Position monitoring

Industry

CPC
H01L21/67259

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/67259Position monitoring

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Loader device and substrate transport system
- Patent number 12,365,095
- Issue date Jul 22, 2025
- Samsung Electronics Co., Ltd.
- Hyun Jae Kang
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Wafer processing apparatus
- Patent number 12,368,065
- Issue date Jul 22, 2025
- Samsung Electronics Co., Ltd.
- Seungbeom Park
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Computer-readable recording medium, substrate bonding system, and s...
- Patent number 12,362,212
- Issue date Jul 15, 2025
- Tokyo Electron Limited
- Keiichi Saiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixture and method for determining position of a target in a reacti...
- Patent number 12,354,893
- Issue date Jul 8, 2025
- ASM IP Holding B.V.
- Siyao Luan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Resin shaping device
- Patent number 12,341,036
- Issue date Jun 24, 2025
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Estimation of chamber component conditions using substrate measurem...
- Patent number 12,339,645
- Issue date Jun 24, 2025
- Applied Materials, Inc.
- Chunlei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated adaptive positioning systems and routines for automated...
- Patent number 12,341,040
- Issue date Jun 24, 2025
- Lam Research Corporation
- Hossein Sadeghi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for inspecting wafer carriers
- Patent number 12,334,373
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Kang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Determining the center position of a semiconductor wafer
- Patent number 12,330,289
- Issue date Jun 17, 2025
- WaferPath, Inc.
- Frantisek Pavlik
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Die bonding apparatus and manufacturing method for semiconductor ap...
- Patent number 12,327,739
- Issue date Jun 10, 2025
- FASFORD TECHNOLOGY CO., LTD.
- Hideharu Kobashi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Substrate processing system and substrate processing method
- Patent number 12,327,768
- Issue date Jun 10, 2025
- Tokyo Electron Limited
- Hayato Tanoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for adjusting chip mounting position, apparatus, medium, and...
- Patent number 12,327,740
- Issue date Jun 10, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Hailin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for automated wafer carrier handling
- Patent number 12,322,628
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ren-Hau Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing substrate, substrate processing apparatus, met...
- Patent number 12,320,778
- Issue date Jun 3, 2025
- Kokusai Electric Corporation
- Teruo Yoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer apparatus and transfer method
- Patent number 12,322,629
- Issue date Jun 3, 2025
- Tokyo Electron Limited
- Tomonori Horiuchi
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Displacement measurements in semiconductor wafer processing
- Patent number 12,322,662
- Issue date Jun 3, 2025
- Applied Materials, Inc.
- Justin Wong
- B24 - GRINDING POLISHING
Information Patent Grant
Plasma processing apparatus, and method and program for controlling...
- Patent number 12,315,704
- Issue date May 27, 2025
- Tokyo Electron Limited
- Yusuke Saitoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing device and wafer conveying method
- Patent number 12,308,277
- Issue date May 20, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Hui Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing display device and apparatus for manufactu...
- Patent number 12,308,259
- Issue date May 20, 2025
- Samsung Display Co., Ltd.
- Dong Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and method for correcting movement amount of bond...
- Patent number 12,308,273
- Issue date May 20, 2025
- Shinkawa Ltd.
- Makoto Takahashi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Substrate processing system
- Patent number 12,300,524
- Issue date May 13, 2025
- Tokyo Electron Limited
- Yoshifumi Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for processing a substrate
- Patent number 12,288,704
- Issue date Apr 29, 2025
- Applied Materials, Inc.
- Ralph P. Antonio
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Substrate processing apparatus, method of manufacturing semiconduct...
- Patent number 12,283,501
- Issue date Apr 22, 2025
- Kokusai Electric Corporation
- Takayuki Ota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate measurement subsystem
- Patent number 12,283,503
- Issue date Apr 22, 2025
- Applied Materials, Inc.
- Upendra V. Ummethala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for controlling overhead hoist transfer vehicle
- Patent number 12,280,961
- Issue date Apr 22, 2025
- Semes Co., Ltd.
- Jun Beom Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment fixture for a reactor system
- Patent number 12,278,129
- Issue date Apr 15, 2025
- ASM IP Holding B.V.
- Surojit Ganguli
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Positioning method
- Patent number 12,272,102
- Issue date Apr 8, 2025
- Disco Corporation
- Yoshimasa Kojima
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus, system and method for providing a fiber optic coupler
- Patent number 12,272,587
- Issue date Apr 8, 2025
- JABIL INC.
- Jeroen Bosboom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced footprint wafer handling platform
- Patent number 12,272,583
- Issue date Apr 8, 2025
- Lam Research Corporation
- Christopher W. Burkhart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus with circuit-locating mechanism
- Patent number 12,266,411
- Issue date Apr 1, 2025
- Micron Technology, Inc.
- Itamar Lavy
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
APPARTUS FOR DETECTING POSITION OF WAFER AND OPERATING METHOD THEREOF
- Publication number 20250233006
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Kyungrim Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING SYSTEM AND PROCESSING METHOD
- Publication number 20250232967
- Publication date Jul 17, 2025
- TOKYO ELECTRON LIMITED
- Norihiko AMIKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD
- Publication number 20250233004
- Publication date Jul 17, 2025
- Canon Kabushiki Kaisha
- MASAHIRO KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE LIFT ASSEMBLY, SYSTEM INCLUDING THE ASSEMBLY, AND METHODS...
- Publication number 20250233007
- Publication date Jul 17, 2025
- ASM IP HOLDING B.V.
- Tilakraj Durgadahalli Shankaregowda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING DISPLAY DEVICE AND APPARATUS FOR MANUFACTU...
- Publication number 20250226243
- Publication date Jul 10, 2025
- SAMSUNG DISPLAY CO., LTD.
- Dong Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE MEASUREMENT SUBSYSTEM
- Publication number 20250218829
- Publication date Jul 3, 2025
- Applied Materials, Inc.
- Upendra V. Ummethala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR DETECTING SUBSTRATE STATE
- Publication number 20250218840
- Publication date Jul 3, 2025
- SEMES CO., LTD.
- Jae Won SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDING DEVICE, SEMICONDUCTOR CHIP MANUFACTURING METHOD, AND SEMI...
- Publication number 20250218872
- Publication date Jul 3, 2025
- YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Yoshikuni SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS
- Publication number 20250218817
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Eunyoung Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONCURRENT SEMICONDUCTOR PROCESSING AND INSPECTION
- Publication number 20250218828
- Publication date Jul 3, 2025
- DR Laser Singapore Pte Ltd.
- Chi Hang KWOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING CHIPS AND A SYSTEM FOR PERFORMING THE METHOD
- Publication number 20250219015
- Publication date Jul 3, 2025
- Canon Kabushiki Kaisha
- Nilabh K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR DISAGGREGATION OF SEMICONDUCTOR DIES IN A...
- Publication number 20250210402
- Publication date Jun 26, 2025
- Intel Corporation
- Marek Patyra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS WITH CIRCUIT-LOCATING MECHANISM
- Publication number 20250201331
- Publication date Jun 19, 2025
- Micron Technology, Inc.
- Itamar Lavy
- G11 - INFORMATION STORAGE
Information Patent Application
ANNEALING APPARATUS AND METHOD THEREOF
- Publication number 20250201604
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Chang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD OF VERIFYING WORKPIECE ALIGNMENT
- Publication number 20250191944
- Publication date Jun 12, 2025
- Axcelis Technologies, Inc.
- Yusef Nouri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING DEVICE, SEMICONDUCTOR CHIP MANUFACTURING METHOD, AND SEMICON...
- Publication number 20250174473
- Publication date May 29, 2025
- YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Yoshikuni SUZUKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE TRANSFER METHOD AND SEMICONDUCTOR MANUFACTURING SYSTEM
- Publication number 20250174478
- Publication date May 29, 2025
- TOKYO ELECTRON LIMITED
- Ryota GOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die-Level Parametric Prediction Boosting Method and System for Impr...
- Publication number 20250174497
- Publication date May 29, 2025
- MEDIATEK INC.
- Chin-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transfer Module, and Substrate Transfer Method in Semiconductor Man...
- Publication number 20250174476
- Publication date May 29, 2025
- TOKYO ELECTRON LIMITED
- Dongwei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die-Level Parametric Prediction Boosting Method and Die-Level Param...
- Publication number 20250174498
- Publication date May 29, 2025
- MEDIATEK INC.
- Chin-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET ALIGNMENT AND REPAIR IN MICRO DEVICE TRANSFER
- Publication number 20250167033
- Publication date May 22, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POSITION RECONSTRUCTION OF SEMICONDUCTOR COMPONENTS ON A WAFER
- Publication number 20250167052
- Publication date May 22, 2025
- ROBERT BOSCH GmbH
- Eric Sebastian Schmidt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET ALIGNMENT AND REPAIR IN MICRO DEVICE TRANSFER
- Publication number 20250167032
- Publication date May 22, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND DETECTING METHOD OF TRAY TILTING
- Publication number 20250167038
- Publication date May 22, 2025
- TES CO., LTD.
- Jin-Hyung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAGE MOTION PROFILE SYSTEM AND METHOD
- Publication number 20250157850
- Publication date May 15, 2025
- KLA Corporation
- Zhaolong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING SYSTEM WITH CAPABILITIES FOR DETECTING WHETHER...
- Publication number 20250140540
- Publication date May 1, 2025
- ASM IP HOLDING B.V.
- Sergei Golovkov
- G01 - MEASURING TESTING
Information Patent Application
INFORMATION PROCESSING APPARATUS, PATTERN FORMING APPARATUS, INFORM...
- Publication number 20250138427
- Publication date May 1, 2025
- Canon Kabushiki Kaisha
- JUNYA TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFORMATION PROCESSING APPARATUS, INFERENCE APPARATUS, MACHINE-LEAR...
- Publication number 20250125172
- Publication date Apr 17, 2025
- EBARA CORPORATION
- Mitsuru MIYAZAKI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Calibration Method and Substrate Processing System
- Publication number 20250125173
- Publication date Apr 17, 2025
- TOKYO ELECTRON LIMITED
- Toshiaki KODAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TRANSFERRING TARGET OBJECT TO TARGET SUBSTRATE
- Publication number 20250125178
- Publication date Apr 17, 2025
- Innolux Corporation
- Chen-Lin Yeh
- H01 - BASIC ELECTRIC ELEMENTS

Position monitoring

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Loader device and substrate transport system

Wafer processing apparatus

Computer-readable recording medium, substrate bonding system, and s...

Fixture and method for determining position of a target in a reacti...

Resin shaping device

Estimation of chamber component conditions using substrate measurem...

Integrated adaptive positioning systems and routines for automated...

Apparatus and method for inspecting wafer carriers

Determining the center position of a semiconductor wafer

Die bonding apparatus and manufacturing method for semiconductor ap...

Substrate processing system and substrate processing method

Method for adjusting chip mounting position, apparatus, medium, and...

Apparatus and method for automated wafer carrier handling

Method of processing substrate, substrate processing apparatus, met...

Transfer apparatus and transfer method

Displacement measurements in semiconductor wafer processing

Plasma processing apparatus, and method and program for controlling...

Wafer processing device and wafer conveying method

Method for manufacturing display device and apparatus for manufactu...

Bonding apparatus and method for correcting movement amount of bond...

Substrate processing system

Methods and apparatus for processing a substrate

Substrate processing apparatus, method of manufacturing semiconduct...

Substrate measurement subsystem

Method and device for controlling overhead hoist transfer vehicle

Alignment fixture for a reactor system

Positioning method

Apparatus, system and method for providing a fiber optic coupler

Reduced footprint wafer handling platform

Apparatus with circuit-locating mechanism

Patents Applicationslast 30 patents

APPARTUS FOR DETECTING POSITION OF WAFER AND OPERATING METHOD THEREOF

PROCESSING SYSTEM AND PROCESSING METHOD

BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD

SUBSTRATE LIFT ASSEMBLY, SYSTEM INCLUDING THE ASSEMBLY, AND METHODS...

METHOD FOR MANUFACTURING DISPLAY DEVICE AND APPARATUS FOR MANUFACTU...

SUBSTRATE MEASUREMENT SUBSYSTEM

APPARATUS AND METHOD FOR DETECTING SUBSTRATE STATE

EXPANDING DEVICE, SEMICONDUCTOR CHIP MANUFACTURING METHOD, AND SEMI...

SUBSTRATE BONDING APPARATUS

CONCURRENT SEMICONDUCTOR PROCESSING AND INSPECTION

METHOD OF BONDING CHIPS AND A SYSTEM FOR PERFORMING THE METHOD

METHODS AND APPARATUS FOR DISAGGREGATION OF SEMICONDUCTOR DIES IN A...

APPARATUS WITH CIRCUIT-LOCATING MECHANISM

ANNEALING APPARATUS AND METHOD THEREOF

SYSTEM AND METHOD OF VERIFYING WORKPIECE ALIGNMENT

DICING DEVICE, SEMICONDUCTOR CHIP MANUFACTURING METHOD, AND SEMICON...

SUBSTRATE TRANSFER METHOD AND SEMICONDUCTOR MANUFACTURING SYSTEM

Die-Level Parametric Prediction Boosting Method and System for Impr...

Transfer Module, and Substrate Transfer Method in Semiconductor Man...

Die-Level Parametric Prediction Boosting Method and Die-Level Param...

OFFSET ALIGNMENT AND REPAIR IN MICRO DEVICE TRANSFER

POSITION RECONSTRUCTION OF SEMICONDUCTOR COMPONENTS ON A WAFER

OFFSET ALIGNMENT AND REPAIR IN MICRO DEVICE TRANSFER

SUBSTRATE PROCESSING APPARATUS AND DETECTING METHOD OF TRAY TILTING

STAGE MOTION PROFILE SYSTEM AND METHOD

SUBSTRATE PROCESSING SYSTEM WITH CAPABILITIES FOR DETECTING WHETHER...

INFORMATION PROCESSING APPARATUS, PATTERN FORMING APPARATUS, INFORM...

INFORMATION PROCESSING APPARATUS, INFERENCE APPARATUS, MACHINE-LEAR...

Calibration Method and Substrate Processing System

METHOD OF TRANSFERRING TARGET OBJECT TO TARGET SUBSTRATE