Position monitoring

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CPC
H01L21/67259

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/67259Position monitoring

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Detection method for seized traveling lift pins in wafer processing...
- Patent number 12,249,534
- Issue date Mar 11, 2025
- ASM IP Holding B.V.
- Eric Shero
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detection and analysis of substrate support and pre-heat ring in a...
- Patent number 12,243,761
- Issue date Mar 4, 2025
- Applied Materials, Inc.
- Martin Jeffrey Salinas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Machine learning on overlay management
- Patent number 12,237,188
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tzu-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate transporter and substrate processing apparatus including...
- Patent number 12,237,194
- Issue date Feb 25, 2025
- EBARA CORPORATION
- Akihiro Yazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing system and substrate processing method
- Patent number 12,230,540
- Issue date Feb 18, 2025
- Tokyo Electron Limited
- Yoshihiro Kawaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Level monitoring and active adjustment of a substrate support assembly
- Patent number 12,227,847
- Issue date Feb 18, 2025
- Applied Materials, Inc.
- James V. Santiago
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus for manufacturing semiconductor device
- Patent number 12,224,187
- Issue date Feb 11, 2025
- Kioxia Corporation
- Makoto Aida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate type sensor and method of measuring the impact point and...
- Patent number 12,224,189
- Issue date Feb 11, 2025
- Semes Co., Ltd.
- Young Seop Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer transfer apparatus with aligner
- Patent number 12,224,191
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- Beomsoo Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing system and method for controlling substrate pr...
- Patent number 12,224,194
- Issue date Feb 11, 2025
- Tokyo Electron Limited
- Atsushi Kubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control method and substrate transfer system
- Patent number 12,224,193
- Issue date Feb 11, 2025
- Tokyo Electron Limited
- Takehiro Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for treating substrate
- Patent number 12,217,977
- Issue date Feb 4, 2025
- Semes Co., Ltd.
- Oh Yeol Kwon
- B08 - CLEANING
Information Patent Grant
Methods and systems of image based robot alignment
- Patent number 12,211,718
- Issue date Jan 28, 2025
- GlobalWafers Co., Ltd.
- TaeHyeong Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Component conveying instrument with an adjusting unit and method of...
- Patent number 12,211,721
- Issue date Jan 28, 2025
- Muehlbauer GmbH & Co. KG
- Rainer Miehlich
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Metal-oxide-metal (MOM) capacitors for integrated circuit monitoring
- Patent number 12,205,885
- Issue date Jan 21, 2025
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vision-based wafer pre-alignment platform and alignment method
- Patent number 12,205,325
- Issue date Jan 21, 2025
- WUXI XIVI SCIENCE AND TECHNOLOGY CO., LTD.
- Minjie Lu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bonding system
- Patent number 12,198,963
- Issue date Jan 14, 2025
- Tokyo Electron Limited
- Yoshitaka Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Execution device and execution method
- Patent number 12,198,954
- Issue date Jan 14, 2025
- Tokyo Electron Limited
- Kippei Sugita
- G01 - MEASURING TESTING
Information Patent Grant
Substrate transfer method and substrate transfer system
- Patent number 12,198,955
- Issue date Jan 14, 2025
- Tokyo Electron Limited
- Wataru Matsumoto
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Substrate holding hand and substrate transferring robot
- Patent number 12,195,285
- Issue date Jan 14, 2025
- Kawasaki Jukogyo Kabushiki Kaisha
- Satoshi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire tension adjustment method and wire tension adjuster
- Patent number 12,191,173
- Issue date Jan 7, 2025
- Shinkawa Ltd.
- Toshihiko Toyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Storage system, query system and storage method for reticles, and c...
- Patent number 12,191,177
- Issue date Jan 7, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Xueyu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate transfer apparatus, substrate transfer method, and substr...
- Patent number 12,183,612
- Issue date Dec 31, 2024
- Tokyo Electron Limited
- Tatsuo Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tin oxide mandrels in patterning
- Patent number 12,183,589
- Issue date Dec 31, 2024
- Lam Research Corporation
- Jengyi Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Cover tape for packing electronic component, package, and package set
- Patent number 12,172,412
- Issue date Dec 24, 2024
- Dai Nippon Printing Co., Ltd.
- Ayuro Murata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Installation fixture for needle and installation method for needle
- Patent number 12,176,235
- Issue date Dec 24, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Fencheng Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for correction of impact of wafer tilt on misre...
- Patent number 12,170,215
- Issue date Dec 17, 2024
- KLA Corporation
- Vladimir Levinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus and substrate bonding method
- Patent number 12,165,902
- Issue date Dec 10, 2024
- Nikon Corporation
- Hajime Mitsuishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for handling semiconductor part carriers
- Patent number 12,165,906
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ren-Hau Wu
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Control device, system and control method
