Pre-cured adhesive

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H01L2224/81856

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/81856Pre-cured adhesive

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Patents Grantslast 30 patents

Information Patent Grant
Memory devices with controllers under memory packages and associate...
- Patent number 11,658,154
- Issue date May 23, 2023
- Micron Technology, Inc.
- Seng Kim Ye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,333
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,332
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices with controllers under memory packages and associate...
- Patent number 10,727,206
- Issue date Jul 28, 2020
- Micron Technology, Inc.
- Seng Kim Ye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,707,111
- Issue date Jul 7, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Engineered polymer-based electronic materials
- Patent number 10,682,732
- Issue date Jun 16, 2020
- Alpha Assembly Solutions Inc.
- Ramakrishna Hosur Venkatagiriyappa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fully molded miniaturized semiconductor module
- Patent number 10,373,902
- Issue date Aug 6, 2019
- Deca Technologies Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,269,609
- Issue date Apr 23, 2019
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices with controllers under memory packages and associate...
- Patent number 10,128,217
- Issue date Nov 13, 2018
- Micron Technology, Inc.
- Seng Kim Ye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 9,892,952
- Issue date Feb 13, 2018
- Semiconductor Components Industries, LLC
- Darrell Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices with controllers under memory packages and associate...
- Patent number 9,627,367
- Issue date Apr 18, 2017
- Micron Technology, Inc.
- Seng Kim Ye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip package structure and method for manufacturing the same
- Patent number 8,426,255
- Issue date Apr 23, 2013
- ChipMOS Technologies, Inc.
- Geng-Shin Shen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FULLY MOLDED MINIATURIZED SEMICONDUCTOR MODULE
- Publication number 20180108606
- Publication date Apr 19, 2018
- DECA TECHNOLOGIES INC
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING A FIRST SUBSTRATE AND A SECOND SUBSTRATE
- Publication number 20170309584
- Publication date Oct 26, 2017
- Agency for Science, Technology and Research
- Ling Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130065361
- Publication date Mar 14, 2013
- CHIPMOS TECHNOLOGIES INC.
- Geng-Shin Shen
- H01 - BASIC ELECTRIC ELEMENTS

Pre-cured adhesive

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Memory devices with controllers under memory packages and associate...

Wafer level flat no-lead semiconductor packages and methods of manu...

Wafer level flat no-lead semiconductor packages and methods of manu...

Memory devices with controllers under memory packages and associate...

Wafer level flat no-lead semiconductor packages and methods of manu...

Engineered polymer-based electronic materials

Fully molded miniaturized semiconductor module

Wafer level flat no-lead semiconductor packages and methods of manu...

Memory devices with controllers under memory packages and associate...

Wafer level flat no-lead semiconductor packages and methods of manu...

Memory devices with controllers under memory packages and associate...

Chip package structure and method for manufacturing the same

Patents Applicationslast 30 patents

FULLY MOLDED MINIATURIZED SEMICONDUCTOR MODULE

METHOD OF BONDING A FIRST SUBSTRATE AND A SECOND SUBSTRATE

CHIP PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME