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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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H01L21/67259
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Patents Grants
last 30 patents
Information
Patent Grant
Methods and systems of image based robot alignment
Patent number
12,211,718
Issue date
Jan 28, 2025
GlobalWafers Co., Ltd.
TaeHyeong Kim
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Component conveying instrument with an adjusting unit and method of...
Patent number
12,211,721
Issue date
Jan 28, 2025
Muehlbauer GmbH & Co. KG
Rainer Miehlich
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Metal-oxide-metal (MOM) capacitors for integrated circuit monitoring
Patent number
12,205,885
Issue date
Jan 21, 2025
Microchip Technology Incorporated
Yaojian Leng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Vision-based wafer pre-alignment platform and alignment method
Patent number
12,205,325
Issue date
Jan 21, 2025
WUXI XIVI SCIENCE AND TECHNOLOGY CO., LTD.
Minjie Lu
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Bonding system
Patent number
12,198,963
Issue date
Jan 14, 2025
Tokyo Electron Limited
Yoshitaka Otsuka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Execution device and execution method
Patent number
12,198,954
Issue date
Jan 14, 2025
Tokyo Electron Limited
Kippei Sugita
G01 - MEASURING TESTING
Information
Patent Grant
Substrate holding hand and substrate transferring robot
Patent number
12,195,285
Issue date
Jan 14, 2025
Kawasaki Jukogyo Kabushiki Kaisha
Satoshi Yamada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate transfer method and substrate transfer system
Patent number
12,198,955
Issue date
Jan 14, 2025
Tokyo Electron Limited
Wataru Matsumoto
B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information
Patent Grant
Wire tension adjustment method and wire tension adjuster
Patent number
12,191,173
Issue date
Jan 7, 2025
Shinkawa Ltd.
Toshihiko Toyama
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Storage system, query system and storage method for reticles, and c...
Patent number
12,191,177
Issue date
Jan 7, 2025
CHANGXIN MEMORY TECHNOLOGIES, INC.
Xueyu Liang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate transfer apparatus, substrate transfer method, and substr...
Patent number
12,183,612
Issue date
Dec 31, 2024
Tokyo Electron Limited
Tatsuo Hatano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Tin oxide mandrels in patterning
Patent number
12,183,589
Issue date
Dec 31, 2024
Lam Research Corporation
Jengyi Yu
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Cover tape for packing electronic component, package, and package set
Patent number
12,172,412
Issue date
Dec 24, 2024
Dai Nippon Printing Co., Ltd.
Ayuro Murata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Installation fixture for needle and installation method for needle
Patent number
12,176,235
Issue date
Dec 24, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Fencheng Zheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Systems and methods for correction of impact of wafer tilt on misre...
Patent number
12,170,215
Issue date
Dec 17, 2024
KLA Corporation
Vladimir Levinski
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate bonding apparatus and substrate bonding method
Patent number
12,165,902
Issue date
Dec 10, 2024
Nikon Corporation
Hajime Mitsuishi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus and methods for handling semiconductor part carriers
Patent number
12,165,906
Issue date
Dec 10, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Ren-Hau Wu
B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information
Patent Grant
Control device, system and control method
Patent number
12,165,892
Issue date
Dec 10, 2024
Tokyo Electron Limited
Yuichi Takenaga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Transfer detection method and substrate processing apparatus
Patent number
12,159,798
Issue date
Dec 3, 2024
Tokyo Electron Limited
Akira Takahashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate-floatation-type laser processing apparatus and method for...
Patent number
12,154,803
Issue date
Nov 26, 2024
JSW AKTINA SYSTEM CO., LTD.
Daisuke Hayashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for monitoring, determining the position of, and positioning...
Patent number
12,154,802
Issue date
Nov 26, 2024
VAT Holding AG
Alejandro Marzinotto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire tension adjustment method and wire tension adjuster
Patent number
12,154,801
Issue date
Nov 26, 2024
Shinkawa Ltd.
Toshihiko Toyama
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Abnormality detection system
Patent number
12,148,638
Issue date
Nov 19, 2024
Denso Corporation
Satoshi Kojima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor element, semiconductor element group, and method of m...
Patent number
12,148,662
Issue date
Nov 19, 2024
Rohm Co., Ltd.
Satoshi Nakagawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for use in wafer processing
Patent number
12,148,640
Issue date
Nov 19, 2024
Infineon Technologies AG
Thomas Fischer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate processing apparatus and substrate processing method
Patent number
12,142,496
Issue date
Nov 12, 2024
Tokyo Electron Limited
Yoshifumi Amano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device manufacturing method and semiconductor device...
Patent number
12,136,569
Issue date
Nov 5, 2024
FILNEX INC.
Mitsuhiko Ogihara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and system for chemical mechanical polishing process
Patent number
12,131,897
Issue date
Oct 29, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-I Peng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Carrier device
Patent number
12,131,941
Issue date
Oct 29, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Lei Zhao
B08 - CLEANING
Information
Patent Grant
Substrate mapping device, method of mapping by the device, and meth...
Patent number
12,131,925
Issue date
Oct 29, 2024
Kawasaki Jukogyo Kabushiki Kaisha
Masaya Yoshida
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
High Throughput Substrate Processing Cluster Tool With Factory Inte...
Publication number
20250038021
Publication date
Jan 30, 2025
Applied Materials, Inc.
Upendra UMMETHALA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DETERMINING SUBSTRATE DECENTERING IN SEMICONDUCTOR PROCESSING SYSTE...
Publication number
20250029853
Publication date
Jan 23, 2025
ASM IP HOLDING B.V.
Christopher Cillie
G01 - MEASURING TESTING
Information
Patent Application
SUBSTRATE PROCESSING APPARATUS
Publication number
20250022730
Publication date
Jan 16, 2025
TES CO., LTD.
Jin-Hyung KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE TRANSPORT SYSTEM AND TRANSFER ROBOT CONTROL DEVICE
Publication number
20250022736
Publication date
Jan 16, 2025
Hirata Corporation
Itaru MOMOKI
B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information
Patent Application
OVERHEAD CONVEYING VEHICLE
Publication number
20250022735
Publication date
Jan 16, 2025
MURATA MACHINERY, LTD.
Makoto Kobayashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE BONDER HAVING A ROTARY BOND ARM ACTUATOR
Publication number
20250022727
Publication date
Jan 16, 2025
ASMPT SINGAPORE PTE. LTD
Ka Shing KWAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISTANCE MEASURING DEVICE, DISTANCE MEASURING METHOD, BONDING APPAR...
Publication number
20250012606
Publication date
Jan 9, 2025
TOKYO ELECTRON LIMITED
Tetsuya Maki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Publication number
20250006525
Publication date
Jan 2, 2025
TOKYO ELECTRON LIMITED
Takeshi Tamura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE CONVEYANCE METHOD AND SUBSTRATE CONVEYANCE DEVICE
Publication number
20250006533
Publication date
Jan 2, 2025
TOKYO ELECTRON LIMITED
Wataru MATSUMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INSPECTION SYSTEM
Publication number
20250006527
Publication date
Jan 2, 2025
BROOKS AUTOMATION (GERMANY) GMBH
Lutz REBSTOCK
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
WAFER BOAT SYSTEM, HOLDER RING AND USE THEREOF
Publication number
20250006529
Publication date
Jan 2, 2025
ASM IP HOLDING B.V.
Theodorus G.M. Oosterlaken
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FOUP HAVING END EFFECTOR DETECTION SENSOR, AND INTEGRATED DATA MANA...
Publication number
20240429082
Publication date
Dec 26, 2024
Samsung Electronics Co., Ltd.
Kyu Ok LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for Teaching Transfer Robot and Substrate Processing System
Publication number
20240424666
Publication date
Dec 26, 2024
TOKYO ELECTRON LIMITED
Kosuke KINOSHITA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD TO CREATE AIR GAPS
Publication number
20240429091
Publication date
Dec 26, 2024
LAM RESEARCH CORPORATION
Patrick A. Van Cleemput
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE AND METHOD FOR ADJUSTING A DETECTION MEANS
Publication number
20240420976
Publication date
Dec 19, 2024
EV GROUP E. THALLNER GMBH
Harald ROHRINGER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MAGNETIC BONDING STRUCTURE AND METHOD OF FORMING SAME
Publication number
20240412991
Publication date
Dec 12, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Tsung-En Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH-PRECISION IN-SITU VERIFICATION AND CORRECTION OF WAFER POSITIO...
Publication number
20240412997
Publication date
Dec 12, 2024
Applied Materials, Inc.
Michael Lee SWEARS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE CORRECTION DEVICE, SUBSTRATE LAMINATION DEVICE, SUBSTRATE...
Publication number
20240404859
Publication date
Dec 5, 2024
Nikon Corporation
Mikio USHIJIMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND APPARATUS FOR INSITU ADJUSTMENT OF WAFER SLIP DETECTION...
Publication number
20240399535
Publication date
Dec 5, 2024
AXUS TECHNOLOGY, LLC
Daniel Ray Trojan
B24 - GRINDING POLISHING
Information
Patent Application
PICKUP METHOD AND PICKUP APPARATUS
Publication number
20240395575
Publication date
Nov 28, 2024
Disco Corporation
Yuya MATSUOKA
B32 - LAYERED PRODUCTS
Information
Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE TRANSFER METHOD
Publication number
20240395585
Publication date
Nov 28, 2024
TOKYO ELECTRON LIMITED
Manabu HONMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Publication number
20240390953
Publication date
Nov 28, 2024
SCREEN Holdings Co., Ltd.
Takuma TAKAHASHI
B08 - CLEANING
Information
Patent Application
MOUNTING DEVICE AND MOUNTING METHOD
Publication number
20240395634
Publication date
Nov 28, 2024
Samsung Electronics Co., Ltd.
Takamasa Sugiura
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
SUBSTRATE PROCESSING SYSTEM, LOAD DEVICE AND METHOD
Publication number
20240387213
Publication date
Nov 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chuang LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING SYSTEM AND METHOD FOR USING THE SAME
Publication number
20240387232
Publication date
Nov 21, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chieh Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ROENTGEN INTEGRATED METROLOGY FOR HYBRID BONDING PROCESS CONTROL IN...
Publication number
20240387448
Publication date
Nov 21, 2024
TOKYO ELECTRON LIMITED
Francisco MACHUCA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF COMPENSATING DIE SHIFT IN THE COMPRESSION MOLDING
Publication number
20240387222
Publication date
Nov 21, 2024
PEP INNOVATION PTE LTD.
Hwee Seng CHEW
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER
Publication number
20240387177
Publication date
Nov 21, 2024
Nikon Corporation
Hajime MITSUISHI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CLEANING AND TRANSFER EQUIPMENT, WAFER TREATMENT EQUIPMENT, TRANSFE...
Publication number
20240379405
Publication date
Nov 14, 2024
EBARA CORPORATION
KOTARO TOYOSAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESSING SYSTEM AND TEACHING METHOD
Publication number
20240379392
Publication date
Nov 14, 2024
TOKYO ELECTRON LIMITED
Toshiaki TOYOMAKI
H01 - BASIC ELECTRIC ELEMENTS