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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/03502Pre-existing or pre-deposited material

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming brass-coated metals in flip-chip redistribution l...
- Patent number 11,984,418
- Issue date May 14, 2024
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additive manufacturing of a frontside or backside interconnect of a...
- Patent number 11,688,713
- Issue date Jun 27, 2023
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,495,557
- Issue date Nov 8, 2022
- Advanced Semiconductor Engineering, Inc.
- Jhao-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector formation methods and packaged semiconductor devices
- Patent number 11,424,199
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector formation methods and packaged semiconductor devices
- Patent number 10,522,486
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,211,173
- Issue date Feb 19, 2019
- Mitsubishi Electric Corporation
- Yui Nakaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector formation methods and packaged semiconductor devices
- Patent number 9,691,723
- Issue date Jun 27, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ALLOY FOR METAL UNDERCUT REDUCTION
- Publication number 20240290735
- Publication date Aug 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- RAFAEL JOSE GUEVARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING AND TRANSFERRING METHOD FOR DIE PACKAGE STRUCTURES
- Publication number 20240072033
- Publication date Feb 29, 2024
- INGENTEC CORPORATION
- Hsiao Lu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230027674
- Publication date Jan 26, 2023
- Advanced Semiconductor Engineering, Inc.
- Jhao-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME, SEMICONDUCTOR...
- Publication number 20230005851
- Publication date Jan 5, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Kai TIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210296267
- Publication date Sep 23, 2021
- Advanced Semiconductor Engineering, Inc.
- Jhao-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device, Semiconductor Component and Method of Fabrica...
- Publication number 20200111759
- Publication date Apr 9, 2020
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connector Formation Methods and Packaged Semiconductor Devices
- Publication number 20170352632
- Publication date Dec 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR FORMATION METHODS AND PACKAGED SEMICONDUCTOR DEVICES
- Publication number 20170125365
- Publication date May 4, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20170098628
- Publication date Apr 6, 2017
- MEDIATEK INC.
- Nai-Wei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURES AND FABRICATION METHOD THEREOF
- Publication number 20140191412
- Publication date Jul 10, 2014
- Semiconductor Manufacturing International (Shanghai) Corporation
- MING ZHOU
- H01 - BASIC ELECTRIC ELEMENTS

Pre-existing or pre-deposited material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming brass-coated metals in flip-chip redistribution l...

Additive manufacturing of a frontside or backside interconnect of a...

Semiconductor device and method of manufacturing the same

Connector formation methods and packaged semiconductor devices

Connector formation methods and packaged semiconductor devices

Semiconductor device and manufacturing method thereof

Connector formation methods and packaged semiconductor devices

Patents Applicationslast 30 patents

ALLOY FOR METAL UNDERCUT REDUCTION

BONDING AND TRANSFERRING METHOD FOR DIE PACKAGE STRUCTURES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME, SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Device, Semiconductor Component and Method of Fabrica...

Connector Formation Methods and Packaged Semiconductor Devices

CONNECTOR FORMATION METHODS AND PACKAGED SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

INTERCONNECTION STRUCTURES AND FABRICATION METHOD THEREOF