Polyphenylene

Industry

CPC
H01L2924/067

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/067Polyphenylene

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Resin particles, electrically conductive particles, electrically co...
- Patent number 12,122,885
- Issue date Oct 22, 2024
- Sekisui Chemical Co., Ltd.
- Kouki Ookura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure and manufacturing method therefor
- Patent number 12,100,923
- Issue date Sep 24, 2024
- Resonac Corporation
- Kunihiko Akai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill flow management in electronic assemblies
- Patent number 11,935,861
- Issue date Mar 19, 2024
- Intel Coropration
- Frederick W. Atadana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure
- Patent number 11,791,310
- Issue date Oct 17, 2023
- TONGFU MICROELECTRONICS CO., LTD.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 11,710,731
- Issue date Jul 25, 2023
- Daicel Corporation
- Naoko Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulation resin composition, laminated sheet, cured product, se...
- Patent number 11,674,032
- Issue date Jun 13, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shigeru Yamatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 11,676,956
- Issue date Jun 13, 2023
- Daicel Corporation
- Naoko Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 11,646,304
- Issue date May 9, 2023
- Daicel Corporation
- Naoko Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure and forming method thereof
- Patent number 11,139,267
- Issue date Oct 5, 2021
- TONGFU MICROELECTRONICS CO., LTD.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure and forming method thereof
- Patent number 10,998,289
- Issue date May 4, 2021
- TONGFU MICROELECTRONICS CO., LTD.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with improvement layer and fabrication method the...
- Patent number 10,910,343
- Issue date Feb 2, 2021
- TONGFU MICROELECTRONICS CO., LTD.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive composition and electronic parts using the same
- Patent number 10,541,222
- Issue date Jan 21, 2020
- NAMICS CORPORATION
- Koji Sasaki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Interconnection structure, LED module and method
- Patent number 10,361,178
- Issue date Jul 23, 2019
- Infineon Technologies Austria AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,256,169
- Issue date Apr 9, 2019
- Fuji Electric Co., Ltd.
- Naoyuki Kanai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition for anisotropic conductive film, anisotropic conductive...
- Patent number 10,224,303
- Issue date Mar 5, 2019
- Samsung SDI Co., Ltd.
- Youn Jo Ko
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive resin compostition for bonding semiconductors and adhesive...
- Patent number 9,953,945
- Issue date Apr 24, 2018
- LG Chem, Ltd.
- Hee Jung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional electronic packages utilizing unpatterned adhesiv...
- Patent number 9,576,889
- Issue date Feb 21, 2017
- Research Triangle Institute
- Erik Paul Vick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV structures and methods for forming the same
- Patent number 9,373,575
- Issue date Jun 21, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV structures and methods for forming the same
- Patent number 8,956,966
- Issue date Feb 17, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV structures and methods for forming the same
- Patent number 8,803,316
- Issue date Aug 12, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240421095
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL INCLUDING A MULTI-LAYER STRUCTURE AND ME...
- Publication number 20240371722
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Chien Pan
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...
- Publication number 20240203754
- Publication date Jun 20, 2024
- Arieca Inc.
- Navid Kazem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Semiconductor Package w...
- Publication number 20240194629
- Publication date Jun 13, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240162184
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Sang-Sick Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN PARTICLES, ELECTRICALLY CONDUCTIVE PARTICLES, ELECTRICALLY CO...
- Publication number 20230106977
- Publication date Apr 6, 2023
- Sekisui Chemical Co., Ltd
- Kouki OOKURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230060577
- Publication date Mar 2, 2023
- Showa Denko Materials Co., Ltd.
- Kunihiko AKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT INSULATING INTERCONNECT FEATURES IN A COMPONENT OF A COMPOSITE...
- Publication number 20220415853
- Publication date Dec 29, 2022
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATION MATERIAL, LAMINATED SHEET, CURED PRODUCT, SEMICONDUCT...
- Publication number 20220115285
- Publication date Apr 14, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- Kazunari TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE
- Publication number 20210391300
- Publication date Dec 16, 2021
- TONGFU MICROELECTRONICS CO., LTD.
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20210384183
- Publication date Dec 9, 2021
- DAICEL CORPORATION
- Naoko TSUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL FLOW MANAGEMENT IN ELECTRONIC ASSEMBLIES
- Publication number 20210343677
- Publication date Nov 4, 2021
- Intel Corporation
- Frederick W. Atadana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURES
- Publication number 20210233890
- Publication date Jul 29, 2021
- TONGFU MICROELECTRONICS CO., LTD.
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATION RESIN COMPOSITION, LAMINATED SHEET, CURED PRODUCT, SE...
- Publication number 20200377715
- Publication date Dec 3, 2020
- Panasonic Intellectual Property Management Co., Ltd.
- Shigeru YAMATSU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PACKAGING STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20200027857
- Publication date Jan 23, 2020
- TONGFU MICROELECTRONICS CO., LTD.
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20200027858
- Publication date Jan 23, 2020
- TONGFU MICROELECTRONICS CO., LTD.
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20200027859
- Publication date Jan 23, 2020
- TONGFU MICROELECTRONICS CO., LTD.
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170278771
- Publication date Sep 28, 2017
- Fuji Electric Co., Ltd.
- Naoyuki Kanai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE COMPOSITION AND ELECTRONIC PARTS USING THE SAME
- Publication number 20170243849
- Publication date Aug 24, 2017
- NAMICS CORPORATION
- Koji SASAKI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
COMPOSITION FOR ANISOTROPIC CONDUCTIVE FILM, ANISOTROPIC CONDUCTIVE...
- Publication number 20170162531
- Publication date Jun 8, 2017
- Samsung SDI Co., Ltd.
- Youn Jo KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FOR SEMICONDUCTOR BACK SURFACE AND ITS USE
- Publication number 20160351432
- Publication date Dec 1, 2016
- Nitto Denko Corporation
- Naohide TAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE RESIN COMPOSITION FOR BONDING SEMICONDUCTORS AND ADHESIVE...
- Publication number 20160336290
- Publication date Nov 17, 2016
- LG CHEM, LTD.
- Hee Jung KIM
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE ARRAY, AND IMAGE FORMATI...
- Publication number 20160293816
- Publication date Oct 6, 2016
- Oki Data Corporation
- Taishi KANETO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Methods Utilizing Anisotropic Conductive Adhesives
- Publication number 20160254244
- Publication date Sep 1, 2016
- SunRay Scientific, LLC
- S. Kumar Khanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR FAN-OUT WAFER LEVEL PACKAGING
- Publication number 20160190028
- Publication date Jun 30, 2016
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- LEI SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL MATERIAL INCLUDING BLOCK COPOLYMER TO TUNE COEFFICIENT OF...
- Publication number 20160099190
- Publication date Apr 7, 2016
- Intel Corporation
- Sivakumar Nagarajan
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTOR DEVICE
- Publication number 20160075920
- Publication date Mar 17, 2016
- Samsung SDI Co., Ltd.
- Dong Seon UH
- B32 - LAYERED PRODUCTS
Information Patent Application
THREE-DIMENSIONAL ELECTRONIC PACKAGES UTILIZING UNPATTERNED ADHESIV...
- Publication number 20150187691
- Publication date Jul 2, 2015
- Research Triangle Institute
- Eric Paul Vick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV Structures and Methods for Forming the Same
- Publication number 20140342547
- Publication date Nov 20, 2014
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV Structures and Methods for Forming the Same
- Publication number 20130140690
- Publication date Jun 6, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS

Polyphenylene

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Resin particles, electrically conductive particles, electrically co...

Connection structure and manufacturing method therefor

Underfill flow management in electronic assemblies

Semiconductor packaging structure

Semiconductor device manufacturing method

Encapsulation resin composition, laminated sheet, cured product, se...

Semiconductor device manufacturing method

Semiconductor device manufacturing method

Packaging structure and forming method thereof

Packaging structure and forming method thereof

Package structure with improvement layer and fabrication method the...

Conductive composition and electronic parts using the same

Interconnection structure, LED module and method

Semiconductor device

Composition for anisotropic conductive film, anisotropic conductive...

Adhesive resin compostition for bonding semiconductors and adhesive...

Three-dimensional electronic packages utilizing unpatterned adhesiv...

TSV structures and methods for forming the same

TSV structures and methods for forming the same

TSV structures and methods for forming the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

THERMAL INTERFACE MATERIAL INCLUDING A MULTI-LAYER STRUCTURE AND ME...

METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...

Semiconductor Device and Method of Making a Semiconductor Package w...

SEMICONDUCTOR PACKAGE

RESIN PARTICLES, ELECTRICALLY CONDUCTIVE PARTICLES, ELECTRICALLY CO...

CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR

HEAT INSULATING INTERCONNECT FEATURES IN A COMPONENT OF A COMPOSITE...

ENCAPSULATION MATERIAL, LAMINATED SHEET, CURED PRODUCT, SEMICONDUCT...

SEMICONDUCTOR PACKAGING STRUCTURE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

UNDERFILL FLOW MANAGEMENT IN ELECTRONIC ASSEMBLIES

PACKAGING STRUCTURES

ENCAPSULATION RESIN COMPOSITION, LAMINATED SHEET, CURED PRODUCT, SE...

PACKAGING STRUCTURE AND FORMING METHOD THEREOF

PACKAGING STRUCTURE AND FORMING METHOD THEREOF

PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR DEVICE

CONDUCTIVE COMPOSITION AND ELECTRONIC PARTS USING THE SAME

COMPOSITION FOR ANISOTROPIC CONDUCTIVE FILM, ANISOTROPIC CONDUCTIVE...

FILM FOR SEMICONDUCTOR BACK SURFACE AND ITS USE

ADHESIVE RESIN COMPOSITION FOR BONDING SEMICONDUCTORS AND ADHESIVE...

SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE ARRAY, AND IMAGE FORMATI...

Systems and Methods Utilizing Anisotropic Conductive Adhesives

METHOD AND STRUCTURE FOR FAN-OUT WAFER LEVEL PACKAGING

UNDERFILL MATERIAL INCLUDING BLOCK COPOLYMER TO TUNE COEFFICIENT OF...

ADHESIVE FILM FOR SEMICONDUCTOR DEVICE

THREE-DIMENSIONAL ELECTRONIC PACKAGES UTILIZING UNPATTERNED ADHESIV...

TSV Structures and Methods for Forming the Same

TSV Structures and Methods for Forming the Same