Pre-cured adhesive

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CPC
H01L2224/83856

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83856Pre-cured adhesive

Industries

Patents Grantslast 30 patents

Information Patent Grant
Package structure and manufacturing method of the same
- Patent number 12,062,742
- Issue date Aug 13, 2024
- Unimicron Technology Corp.
- Hao-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate
- Patent number 11,901,325
- Issue date Feb 13, 2024
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with high heat dissipation efficiency
- Patent number 11,699,675
- Issue date Jul 11, 2023
- Harvatek Corporation
- Chin-Jui Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making flexible semiconductor device with graphene tape
- Patent number 11,456,188
- Issue date Sep 27, 2022
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor package including filling me...
- Patent number 11,450,535
- Issue date Sep 20, 2022
- Nepes Co., Ltd.
- Yong-Tae Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced adhesive materials and processes for 3D applications
- Patent number 11,168,234
- Issue date Nov 9, 2021
- International Business Machines Corporation
- James L. Hedrick
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Inkjet adhesive, manufacturing method for semiconductor device, and...
- Patent number 10,961,411
- Issue date Mar 30, 2021
- Sekisui Chemical Co., Ltd.
- Mitsuru Tanikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for fabricating a semiconductor and semiconductor package
- Patent number 10,957,671
- Issue date Mar 23, 2021
- INTEL DEUTSCHLAND GMBH
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-stage cure bare die light emitting diode
- Patent number 10,795,452
- Issue date Oct 6, 2020
- Microsoft Technology Licensing, LLC
- Benjamin Patrick Sullivan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High reliability wafer level semiconductor packaging
- Patent number 10,790,208
- Issue date Sep 29, 2020
- Semiconductor Components Industries, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,333
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced adhesive materials and processes for 3D applications
- Patent number 10,767,084
- Issue date Sep 8, 2020
- International Business Machines Corporation
- James L. Hedrick
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,332
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,707,111
- Issue date Jul 7, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible semiconductor device with graphene tape
- Patent number 10,692,802
- Issue date Jun 23, 2020
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Engineered polymer-based electronic materials
- Patent number 10,682,732
- Issue date Jun 16, 2020
- Alpha Assembly Solutions Inc.
- Ramakrishna Hosur Venkatagiriyappa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating a semiconductor and semiconductor package
- Patent number 10,643,971
- Issue date May 5, 2020
- INTEL DEUTSCHLAND GMBH
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 10,636,766
- Issue date Apr 28, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with barrier layer
- Patent number 10,593,621
- Issue date Mar 17, 2020
- Shinko Electric Industries Co., Ltd.
- Keigo Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming high routing density int...
- Patent number 10,580,749
- Issue date Mar 3, 2020
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
A-staged thermoplastic-polyimide (TPI) adhesive compound and method...
- Patent number 10,550,299
- Issue date Feb 4, 2020
- FRAIVILLIG TECHNOGIES COMPANY
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
A-staged thermoplastic-polyimide (TPI) adhesive compound containing...
- Patent number 10,435,603
- Issue date Oct 8, 2019
- Fravillig Technologies Company
- James B. Fraivillig
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for fabricating a semiconductor and semiconductor package
- Patent number 10,438,926
- Issue date Oct 8, 2019
- INTEL DEUTSCHLAND GMBH
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive resin composition, film adhesive, adhesive sheet, ad...
- Patent number 10,428,253
- Issue date Oct 1, 2019
- Hitachi Chemical Company, Ltd.
- Tomonori Minegishi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
3D packaging method for semiconductor components
- Patent number 10,418,339
- Issue date Sep 17, 2019
- Imec VZW
- Fabrice Duval
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film, method for producing anisotropic condu...
- Patent number 10,373,926
- Issue date Aug 6, 2019
- Dexerials Corporation
- Kouichi Sato
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
High reliability wafer level semiconductor packaging
- Patent number 10,290,556
- Issue date May 14, 2019
- Semiconductor Components Industries, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,269,609
- Issue date Apr 23, 2019
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming an embedded SoP fan-out...
- Patent number 10,217,702
- Issue date Feb 26, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240312976
- Publication date Sep 19, 2024
- KIOXIA Corporation
