Polyolefin polymer

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CPC
H01L2924/061

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/061Polyolefin polymer

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Resin particles, electrically conductive particles, electrically co...
- Patent number 12,122,885
- Issue date Oct 22, 2024
- Sekisui Chemical Co., Ltd.
- Kouki Ookura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material, an integrated circuit formed therewith,...
- Patent number 12,027,442
- Issue date Jul 2, 2024
- ARIECA INC.
- Jeffrey Gelorme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanoscale interconnect array for stacked dies
- Patent number 10,600,761
- Issue date Mar 24, 2020
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive composition and electronic parts using the same
- Patent number 10,541,222
- Issue date Jan 21, 2020
- NAMICS CORPORATION
- Koji Sasaki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Nanoscale interconnect array for stacked dies
- Patent number 10,304,803
- Issue date May 28, 2019
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition for anisotropic conductive film, anisotropic conductive...
- Patent number 10,224,303
- Issue date Mar 5, 2019
- Samsung SDI Co., Ltd.
- Youn Jo Ko
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Module, method for manufacturing the same, and electronic device
- Patent number 10,115,691
- Issue date Oct 30, 2018
- Canon Kabushiki Kaisha
- Ichiro Kataoka
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Molded composite enclosure for integrated circuit assembly
- Patent number 10,056,308
- Issue date Aug 21, 2018
- Intel Corporation
- Paul J. Gwin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dicing die bonding film having excellent burr property and reliabil...
- Patent number 9,695,345
- Issue date Jul 4, 2017
- LG Chem, Ltd.
- Hyun Jee Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded composite enclosure for integrated circuit assembly
- Patent number 9,607,914
- Issue date Mar 28, 2017
- Intel Corporation
- Paul J. Gwin
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...
- Publication number 20240203754
- Publication date Jun 20, 2024
- Arieca Inc.
- Navid Kazem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE INCLUDING SAME
- Publication number 20230290751
- Publication date Sep 14, 2023
- SAMSUNG DISPLAY CO., LTD.
- Joo Nyung JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-DENSIFYING NANO-SILVER PASTE AND A METHOD OF FORMING INTERCONN...
- Publication number 20230230950
- Publication date Jul 20, 2023
- NANO AND ADVANCED MATERIALS INSTITUTE LIMITED
- Yuechen WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN PARTICLES, ELECTRICALLY CONDUCTIVE PARTICLES, ELECTRICALLY CO...
- Publication number 20230106977
- Publication date Apr 6, 2023
- Sekisui Chemical Co., Ltd
- Kouki OOKURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TERMINAL AND CONNECTION METHOD
- Publication number 20230075929
- Publication date Mar 9, 2023
- SONY GROUP CORPORATION
- JO UMEZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSCALE INTERCONNECT ARRAY FOR STACKED DIES
- Publication number 20190237437
- Publication date Aug 1, 2019
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE
- Publication number 20170330852
- Publication date Nov 16, 2017
- Canon Kabushiki Kaisha
- Ichiro Kataoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nanoscale Interconnect Array for Stacked Dies
- Publication number 20170323867
- Publication date Nov 9, 2017
- Invensas Corporatoin
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE COMPOSITION AND ELECTRONIC PARTS USING THE SAME
- Publication number 20170243849
- Publication date Aug 24, 2017
- NAMICS CORPORATION
- Koji SASAKI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MOLDED COMPOSITE ENCLOSURE FOR INTEGRATED CIRCUIT ASSEMBLY
- Publication number 20170170085
- Publication date Jun 15, 2017
- Intel Corporation
- Paul J. Gwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR ANISOTROPIC CONDUCTIVE FILM, ANISOTROPIC CONDUCTIVE...
- Publication number 20170162531
- Publication date Jun 8, 2017
- Samsung SDI Co., Ltd.
- Youn Jo KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED COMPOSITE ENCLOSURE FOR INTEGRATED CIRCUIT ASSEMBLY
- Publication number 20160268178
- Publication date Sep 15, 2016
- Paul J. Gwin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
UNDERFILL MATERIAL INCLUDING BLOCK COPOLYMER TO TUNE COEFFICIENT OF...
- Publication number 20160099190
- Publication date Apr 7, 2016
- Intel Corporation
- Sivakumar Nagarajan
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTOR DEVICE
- Publication number 20160075920
- Publication date Mar 17, 2016
- Samsung SDI Co., Ltd.
- Dong Seon UH
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING THROUGH ELECTRODES AND METHODS OF MANU...
- Publication number 20150270220
- Publication date Sep 24, 2015
- SK HYNIX INC.
- Jong Kyu MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTOR DEVICE
- Publication number 20120141786
- Publication date Jun 7, 2012
- Dong Seon UH
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
DICING DIE BONDING FILM HAVING EXCELLENT BURR PROPERTY AND RELIABIL...
- Publication number 20110037180
- Publication date Feb 17, 2011
- LG CHEM, LTD.
- Hyun Jee Yoo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Polyolefin polymer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Resin particles, electrically conductive particles, electrically co...

Thermal interface material, an integrated circuit formed therewith,...

Nanoscale interconnect array for stacked dies

Conductive composition and electronic parts using the same

Nanoscale interconnect array for stacked dies

Composition for anisotropic conductive film, anisotropic conductive...

Module, method for manufacturing the same, and electronic device

Molded composite enclosure for integrated circuit assembly

Dicing die bonding film having excellent burr property and reliabil...

Molded composite enclosure for integrated circuit assembly

Patents Applicationslast 30 patents

METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...

ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE INCLUDING SAME

SELF-DENSIFYING NANO-SILVER PASTE AND A METHOD OF FORMING INTERCONN...

RESIN PARTICLES, ELECTRICALLY CONDUCTIVE PARTICLES, ELECTRICALLY CO...

TERMINAL AND CONNECTION METHOD

NANOSCALE INTERCONNECT ARRAY FOR STACKED DIES

MODULE, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE

Nanoscale Interconnect Array for Stacked Dies

CONDUCTIVE COMPOSITION AND ELECTRONIC PARTS USING THE SAME

MOLDED COMPOSITE ENCLOSURE FOR INTEGRATED CIRCUIT ASSEMBLY

COMPOSITION FOR ANISOTROPIC CONDUCTIVE FILM, ANISOTROPIC CONDUCTIVE...

MOLDED COMPOSITE ENCLOSURE FOR INTEGRATED CIRCUIT ASSEMBLY

UNDERFILL MATERIAL INCLUDING BLOCK COPOLYMER TO TUNE COEFFICIENT OF...

ADHESIVE FILM FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES HAVING THROUGH ELECTRODES AND METHODS OF MANU...

ADHESIVE FILM FOR SEMICONDUCTOR DEVICE

DICING DIE BONDING FILM HAVING EXCELLENT BURR PROPERTY AND RELIABIL...