post-treatment or after-treatment

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H01L21/76814

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76814post-treatment or after-treatment

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,315,795
- Issue date May 27, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Luguang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition window enlargement
- Patent number 12,300,496
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistant contact method and structure
- Patent number 12,300,729
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for semiconductor devices
- Patent number 12,293,910
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Chuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,284,801
- Issue date Apr 22, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Sen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact features of semiconductor device and method of forming same
- Patent number 12,272,600
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removing polymer through treatment
- Patent number 12,272,595
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a barrier layer in an interconnect structure of s...
- Patent number 12,266,567
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Jhih Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with an interconnect structure in a...
- Patent number 12,249,542
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hao Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hard mask removal without damaging top epitaxial layer
- Patent number 12,243,770
- Issue date Mar 4, 2025
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,218,184
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jui-Lin Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning chamber for metal oxide removal
- Patent number 12,211,737
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for semiconductor devices
- Patent number 12,205,816
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Chuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure and semiconductor structure
- Patent number 12,205,893
- Issue date Jan 21, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Tianlei Mu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for minimizing feature-to-feature gap fill height variations
- Patent number 12,191,200
- Issue date Jan 7, 2025
- Applied Materials, Inc.
- Jiajie Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for copper doped hybrid metallization for line and via
- Patent number 12,183,631
- Issue date Dec 31, 2024
- Applied Materials, Inc.
- Suketu Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal interconnect structure having cap layer with different thickn...
- Patent number 12,183,626
- Issue date Dec 31, 2024
- United Microelectronics Corp.
- Yi-How Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and manufacturing method thereof and semi...
- Patent number 12,165,967
- Issue date Dec 10, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Delong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance and high reliability metallization module
- Patent number 12,148,660
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Roey Shaviv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method having a through substrate via and...
- Patent number 12,148,664
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices
- Patent number 12,148,653
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ru-Gun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having one or more modifying substances distr...
- Patent number 12,144,176
- Issue date Nov 12, 2024
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming recesses in source/drain regions and devices fo...
- Patent number 12,132,089
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization lines on integrated circuit products
- Patent number 12,131,994
- Issue date Oct 29, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,080,770
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure
- Patent number 12,074,062
- Issue date Aug 27, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Taoyan Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing tool and methods of operation
- Patent number 12,068,169
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ji Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prevention of contact bottom void in semiconductor fabrication
- Patent number 12,062,578
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor memory device
- Patent number 12,058,851
- Issue date Aug 6, 2024
- United Microelectronics Corp.
- Yi-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact for semiconductor device and method of forming thereof
- Patent number 12,046,677
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huei-Shan Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20250142847
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- JUI-LIN CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250132198
- Publication date Apr 24, 2025
- Samsung Electronics Co., LTD
- Yunho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND FORMULATIONS FOR SACRIFICIAL BRACING, SURFACE PROTECTIO...
- Publication number 20250132195
- Publication date Apr 24, 2025
- LAM RESEARCH CORPORATION
- Stephen M. SIRARD
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
INTEGRATED ASSEMBLIES HAVING ONE OR MORE MODIFYING SUBSTANCES DISTR...
- Publication number 20250107089
- Publication date Mar 27, 2025
- Lodestar Licensing Group LLC
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20250087578
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250079315
- Publication date Mar 6, 2025
- WINBOND ELECTRONICS CORP.
- Jian-Ting CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INTERCONNECT STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250079237
- Publication date Mar 6, 2025
- UNITED MICROELECTRONICS CORP.
- Yi-How Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE BARRIER STRUCTURE AND METHOD FO...
- Publication number 20250069947
- Publication date Feb 27, 2025
- NANYA TECHNOLOGY CORPORATION
- WEI-CHEN PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFIED REVERSE SELECTIVE BARRIER STRUCTURE
- Publication number 20250046716
- Publication date Feb 6, 2025
- QUALCOMM Incorporated
- Junjing BAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Resistance and High Reliability Metallization Module
- Publication number 20250029874
- Publication date Jan 23, 2025
- Applied Materials, Inc.
- Roey Shaviv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM ETCH PROCESS FOR CONTACT PLUG ANCHORING
- Publication number 20250006518
- Publication date Jan 2, 2025
- Applied Materials, Inc.
- Shiyu YUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Feature Through Heterogeneous Stacked Film and Methods of M...
- Publication number 20240429090
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Jhen Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZATION LINES ON INTEGRATED CIRCUIT PRODUCTS
- Publication number 20240413082
- Publication date Dec 12, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20240387247
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ru-Gun LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20240387265
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION WINDOW ENLARGEMENT
- Publication number 20240387180
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR SEMICONDUCTOR DEVICES
- Publication number 20240379344
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240379439
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEANING CHAMBER FOR METAL OXIDE REMOVAL
- Publication number 20240371685
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERRUPTION LAYER FILL FOR LOW RESISTANCE CONTACTS
- Publication number 20240371771
- Publication date Nov 7, 2024
- Applied Materials, Inc.
- Sahil Jaykumar PATEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
- Publication number 20240363361
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ji CUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240363330
- Publication date Oct 31, 2024
- NANYA TECHNOLOGY CORPORATION
- Szu Yu HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREVENTION OF CONTACT BOTTOM VOID IN SEMICONDUCTOR FABRICATION
- Publication number 20240363429
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Yun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PRESSURE PLASMA ETCH PROCESS FOR PREFERENTIAL GENERATION OF OXI...
- Publication number 20240355629
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Tzu-Ging Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR MEMORY DEVICE
- Publication number 20240349493
- Publication date Oct 17, 2024
- UNITED MICROELECTRONICS CORP.
- Yi-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact for Semiconductor Device and Method of Forming Thereof
- Publication number 20240339539
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huei-Shan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR STRUCTURE WITH AIR GAP AND METHOD OF FABRICATING THE SAME
- Publication number 20240332067
- Publication date Oct 3, 2024
- UNITED MICROELECTRONICS CORP.
- Yunfei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR MEMORY DEVICE
- Publication number 20240324187
- Publication date Sep 26, 2024
- UNITED MICROELECTRONICS CORP.
- Yi-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240290652
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polishing Interconnect Structures In Semiconductor Devices
- Publication number 20240290654
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pang-Sheng Chang
- H01 - BASIC ELECTRIC ELEMENTS

post-treatment or after-treatment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure and manufacturing method thereof

Deposition window enlargement

Low resistant contact method and structure

Interconnect structure for semiconductor devices

Semiconductor structure and manufacturing method thereof

Contact features of semiconductor device and method of forming same

Removing polymer through treatment

Method of forming a barrier layer in an interconnect structure of s...

Semiconductor device structure with an interconnect structure in a...

Hard mask removal without damaging top epitaxial layer

Semiconductor structure and method for forming the same

Cleaning chamber for metal oxide removal

Interconnect structure for semiconductor devices

Method for forming semiconductor structure and semiconductor structure

Methods for minimizing feature-to-feature gap fill height variations

Methods for copper doped hybrid metallization for line and via

Metal interconnect structure having cap layer with different thickn...

Interconnection structure and manufacturing method thereof and semi...

Low resistance and high reliability metallization module

Semiconductor device and method having a through substrate via and...

Method of manufacturing semiconductor devices

Integrated assemblies having one or more modifying substances distr...

Methods for forming recesses in source/drain regions and devices fo...

Metallization lines on integrated circuit products

Semiconductor device and method

Method for manufacturing semiconductor structure

Semiconductor processing tool and methods of operation

Prevention of contact bottom void in semiconductor fabrication

Method of forming semiconductor memory device

Contact for semiconductor device and method of forming thereof

Patents Applicationslast 30 patents

METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHODS AND FORMULATIONS FOR SACRIFICIAL BRACING, SURFACE PROTECTIO...

INTEGRATED ASSEMBLIES HAVING ONE OR MORE MODIFYING SUBSTANCES DISTR...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

METAL INTERCONNECT STRUCTURE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE WITH COMPOSITE BARRIER STRUCTURE AND METHOD FO...

MODIFIED REVERSE SELECTIVE BARRIER STRUCTURE

Low Resistance and High Reliability Metallization Module

BOTTOM ETCH PROCESS FOR CONTACT PLUG ANCHORING

Contact Feature Through Heterogeneous Stacked Film and Methods of M...

METALLIZATION LINES ON INTEGRATED CIRCUIT PRODUCTS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES

CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

DEPOSITION WINDOW ENLARGEMENT

INTERCONNECT STRUCTURE FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE AND METHOD

CLEANING CHAMBER FOR METAL OXIDE REMOVAL

INTERRUPTION LAYER FILL FOR LOW RESISTANCE CONTACTS

SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PREVENTION OF CONTACT BOTTOM VOID IN SEMICONDUCTOR FABRICATION

LOW PRESSURE PLASMA ETCH PROCESS FOR PREFERENTIAL GENERATION OF OXI...

METHOD OF FORMING SEMICONDUCTOR MEMORY DEVICE

Contact for Semiconductor Device and Method of Forming Thereof

TRANSISTOR STRUCTURE WITH AIR GAP AND METHOD OF FABRICATING THE SAME

METHOD OF FORMING SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR DEVICE

Polishing Interconnect Structures In Semiconductor Devices