Pre-treatment of the bonding area

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H01L2224/80009

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/80009Pre-treatment of the bonding area

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Patents Grantslast 30 patents

Information Patent Grant
Embedded cooling assemblies for advanced device packaging and metho...
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- Issue date Dec 31, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
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Information Patent Grant
Silicon carbide composite wafer and manufacturing method thereof
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- Issue date Dec 3, 2024
- HONG CHUANG APPLIED TECHNOLOGY CO., LTD
- Yan-Kai Zeng
- C30 - CRYSTAL GROWTH
Information Patent Grant
Wafer-bonding structure and method of forming thereof
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- Issue date Jun 25, 2024
- Integrated Silicon Solution Inc.
- Hsingya Arthur Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical bonding method, package-type electronic component, and hyb...
- Patent number 11,916,038
- Issue date Feb 27, 2024
- Canon Anelva Corporation
- Takayuki Saitoh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing semiconductor package with air gap
- Patent number 11,817,306
- Issue date Nov 14, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method, solid state image senso...
- Patent number 11,776,923
- Issue date Oct 3, 2023
- Sony Corporation
- Masaki Haneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon heater bonded to a test wafer
- Patent number 11,668,665
- Issue date Jun 6, 2023
- Tokyo Electron Limited
- Shigeru Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid interconnect for laser bonding using nanoporous metal tips
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- Issue date Aug 23, 2022
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with air gap and manufacturing method thereof
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- Issue date Apr 19, 2022
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
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3D IC package with RDL interposer and related method
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- Issue date Jun 15, 2021
- GLOBALFOUNDRIES U.S. INC.
- Luke G. England
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Bonding apparatus, bonding system, bonding method and storage medium
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- Issue date Apr 20, 2021
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor device, manufacturing method, solid state image senso...
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- Issue date Mar 16, 2021
- Sony Corporation
- Masaki Haneda
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Information Patent Grant
Bonding system
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- Issue date Nov 17, 2020
- Tokyo Electron Limited
- Masataka Matsunaga
- B32 - LAYERED PRODUCTS
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
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- Issue date Aug 25, 2020
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor device, manufacturing method, solid state image senso...
- Patent number 10,615,210
- Issue date Apr 7, 2020
- Sony Corporation
- Masaki Haneda
- H01 - BASIC ELECTRIC ELEMENTS
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Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,438,920
- Issue date Oct 8, 2019
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
3D IC package with RDL interposer and related method
- Patent number 10,388,631
- Issue date Aug 20, 2019
- GLOBALFOUNDRIES Inc.
- Luke G. England
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method, solid state image senso...
- Patent number 10,332,927
- Issue date Jun 25, 2019
- Sony Corporation
- Masaki Haneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a microelectronic device structure, and related...
- Patent number 10,136,520
- Issue date Nov 20, 2018
- Quartzdyne, Inc.
- Mark Hahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,096,569
- Issue date Oct 9, 2018
- Advanced Semiconductor Engineering, Inc.
- Ying-Ta Chiu
- H01 - BASIC ELECTRIC ELEMENTS
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Methods of forming a microelectronic device structure, and related...
- Patent number 9,717,148
- Issue date Jul 25, 2017
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- Mark Hahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate bonding with diffusion barrier structures
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- Issue date Apr 11, 2017
- GLOBALFOUNDRIES Inc.
- Daniel C. Edelstein
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Information Patent Grant
Integrated circuit device and structure
- Patent number 9,099,526
- Issue date Aug 4, 2015
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING LAYERS IN SEMICONDCUTOR PACKAGES AND METHODS OF FORMING
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- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD AND BONDING SYSTEM
- Publication number 20250029950
- Publication date Jan 23, 2025
- TOKYO ELECTRON LIMITED
- Yuji MIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM OF PERFORMING COLLECTIVE DIE-TO-WAFER BONDING
- Publication number 20250022839
- Publication date Jan 16, 2025
- IHP GmbH-Innovations for High Performance Microelectronics/Leibniz-Instit. fu...
