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H01L21/76814

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76814post-treatment or after-treatment

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Interconnection structure and manufacturing method thereof and semi...
- Patent number 12,165,967
- Issue date Dec 10, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Delong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance and high reliability metallization module
- Patent number 12,148,660
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Roey Shaviv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method having a through substrate via and...
- Patent number 12,148,664
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices
- Patent number 12,148,653
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ru-Gun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having one or more modifying substances distr...
- Patent number 12,144,176
- Issue date Nov 12, 2024
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming recesses in source/drain regions and devices fo...
- Patent number 12,132,089
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization lines on integrated circuit products
- Patent number 12,131,994
- Issue date Oct 29, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,080,770
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure
- Patent number 12,074,062
- Issue date Aug 27, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Taoyan Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing tool and methods of operation
- Patent number 12,068,169
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ji Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prevention of contact bottom void in semiconductor fabrication
- Patent number 12,062,578
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor memory device
- Patent number 12,058,851
- Issue date Aug 6, 2024
- United Microelectronics Corp.
- Yi-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact for semiconductor device and method of forming thereof
- Patent number 12,046,677
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huei-Shan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor structure with air gap and method of fabricating the same
- Patent number 12,040,224
- Issue date Jul 16, 2024
- United Microelectronics Corp.
- Yunfei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact window structure, metal plug and forming method thereof, an...
- Patent number 12,002,748
- Issue date Jun 4, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jie Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with source/drain epitaxial layer
- Patent number 11,996,323
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for metal gate surface clean
- Patent number 11,996,283
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shich-Chang Suen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing interconnect structures in semiconductor devices
- Patent number 11,978,664
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pang-Sheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned barrier for metal vias
- Patent number 11,972,974
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch damage and ESL free dual damascene metal interconnect
- Patent number 11,955,376
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sunil Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for forming dual metal interconnects
- Patent number 11,948,885
- Issue date Apr 2, 2024
- Applied Materials, Inc.
- Suketu A Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface modification layer for conductive feature formation
- Patent number 11,942,362
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian-Jou Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for inhibiting line bending during conductive material depo...
- Patent number 11,935,782
- Issue date Mar 19, 2024
- Micron Technology, Inc.
- Gurtej S. Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact window structure and method for forming contact window stru...
- Patent number 11,929,280
- Issue date Mar 12, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor device structures
- Patent number 11,901,219
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Wen Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implantations for forming source/drain regions of different transis...
- Patent number 11,895,819
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Dian-Sheg Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-pass plating process with intermediate rinse and dry
- Patent number 11,887,888
- Issue date Jan 30, 2024
- Texas Instruments Incorporated
- Peter John Holverson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Melt anneal source and drain regions
- Patent number 11,855,146
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-oxidation layer to prevent dielectric loss from planarization...
- Patent number 11,854,822
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Zhen Yu Guan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with interconnect structure and meth...
- Patent number 11,854,872
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hao Kung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METALLIZATION LINES ON INTEGRATED CIRCUIT PRODUCTS
- Publication number 20240413082
- Publication date Dec 12, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20240387247
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ru-Gun LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20240387265
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION WINDOW ENLARGEMENT
- Publication number 20240387180
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR SEMICONDUCTOR DEVICES
- Publication number 20240379344
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240379439
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEANING CHAMBER FOR METAL OXIDE REMOVAL
- Publication number 20240371685
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERRUPTION LAYER FILL FOR LOW RESISTANCE CONTACTS
- Publication number 20240371771
- Publication date Nov 7, 2024
- Applied Materials, Inc.
- Sahil Jaykumar PATEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
- Publication number 20240363361
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ji CUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240363330
- Publication date Oct 31, 2024
- NANYA TECHNOLOGY CORPORATION
- Szu Yu HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREVENTION OF CONTACT BOTTOM VOID IN SEMICONDUCTOR FABRICATION
- Publication number 20240363429
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Yun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PRESSURE PLASMA ETCH PROCESS FOR PREFERENTIAL GENERATION OF OXI...
- Publication number 20240355629
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Tzu-Ging Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR MEMORY DEVICE
- Publication number 20240349493
- Publication date Oct 17, 2024
- UNITED MICROELECTRONICS CORP.
- Yi-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact for Semiconductor Device and Method of Forming Thereof
- Publication number 20240339539
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huei-Shan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR STRUCTURE WITH AIR GAP AND METHOD OF FABRICATING THE SAME
- Publication number 20240332067
- Publication date Oct 3, 2024
- UNITED MICROELECTRONICS CORP.
- Yunfei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR MEMORY DEVICE
- Publication number 20240324187
- Publication date Sep 26, 2024
- UNITED MICROELECTRONICS CORP.
- Yi-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240290652
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polishing Interconnect Structures In Semiconductor Devices
- Publication number 20240290654
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pang-Sheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING AIR GAP AND METHOD FOR MANUFACTURING TH...
- Publication number 20240266212
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hao LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA TREATMENT OF BARRIER AND LINER LAYERS
- Publication number 20240258103
- Publication date Aug 1, 2024
- Applied Materials, Inc.
- Jiajie Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE AND SEMICONDUCTOR DEVICE COMPRISING THE SAME
- Publication number 20240258157
- Publication date Aug 1, 2024
- Samsung Electronics Co., Ltd.
- Jinyong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Implantations for Forming Source/Drain Regions of Different Transis...
- Publication number 20240251537
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Dian-Sheg Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED BARRIER FOR METAL VIAS
- Publication number 20240243009
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Li WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL LAYER WITH ROUGHENED SURFACES
- Publication number 20240222136
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240222266
- Publication date Jul 4, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Luguang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MODIFICATION LAYER FOR CONDUCTIVE FEATURE FORMATION
- Publication number 20240194522
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Jou Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION SCHEME FOR FABRICATING HIGH PRECISION, LOW CAPACITOR WI...
- Publication number 20240186367
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Sunil Kumar SINGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR DEVICE STRUCTURES
- Publication number 20240153814
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240145375
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Hyeonjeong HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...
- Publication number 20240113012
- Publication date Apr 4, 2024
- Micron Technology, Inc.
- Collin Howder
- H01 - BASIC ELECTRIC ELEMENTS

