Position of a single component

Industry

CPC
H05K2201/10439

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10439Position of a single component

Industries

Patents Grantslast 30 patents

Information Patent Grant
Component carrier with embedded component and horizontally elongate...
- Patent number 11,470,714
- Issue date Oct 11, 2022
- AT&S (China) Co. Ltd.
- Gin Feng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 10,881,003
- Issue date Dec 29, 2020
- Ricoh Company, Ltd.
- Naohiro Funada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stretchable circuit board and strain sensor
- Patent number 10,455,695
- Issue date Oct 22, 2019
- Seiko Epson Corporation
- Yohei Yamada
- G01 - MEASURING TESTING
Information Patent Grant
Redistribution layer system in package
- Patent number 9,936,578
- Issue date Apr 3, 2018
- Qorvo US, Inc.
- Thong Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and display device having the same
- Patent number 9,730,317
- Issue date Aug 8, 2017
- Samsung Display Co., Ltd.
- Hyeong-Cheol Ahn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric part soldered onto printed circuit board
- Patent number 9,668,347
- Issue date May 30, 2017
- Dai-Ichi Seiko Co., Ltd.
- Takayoshi Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing ceramic electronic component, ceramic elect...
- Patent number 9,007,161
- Issue date Apr 14, 2015
- Murata Manufacturing Co. Ltd.
- Koji Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing an electronic module
- Patent number 8,959,757
- Issue date Feb 24, 2015
- RF Micro Devices, Inc.
- Thong Dang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a ceramic electronic component
- Patent number 8,819,932
- Issue date Sep 2, 2014
- Murata Manufacturing Co., Ltd.
- Koji Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ANTENNA MODULE
- Publication number 20240334609
- Publication date Oct 3, 2024
- TDK Corporation
- Toshiyuki ABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20240224414
- Publication date Jul 4, 2024
- NIKO SEMICONDUCTOR CO., LTD.
- CHUNG-MING LENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL MODULE AND METHOD OF MANUFACTURING OPTICAL MODULE
- Publication number 20220369524
- Publication date Nov 17, 2022
- FURUKAWA ELECTRIC CO., LTD.
- Kazuya NAGASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT CARRIER WITH EMBEDDED COMPONENT AND HORIZONTALLY ELONGATE...
- Publication number 20210127478
- Publication date Apr 29, 2021
- AT&S (China) Co. Ltd.
- Gin Feng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE CIRCUIT BOARD AND STRAIN SENSOR
- Publication number 20180317318
- Publication date Nov 1, 2018
- SEIKO EPSON CORPORATION
- Yohei YAMADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE FLEXIBLE SUBSTRATE INCLUDING FIRST INSULATING LAYER, SE...
- Publication number 20160353567
- Publication date Dec 1, 2016
- Panasonic Intellectual Property Management Co., Ltd.
- TAKASHI ICHIRYU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, MANUFACTURING METHOD THEREOF AND ELECTRONIC...
- Publication number 20160316557
- Publication date Oct 27, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Jeong-Ho LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRIC PART SOLDERED ONTO PRINTED CIRCUIT BOARD
- Publication number 20150083478
- Publication date Mar 26, 2015
- DAI-ICHI SEIKO CO., LTD.
- Takayoshi ENDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND DISPLAY DEVICE HAVING THE SAME
- Publication number 20150043176
- Publication date Feb 12, 2015
- SAMSUNG DISPLAY CO., LTD.
- Hyeong-Cheol AHN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND PRINTED CIRCUI...
- Publication number 20150041197
- Publication date Feb 12, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Byoung Hwa Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RDL SYSTEM IN PACKAGE
- Publication number 20150036306
- Publication date Feb 5, 2015
- RF Micro Devices, Inc.
- Thong Dang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE COMPRISING AN INTEGRATED CIRCUIT CHIP PROVIDED WI...
- Publication number 20150022987
- Publication date Jan 22, 2015
- STMicroelectronics (Crolles 2) SAS
- Sebastien Gallois-Garreignot
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD HAVING COOLING...
- Publication number 20150003020
- Publication date Jan 1, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Suk Chang HONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20140369014
- Publication date Dec 18, 2014
- YAZAKI CORPORATION
- Yusuke Takagi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING CERAMIC ELECTRONIC COMPONENT, CERAMIC ELECT...
- Publication number 20140332260
- Publication date Nov 13, 2014
- Koji SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RDL SYSTEM IN PACKAGE
- Publication number 20130170147
- Publication date Jul 4, 2013
- RF Micro Devices, Inc.
- Thong Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING CERAMIC ELECTRONIC COMPONENT, CERAMIC ELECT...
- Publication number 20120018205
- Publication date Jan 26, 2012
- Murata Manufacturing Co., Ltd.
- Koji SATO
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD COMPRISING COOL...
- Publication number 20100288535
- Publication date Nov 18, 2010
- Suk Chang HONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Position of a single component

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Component carrier with embedded component and horizontally elongate...

Wiring board

Stretchable circuit board and strain sensor

Redistribution layer system in package

Circuit board and display device having the same

Electric part soldered onto printed circuit board

Method of manufacturing ceramic electronic component, ceramic elect...

Method of manufacturing an electronic module

Method of manufacturing a ceramic electronic component

Patents Applicationslast 30 patents

ANTENNA MODULE

CIRCUIT BOARD

OPTICAL MODULE AND METHOD OF MANUFACTURING OPTICAL MODULE

COMPONENT CARRIER WITH EMBEDDED COMPONENT AND HORIZONTALLY ELONGATE...

STRETCHABLE CIRCUIT BOARD AND STRAIN SENSOR

STRETCHABLE FLEXIBLE SUBSTRATE INCLUDING FIRST INSULATING LAYER, SE...

PRINTED CIRCUIT BOARD, MANUFACTURING METHOD THEREOF AND ELECTRONIC...

ELECTRIC PART SOLDERED ONTO PRINTED CIRCUIT BOARD

CIRCUIT BOARD AND DISPLAY DEVICE HAVING THE SAME

EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND PRINTED CIRCUI...

RDL SYSTEM IN PACKAGE

ELECTRONIC DEVICE COMPRISING AN INTEGRATED CIRCUIT CHIP PROVIDED WI...

ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD HAVING COOLING...

WIRING BOARD

METHOD OF MANUFACTURING CERAMIC ELECTRONIC COMPONENT, CERAMIC ELECT...

RDL SYSTEM IN PACKAGE

METHOD OF MANUFACTURING CERAMIC ELECTRONIC COMPONENT, CERAMIC ELECT...

ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD COMPRISING COOL...