- Sebastian SCHULZE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS INCLUDING A BONDING HEAD AND A METHOD OF USING THE SAME
- Publication number 20240404867
- Publication date Dec 5, 2024
- Canon Kabushiki Kaisha
- Byung-Jin Choi
- H01 - BASIC ELECTRIC ELEMENTS
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BONDING METHOD AND BONDING SYSTEM
- Publication number 20240339431
- Publication date Oct 10, 2024
- TOKYO ELECTRON LIMITED
- Kazutaka Noda
- H01 - BASIC ELECTRIC ELEMENTS
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DIRECT BONDING METHODS AND STRUCTURES
- Publication number 20240304593
- Publication date Sep 12, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
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BONDING METHOD, SUBSTRATE BONDING DEVICE, AND SUBSTRATE BONDING SYSTEM
- Publication number 20240304594
- Publication date Sep 12, 2024
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
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MIXED ACTIVATING AND REDUCING AGENT FOR BONDING
- Publication number 20240290748
- Publication date Aug 29, 2024
- TOKYO ELECTRON LIMITED
- Christopher NETZBAND
- H01 - BASIC ELECTRIC ELEMENTS
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EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHO...
- Publication number 20240222226
- Publication date Jul 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
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STORAGE CONTAINER, PROCESSING APPARATUS, BONDING APPARATUS, PROCESS...
- Publication number 20240213211
- Publication date Jun 27, 2024
- Canon Kabushiki Kaisha
- KENICHIRO MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...
- Publication number 20230402411
- Publication date Dec 14, 2023
- SONY GROUP CORPORATION
- Masaki HANEDA
- H01 - BASIC ELECTRIC ELEMENTS
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GANG-FLIPPING OF DIES PRIOR TO BONDING
- Publication number 20230360950
- Publication date Nov 9, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID INTERCONNECT FOR LASER BONDING USING NANOPOROUS METAL TIPS
- Publication number 20230352437
- Publication date Nov 2, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CLEANING CHAMBER
- Publication number 20230178345
- Publication date Jun 8, 2023
- Kyoungran Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING METHOD USING SELECTIVE DEPOSITION AND SURFACE TREATMENT
- Publication number 20230075263
- Publication date Mar 9, 2023
- TOKYO ELECTRON LIMITED
- Soo Doo Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL BONDING METHOD, PACKAGE-TYPE ELECTRONIC COMPONENT, AND HYB...
- Publication number 20230051810
- Publication date Feb 16, 2023
- Canon ANELVA Corporation
- Takayuki SAITOH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SILICON CARBIDE COMPOSITE WAFER AND MANUFACTURING METHOD THEREOF
- Publication number 20220384385
- Publication date Dec 1, 2022
- Hong Chuang Applied Technology Co., Ltd
- Yan-Kai ZENG
- H01 - BASIC ELECTRIC ELEMENTS
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BONDING SYSTEM AND SURFACE MODIFICATION METHOD
- Publication number 20220384386
- Publication date Dec 1, 2022
- TOKYO ELECTRON LIMITED
- Yuji Mimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING METHODS AND STRUCTURES
- Publication number 20220320035
- Publication date Oct 6, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
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METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE WITH AIR GAP
- Publication number 20220059468
- Publication date Feb 24, 2022
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
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WAFER-BONDING STRUCTURE AND METHOD OF FORMING THEREOF
- Publication number 20220020721
- Publication date Jan 20, 2022
- Integrated Silicon Solution Inc.
- Hsingya Arthur WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH AIR GAP AND MANUFACTURING METHOD THEREOF
- Publication number 20210343654
- Publication date Nov 4, 2021
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-BONDING STRUCTURE AND METHOD OF FORMING THEREOF
- Publication number 20210296281
- Publication date Sep 23, 2021
- Integrated Silicon Solution Inc.
- Hsingya Arthur WANG
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...
- Publication number 20210183661
- Publication date Jun 17, 2021
- SONY CORPORATION
- Masaki HANEDA
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...
- Publication number 20200227462
- Publication date Jul 16, 2020
- SONY CORPORATION
- Masaki HANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST WAFER AND METHOD FOR MANUFACTURING SAME
- Publication number 20200173942
- Publication date Jun 4, 2020
- TOKYO ELECTRON LIMITED
- Shigeru KASAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC PACKAGE WITH RDL INTERPOSER AND RELATED METHOD
- Publication number 20190304954
- Publication date Oct 3, 2019
- GLOBALFOUNDRIES INC.
- Luke G. England
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC PACKAGE WITH RDL INTERPOSER AND RELATED METHOD
- Publication number 20190237430
- Publication date Aug 1, 2019
- GLOBALFOUNDRIES INC.
- Luke G. England
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...
- Publication number 20190206919
- Publication date Jul 4, 2019
- SONY CORPORATION
- Masaki HANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180247913
- Publication date Aug 30, 2018
- Advanced Semiconductor Engineering, Inc.
- Ying-Ta CHIU
- H01 - BASIC ELECTRIC ELEMENTS

Pre-treatment of the bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Embedded cooling assemblies for advanced device packaging and metho...

Silicon carbide composite wafer and manufacturing method thereof

Wafer-bonding structure and method of forming thereof

Chemical bonding method, package-type electronic component, and hyb...

Method for manufacturing semiconductor package with air gap

Semiconductor device, manufacturing method, solid state image senso...

Silicon heater bonded to a test wafer

Hybrid interconnect for laser bonding using nanoporous metal tips

Semiconductor package with air gap and manufacturing method thereof

3D IC package with RDL interposer and related method

Bonding apparatus, bonding system, bonding method and storage medium

Semiconductor device, manufacturing method, solid state image senso...

Bonding system

Bonding apparatus, bonding system, bonding method and storage medium

Semiconductor device, manufacturing method, solid state image senso...

Bonding apparatus, bonding system, bonding method and storage medium

3D IC package with RDL interposer and related method

Semiconductor device, manufacturing method, solid state image senso...

Methods of forming a microelectronic device structure, and related...

Semiconductor device and method for manufacturing the same

Methods of forming a microelectronic device structure, and related...

Substrate bonding with diffusion barrier structures

Integrated circuit device and structure

Patents Applicationslast 30 patents

BONDING LAYERS IN SEMICONDCUTOR PACKAGES AND METHODS OF FORMING

BONDING METHOD AND BONDING SYSTEM

METHOD AND SYSTEM OF PERFORMING COLLECTIVE DIE-TO-WAFER BONDING

APPARATUS INCLUDING A BONDING HEAD AND A METHOD OF USING THE SAME

BONDING METHOD AND BONDING SYSTEM

DIRECT BONDING METHODS AND STRUCTURES

BONDING METHOD, SUBSTRATE BONDING DEVICE, AND SUBSTRATE BONDING SYSTEM

MIXED ACTIVATING AND REDUCING AGENT FOR BONDING

EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHO...

STORAGE CONTAINER, PROCESSING APPARATUS, BONDING APPARATUS, PROCESS...

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...

GANG-FLIPPING OF DIES PRIOR TO BONDING

HYBRID INTERCONNECT FOR LASER BONDING USING NANOPOROUS METAL TIPS

METHOD OF CLEANING CHAMBER

WAFER BONDING METHOD USING SELECTIVE DEPOSITION AND SURFACE TREATMENT

CHEMICAL BONDING METHOD, PACKAGE-TYPE ELECTRONIC COMPONENT, AND HYB...

SILICON CARBIDE COMPOSITE WAFER AND MANUFACTURING METHOD THEREOF

BONDING SYSTEM AND SURFACE MODIFICATION METHOD

DIRECT BONDING METHODS AND STRUCTURES

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE WITH AIR GAP

WAFER-BONDING STRUCTURE AND METHOD OF FORMING THEREOF

SEMICONDUCTOR PACKAGE WITH AIR GAP AND MANUFACTURING METHOD THEREOF

WAFER-BONDING STRUCTURE AND METHOD OF FORMING THEREOF

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...

TEST WAFER AND METHOD FOR MANUFACTURING SAME

3D IC PACKAGE WITH RDL INTERPOSER AND RELATED METHOD

3D IC PACKAGE WITH RDL INTERPOSER AND RELATED METHOD

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME