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Pre-cured adhesive
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CPC
H01L2224/85856
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/85856
Pre-cured adhesive
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last 30 patents
Patents Applications
last 30 patents
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Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM USING B-STAGE POLYMER AND METHO...
Publication number
20120228768
Publication date
Sep 13, 2012
Reza Argenty Pagaila
H01 - BASIC ELECTRIC ELEMENTS