Methods for packaging integrated circuits

Localized sealing of interconnect structures in small gaps

Semiconductor device having semiconductor chip affixed to substrate...

Power semiconductor package with conductive clip

Isocyanurate compound for forming organic anti-reflective layer and...

Semiconductor package having gap-filler injection-friendly structure

Flip chip package manufacturing method

Method of manufacturing semiconductor device

Method for producing chip elements equipped with wire insertion gro...

IGBT power semiconductor package having a conductive clip

Patents Applicationslast 30 patents

PACKAGE WITH SOLDER MASK

SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION

COMPOSITION, MULTILAYER BODY AND METHOD FOR PRODUCING MULTILAYER BODY

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

METHOD OF MOUNTING DIE

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND ELECTRIC POWER CONVERTER

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound Containing...

A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound and Method...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND UNDERFILL FILM

BONDING INTERFACE LAYER

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

INTERLAYER FILLER COMPOSITION FOR SEMICONDUCTOR DEVICE AND METHOD F...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

APPARATUS AND METHOD FOR PROCESSING A SUBSTRATE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound and Method...

METHODS FOR PACKAGING INTEGRATED CIRCUITS

SEMICONDUCTOR DEVICE

Localized sealing of interconnect structures in small gaps

METHOD OF MANUFACTURING A MICRO-FABRICATED WAFER LEVEL INTEGRATED I...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR COMPONENT SUPPORT AND SEMICONDUCTOR DEVICE

METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

Power Semiconductor Package with Conductive Clip

FLIP CHIP PACKAGE MANUFACTURING METHOD

IGBT Power Semiconductor Package Having a Conductive Clip

ISOCYANURATE COMPOUND FOR FORMING ORGANIC ANTI-REFLECTIVE LAYER AND...