post-treatment or after-treatment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Interconnection structure and manufacturing method thereof and semi...

Low resistance and high reliability metallization module

Semiconductor device and method having a through substrate via and...

Method of manufacturing semiconductor devices

Integrated assemblies having one or more modifying substances distr...

Methods for forming recesses in source/drain regions and devices fo...

Metallization lines on integrated circuit products

Semiconductor device and method

Method for manufacturing semiconductor structure

Semiconductor processing tool and methods of operation

Prevention of contact bottom void in semiconductor fabrication

Method of forming semiconductor memory device

Contact for semiconductor device and method of forming thereof

Transistor structure with air gap and method of fabricating the same

Contact window structure, metal plug and forming method thereof, an...

Semiconductor device with source/drain epitaxial layer

Method for metal gate surface clean

Polishing interconnect structures in semiconductor devices

Self-aligned barrier for metal vias

Etch damage and ESL free dual damascene metal interconnect

Methods and apparatus for forming dual metal interconnects

Surface modification layer for conductive feature formation

Methods for inhibiting line bending during conductive material depo...

Contact window structure and method for forming contact window stru...

Methods of forming semiconductor device structures

Implantations for forming source/drain regions of different transis...

Multi-pass plating process with intermediate rinse and dry

Melt anneal source and drain regions

Anti-oxidation layer to prevent dielectric loss from planarization...

Semiconductor device structure with interconnect structure and meth...

Patents Applicationslast 30 patents

METALLIZATION LINES ON INTEGRATED CIRCUIT PRODUCTS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES

CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

DEPOSITION WINDOW ENLARGEMENT

INTERCONNECT STRUCTURE FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE AND METHOD

CLEANING CHAMBER FOR METAL OXIDE REMOVAL

INTERRUPTION LAYER FILL FOR LOW RESISTANCE CONTACTS

SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PREVENTION OF CONTACT BOTTOM VOID IN SEMICONDUCTOR FABRICATION

LOW PRESSURE PLASMA ETCH PROCESS FOR PREFERENTIAL GENERATION OF OXI...

METHOD OF FORMING SEMICONDUCTOR MEMORY DEVICE

Contact for Semiconductor Device and Method of Forming Thereof

TRANSISTOR STRUCTURE WITH AIR GAP AND METHOD OF FABRICATING THE SAME

METHOD OF FORMING SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR DEVICE

Polishing Interconnect Structures In Semiconductor Devices

SEMICONDUCTOR DEVICE HAVING AIR GAP AND METHOD FOR MANUFACTURING TH...

PLASMA TREATMENT OF BARRIER AND LINER LAYERS

WIRING STRUCTURE AND SEMICONDUCTOR DEVICE COMPRISING THE SAME

Implantations for Forming Source/Drain Regions of Different Transis...

SELF-ALIGNED BARRIER FOR METAL VIAS

ELECTRICAL LAYER WITH ROUGHENED SURFACES

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SURFACE MODIFICATION LAYER FOR CONDUCTIVE FEATURE FORMATION

INTEGRATION SCHEME FOR FABRICATING HIGH PRECISION, LOW CAPACITOR WI...

METHODS OF FORMING SEMICONDUCTOR DEVICE STRUCTURES

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...