Pre-treatment of the bump connector or the bonding area

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H01L2224/81009

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81009Pre-treatment of the bump connector or the bonding area

Industries

Patents Grantslast 30 patents

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Information Patent Grant
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No clean flux composition and methods for use thereof
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
Package-on-package (PoP) structure including stud bulbs and method
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Information Patent Grant
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Information Patent Grant
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- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
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- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

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Pre-treatment of the bump connector or the bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Hybrid interconnect for laser bonding using nanoporous metal tips

Contoured package-on-package joint

Manufacturing of flip-chip electronic device with carrier having he...

Flip-chip electronic device with carrier having heat dissipation el...

Contoured package-on-package joint

Package-on-package (PoP) structure including stud bulbs

No clean flux composition and methods for use thereof

Package-on-package (PoP) structure including stud bulbs

Flip-chip electronic device with carrier having heat dissipation el...

Contoured package-on-package joint

Electrostatic discharge protection apparatus and process

Package on-package (PoP) structure including stud bulbs

Protecting flip-chip package using pre-applied fillet

Chip packaging method and chip package using hydrophobic surface

Package on-Package (PoP) structure including stud bulbs and method

Pressure application apparatus and pressure application method

Pressure application apparatus and pressure application method

Package-on-package (PoP) structure including stud bulbs and method

Joining method and device produced by this method and joining unit

Method of manufacturing semiconductor device

Electrode bonding method and part mounting apparatus

Electronic member, electronic part and manufacturing method therefor

Joining method and device produced by this method and joining unit

Joining method and device produced by this method and joining unit

Method for producing and cleaning surface-mountable bases with exte...

Bonding method and apparatus

Patents Applicationslast 30 patents

MULTI-VIEW DEPTH ESTIMATION LEVERAGING OFFLINE STRUCTURE-FROM-MOTION

HYBRID INTERCONNECT FOR LASER BONDING USING NANOPOROUS METAL TIPS

ELECTRICAL CONNECTION METHOD FOR ELECTRONIC ELEMENT, AND RELATED AP...

Contoured Package-on-Package Joint

Package-On-Package (PoP) Structure Including Stud Bulbs

FLIP-CHIP ELECTRONIC DEVICE WITH CARRIER HAVING HEAT DISSIPATION EL...

Contoured Package-on-Package Joint

NO CLEAN FLUX COMPOSITION AND METHODS FOR USE THEREOF

Package-On-Package (PoP) Structure Including Stud Bulbs

NO CLEAN FLUX COMPOSITION AND METHODS FOR USE THEREOF

ELECTROSTATIC DISCHARGE PROTECTION APPARATUS AND PROCESS

FLIP-CHIP ELECTRONIC DEVICE WITH CARRIER HAVING HEAT DISSIPATION EL...

Contoured Package-on-Package Joint

Protecting Flip-Chip Package using Pre-Applied Fillet

Contoured Package-on-Package Joint

Package-On-Package (PoP) Structure and Method

PRESSURE APPLICATION APPARATUS AND PRESSURE APPLICATION METHOD

Protecting Flip-Chip Package using Pre-Applied Fillet

JOINING METHOD AND DEVICE PRODUCED BY THIS METHOD AND JOINING UNIT

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

JOINING METHOD AND DEVICE PRODUCED BY THIS METHOD AND JOINING UNIT

ELECTRONIC MEMBER, ELECTRONIC PART AND MANUFACTURING METHOD THEREFOR

ELECTRODE BONDING METHOD AND PART MOUNTING APPARATUS

Joining Method and Device Produced by this Method and Joining Unit

Bonding method and apparatus

Method For Producing And Cleaning Surface-Mountable Bases With Exte...

Bonding apparatus and method

Joining apparatus