- Keiichi NIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR PACKAGE
- Publication number 20240304639
- Publication date Sep 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yu-Te Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240162184
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Sang-Sick Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20230231087
- Publication date Jul 20, 2023
- Unimicron Technology Corp.
- Hao-Wei TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH HIGH HEAT DISSIPATION EFFICIENCY
- Publication number 20220359451
- Publication date Nov 10, 2022
- HARVATEK CORPORATION
- Chin-Jui LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuits Including Micropatterns and Using Partial Curing to Adhere...
- Publication number 20220352108
- Publication date Nov 3, 2022
- 3M Innovative Properties Company
- Teresa M. Goeddel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE
- Publication number 20200303340
- Publication date Sep 24, 2020
- Intel Deutschland GmbH
- Gottfried BEER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY
- Publication number 20200219848
- Publication date Jul 9, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE
- Publication number 20200013751
- Publication date Jan 9, 2020
- Intel Deutschland GmbH
- Gottfried BEER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING
- Publication number 20190229025
- Publication date Jul 25, 2019
- Semiconductor Components Industries, LLC
- Yu-Te HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INKJET ADHESIVE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND...
- Publication number 20190092963
- Publication date Mar 28, 2019
- Sekisui Chemical Co., Ltd
- Mitsuru Tanikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound Containing...
- Publication number 20190048238
- Publication date Feb 14, 2019
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound and Method...
- Publication number 20180346777
- Publication date Dec 6, 2018
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ENHANCED ADHESIVE MATERIALS AND PROCESSES FOR 3D APPLICATIONS
- Publication number 20180340100
- Publication date Nov 29, 2018
- International Business Machines Corporation
- James L. Hedrick
- B82 - NANO-TECHNOLOGY
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING ANISOTROPIC CONDU...
- Publication number 20180218994
- Publication date Aug 2, 2018
- DEXERIALS CORPORATION
- Kouichi SATO
- B32 - LAYERED PRODUCTS
Information Patent Application
WAFER LEVEL FLAT NO-LEAD SEMICONDUCTOR PACKAGES AND METHODS OF MANU...
- Publication number 20180174881
- Publication date Jun 21, 2018
- Semiconductor Components Industries, LLC
- Darrell D. TRUHITTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING
- Publication number 20180082913
- Publication date Mar 22, 2018
- Semiconductor Components Industries, LLC
- Yu-Te HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY
- Publication number 20180068982
- Publication date Mar 8, 2018
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING
- Publication number 20170236761
- Publication date Aug 17, 2017
- Semiconductor Components Industries, LLC
- Yu-Te HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INKJET PHOTO- AND HEAT-CURABLE ADHESIVE, SEMICONDUCTOR DEVICE MANUF...
- Publication number 20170158922
- Publication date Jun 8, 2017
- Sekisui Chemical Co., Ltd.
- Mitsuru Tanikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PACKAGED IC HAVING PRINTED DIELECTRIC ADHESIVE ON DIE PAD
- Publication number 20140327123
- Publication date Nov 6, 2014
- WAN MOHD MISUARI SULEIMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming High Routing Density Int...
- Publication number 20140319692
- Publication date Oct 30, 2014
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, HAVING THROUGH ELECTRODES, A MANUFACTURING ME...
- Publication number 20140306342
- Publication date Oct 16, 2014
- Tsuyoshi YODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES WITH POLYMER CORE
- Publication number 20140264910
- Publication date Sep 18, 2014
- Sandeep Razdan
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRONIC PACKAGING SUBSTRATE WITH ETCHING INDENTATION AS DIE ATTA...
- Publication number 20140252399
- Publication date Sep 11, 2014
- Avago Technologies General IP (Singapore) PTE. LTD.
- Meng Ee Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS...
- Publication number 20140239511
- Publication date Aug 28, 2014
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140239508
- Publication date Aug 28, 2014
- Shinko Electric Industries Co., LTD.
- Sumihiro Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BACK SIDE COATING AS DICING TAPE ADHESIVE
- Publication number 20140225283
- Publication date Aug 14, 2014
- Henkel Corporation
- Gyanendra Dutt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING ELECTRONIC DEVICE WITH LIQUID CRYSTAL POLYMER AND...
- Publication number 20140217618
- Publication date Aug 7, 2014
- Harris Corporation
- Andrew Craig KING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20140217438
- Publication date Aug 7, 2014
- Hideyuki TOMIZAWA
- H01 - BASIC ELECTRIC ELEMENTS

