Post-treatment of the layer connector or bonding area

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H01L2224/83909

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/83909Post-treatment of the layer connector or bonding area

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Patents Grantslast 30 patents

Information Patent Grant
Method for transferring and bonding of devices
- Patent number 11,677,060
- Issue date Jun 13, 2023
- ELECTRONICS AND TELEOCMMUNICATIONS RESEARCH INSTITUTE
- Jiho Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated high efficiency gate on gate cooling
- Patent number 11,581,242
- Issue date Feb 14, 2023
- Tokyo Electron Limited
- Daniel Chanemougame
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level integration including design/co-design, structure proce...
- Patent number 11,201,138
- Issue date Dec 14, 2021
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for microelectronics fabrication and packaging...
- Patent number 10,354,950
- Issue date Jul 16, 2019
- Ferric Inc.
- Noah Sturcken
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Methods for microelectronics fabrication and packaging using a magn...
- Patent number 10,002,828
- Issue date Jun 19, 2018
- Ferric, Inc.
- Noah Sturcken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Horizontally and vertically aligned graphite nanofibers thermal int...
- Patent number 9,111,899
- Issue date Aug 18, 2015
- Lenovo
- Gerald K. Bartley
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME
- Publication number 20240371820
- Publication date Nov 7, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- JUI-HUNG HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED HIGH EFFICIENCY GATE ON GATE COOLING
- Publication number 20220223497
- Publication date Jul 14, 2022
- TOKYO ELECTRON LIMITED
- Daniel CHANEMOUGAME
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...
- Publication number 20200126951
- Publication date Apr 23, 2020
- International Business Machines Corporation
- Bing DANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Microelectronics Fabrication and Packaging Using a Magn...
- Publication number 20170250134
- Publication date Aug 31, 2017
- Ferric Inc.
- Noah Sturcken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HORIZONTALLY AND VERTICALLY ALIGNED GRAPHITE NANOFIBERS THERMAL INT...
- Publication number 20140070393
- Publication date Mar 13, 2014
- International Business Machines Corporation
- Gerald K. Bartley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID ADHESIVE BOUNDARY CONTROL
- Publication number 20130064967
- Publication date Mar 14, 2013
- CASEY J. FEINSTEIN
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...