- Patent number 12,165,892
- Issue date Dec 10, 2024
- Tokyo Electron Limited
- Yuichi Takenaga
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PRE-ALIGNER
- Publication number 20250079221
- Publication date Mar 6, 2025
- APPLIED MATERIALS ISRAEL LTD.
- Itamar Orenbuch
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, AND ABNORMALITY DETERMINATION METHOD
- Publication number 20250073841
- Publication date Mar 6, 2025
- EBARA CORPORATION
- Yoshimasa OZONE
- B24 - GRINDING POLISHING
Information Patent Application
INSPECTION SYSTEM AND METHOD FOR SUPPORTING BEAM OF SUBSTRATE CARRIER
- Publication number 20250079208
- Publication date Mar 6, 2025
- GUDENG PRECISION INDUSTRIAL CO., LTD.
- MING-CHIEN CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, ROTATION STATE DETECTION METHOD, ME...
- Publication number 20250079231
- Publication date Mar 6, 2025
- Kokusai Electric Corporation
- Naofumi OHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR PACKAGING WAFER CASSETTES
- Publication number 20250069927
- Publication date Feb 27, 2025
- Siltronic AG
- Franz SOLLINGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUSCEPTOR HEIGHT ADJUSTMENT
- Publication number 20250069928
- Publication date Feb 27, 2025
- Applied Materials, Inc.
- Vijay D. Parkhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR WAFER WET PROCESS
- Publication number 20250062141
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT DEVICE WITH DIAGNOSTIC CAPABILITIES
- Publication number 20250062143
- Publication date Feb 20, 2025
- Applied Materials, Inc.
- Deepak Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAPPING APPARATUS AND LOAD PORT APPARATUS
- Publication number 20250054790
- Publication date Feb 13, 2025
- TDK Corporation
- Tatsuhiro KOTSUGAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE MAP GENERATING METHOD
- Publication number 20250046646
- Publication date Feb 6, 2025
- TOKYO ELECTRON LIMITED
- Junnosuke TAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING
- Publication number 20250046635
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Sangchul Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JUNCTION PASSAGE CONTROL SYSTEM BASED ON LOCATION OF OHT USING POWE...
- Publication number 20250046638
- Publication date Feb 6, 2025
- CANTOPS CO., LTD.
- Hak Seo OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Throughput Substrate Processing Cluster Tool With Factory Inte...
- Publication number 20250038021
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Upendra UMMETHALA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETERMINING SUBSTRATE DECENTERING IN SEMICONDUCTOR PROCESSING SYSTE...
- Publication number 20250029853
- Publication date Jan 23, 2025
- ASM IP HOLDING B.V.
- Christopher Cillie
- G01 - MEASURING TESTING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20250022730
- Publication date Jan 16, 2025
- TES CO., LTD.
- Jin-Hyung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TRANSPORT SYSTEM AND TRANSFER ROBOT CONTROL DEVICE
- Publication number 20250022736
- Publication date Jan 16, 2025
- Hirata Corporation
- Itaru MOMOKI
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
DIE BONDER HAVING A ROTARY BOND ARM ACTUATOR
- Publication number 20250022727
- Publication date Jan 16, 2025
- ASMPT SINGAPORE PTE. LTD
- Ka Shing KWAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERHEAD CONVEYING VEHICLE
- Publication number 20250022735
- Publication date Jan 16, 2025
- MURATA MACHINERY, LTD.
- Makoto Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISTANCE MEASURING DEVICE, DISTANCE MEASURING METHOD, BONDING APPAR...
- Publication number 20250012606
- Publication date Jan 9, 2025
- TOKYO ELECTRON LIMITED
- Tetsuya Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20250006525
- Publication date Jan 2, 2025
- TOKYO ELECTRON LIMITED
- Takeshi Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE CONVEYANCE METHOD AND SUBSTRATE CONVEYANCE DEVICE
- Publication number 20250006533
- Publication date Jan 2, 2025
- TOKYO ELECTRON LIMITED
- Wataru MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSPECTION SYSTEM
- Publication number 20250006527
- Publication date Jan 2, 2025
- BROOKS AUTOMATION (GERMANY) GMBH
- Lutz REBSTOCK
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WAFER BOAT SYSTEM, HOLDER RING AND USE THEREOF
- Publication number 20250006529
- Publication date Jan 2, 2025
- ASM IP HOLDING B.V.
- Theodorus G.M. Oosterlaken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOUP HAVING END EFFECTOR DETECTION SENSOR, AND INTEGRATED DATA MANA...
- Publication number 20240429082
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Kyu Ok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Teaching Transfer Robot and Substrate Processing System
- Publication number 20240424666
- Publication date Dec 26, 2024
- TOKYO ELECTRON LIMITED
- Kosuke KINOSHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO CREATE AIR GAPS
- Publication number 20240429091
- Publication date Dec 26, 2024
- LAM RESEARCH CORPORATION
- Patrick A. Van Cleemput
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR ADJUSTING A DETECTION MEANS
- Publication number 20240420976
- Publication date Dec 19, 2024
- EV GROUP E. THALLNER GMBH
- Harald ROHRINGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC BONDING STRUCTURE AND METHOD OF FORMING SAME
- Publication number 20240412991
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-En Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-PRECISION IN-SITU VERIFICATION AND CORRECTION OF WAFER POSITIO...
- Publication number 20240412997
- Publication date Dec 12, 2024
- Applied Materials, Inc.
- Michael Lee SWEARS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE CORRECTION DEVICE, SUBSTRATE LAMINATION DEVICE, SUBSTRATE...
- Publication number 20240404859
- Publication date Dec 5, 2024
- Nikon Corporation
- Mikio USHIJIMA
- H01 - BASIC ELECTRIC ELEMENTS

Position monitoring

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Detection method for seized traveling lift pins in wafer processing...

Detection and analysis of substrate support and pre-heat ring in a...

Machine learning on overlay management

Substrate transporter and substrate processing apparatus including...

Substrate processing system and substrate processing method

Level monitoring and active adjustment of a substrate support assembly

Substrate processing apparatus for manufacturing semiconductor device

Substrate type sensor and method of measuring the impact point and...

Wafer transfer apparatus with aligner

Substrate processing system and method for controlling substrate pr...

Control method and substrate transfer system

Method and apparatus for treating substrate

Methods and systems of image based robot alignment

Component conveying instrument with an adjusting unit and method of...

Metal-oxide-metal (MOM) capacitors for integrated circuit monitoring

Vision-based wafer pre-alignment platform and alignment method

Bonding system

Execution device and execution method

Substrate transfer method and substrate transfer system

Substrate holding hand and substrate transferring robot

Wire tension adjustment method and wire tension adjuster

Storage system, query system and storage method for reticles, and c...

Substrate transfer apparatus, substrate transfer method, and substr...

Tin oxide mandrels in patterning

Cover tape for packing electronic component, package, and package set

Installation fixture for needle and installation method for needle

Systems and methods for correction of impact of wafer tilt on misre...

Substrate bonding apparatus and substrate bonding method

Apparatus and methods for handling semiconductor part carriers

Control device, system and control method

Patents Applicationslast 30 patents

SUBSTRATE PRE-ALIGNER

SUBSTRATE PROCESSING APPARATUS, AND ABNORMALITY DETERMINATION METHOD

INSPECTION SYSTEM AND METHOD FOR SUPPORTING BEAM OF SUBSTRATE CARRIER

SUBSTRATE PROCESSING APPARATUS, ROTATION STATE DETECTION METHOD, ME...

DEVICE FOR PACKAGING WAFER CASSETTES

SUSCEPTOR HEIGHT ADJUSTMENT

SYSTEM AND METHOD FOR WAFER WET PROCESS

SUBSTRATE SUPPORT DEVICE WITH DIAGNOSTIC CAPABILITIES

MAPPING APPARATUS AND LOAD PORT APPARATUS

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE MAP GENERATING METHOD

SUBSTRATE PROCESSING

JUNCTION PASSAGE CONTROL SYSTEM BASED ON LOCATION OF OHT USING POWE...

High Throughput Substrate Processing Cluster Tool With Factory Inte...

DETERMINING SUBSTRATE DECENTERING IN SEMICONDUCTOR PROCESSING SYSTE...

SUBSTRATE PROCESSING APPARATUS

SUBSTRATE TRANSPORT SYSTEM AND TRANSFER ROBOT CONTROL DEVICE

DIE BONDER HAVING A ROTARY BOND ARM ACTUATOR

OVERHEAD CONVEYING VEHICLE

DISTANCE MEASURING DEVICE, DISTANCE MEASURING METHOD, BONDING APPAR...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

SUBSTRATE CONVEYANCE METHOD AND SUBSTRATE CONVEYANCE DEVICE

INSPECTION SYSTEM

WAFER BOAT SYSTEM, HOLDER RING AND USE THEREOF

FOUP HAVING END EFFECTOR DETECTION SENSOR, AND INTEGRATED DATA MANA...

Method for Teaching Transfer Robot and Substrate Processing System

METHOD TO CREATE AIR GAPS

DEVICE AND METHOD FOR ADJUSTING A DETECTION MEANS

MAGNETIC BONDING STRUCTURE AND METHOD OF FORMING SAME

HIGH-PRECISION IN-SITU VERIFICATION AND CORRECTION OF WAFER POSITIO...

SUBSTRATE CORRECTION DEVICE, SUBSTRATE LAMINATION DEVICE, SUBSTRATE...