Pre-cured adhesive

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package structure and manufacturing method of the same

Multilayer substrate

Semiconductor device with high heat dissipation efficiency

Chip assembly

Method of making flexible semiconductor device with graphene tape

Manufacturing method for semiconductor package including filling me...

Enhanced adhesive materials and processes for 3D applications

Inkjet adhesive, manufacturing method for semiconductor device, and...

Method for fabricating a semiconductor and semiconductor package

Multi-stage cure bare die light emitting diode

High reliability wafer level semiconductor packaging

Wafer level flat no-lead semiconductor packages and methods of manu...

Enhanced adhesive materials and processes for 3D applications

Wafer level flat no-lead semiconductor packages and methods of manu...

Wafer level flat no-lead semiconductor packages and methods of manu...

Flexible semiconductor device with graphene tape

Engineered polymer-based electronic materials

Method for fabricating a semiconductor and semiconductor package

Chip assembly

Semiconductor device with barrier layer

Semiconductor device and method of forming high routing density int...

A-staged thermoplastic-polyimide (TPI) adhesive compound and method...

A-staged thermoplastic-polyimide (TPI) adhesive compound containing...

Method for fabricating a semiconductor and semiconductor package

Photosensitive resin composition, film adhesive, adhesive sheet, ad...

3D packaging method for semiconductor components

Anisotropic conductive film, method for producing anisotropic condu...

High reliability wafer level semiconductor packaging

Wafer level flat no-lead semiconductor packages and methods of manu...

Semiconductor device and method of forming an embedded SoP fan-out...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

OPTICAL SENSOR PACKAGE

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DEVICE WITH HIGH HEAT DISSIPATION EFFICIENCY

Circuits Including Micropatterns and Using Partial Curing to Adhere...

METHOD FOR FABRICATING A SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE

METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY

METHOD FOR FABRICATING A SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE

HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING

INKJET ADHESIVE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND...

A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound Containing...

A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound and Method...

ENHANCED ADHESIVE MATERIALS AND PROCESSES FOR 3D APPLICATIONS

ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING ANISOTROPIC CONDU...

WAFER LEVEL FLAT NO-LEAD SEMICONDUCTOR PACKAGES AND METHODS OF MANU...

HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING

METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY

HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING

INKJET PHOTO- AND HEAT-CURABLE ADHESIVE, SEMICONDUCTOR DEVICE MANUF...

PACKAGED IC HAVING PRINTED DIELECTRIC ADHESIVE ON DIE PAD

Semiconductor Device and Method of Forming High Routing Density Int...

SEMICONDUCTOR DEVICE, HAVING THROUGH ELECTRODES, A MANUFACTURING ME...

INTERCONNECT STRUCTURES WITH POLYMER CORE

ELECTRONIC PACKAGING SUBSTRATE WITH ETCHING INDENTATION AS DIE ATTA...

SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

WAFER BACK SIDE COATING AS DICING TAPE ADHESIVE

METHOD FOR MAKING ELECTRONIC DEVICE WITH LIQUID CRYSTAL POLYMER AND...

SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME