Pre-treatment of the layer connector or the bonding area

Industry

CPC
H01L2224/83009

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83009Pre-treatment of the layer connector or the bonding area

Industries

Patents Grantslast 30 patents

Information Patent Grant
DBI to SI bonding for simplified handle wafer
- Patent number 11,791,307
- Issue date Oct 17, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive bonding composition and method of use
- Patent number 11,648,750
- Issue date May 16, 2023
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for producing an at least partly packaged semiconductor wafer
- Patent number 11,018,029
- Issue date May 25, 2021
- United Monolithic Semiconductors GmbH
- Hermann Stieglauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,985,132
- Issue date Apr 20, 2021
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
DBI to Si bonding for simplified handle wafer
- Patent number 10,964,664
- Issue date Mar 30, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding semiconductor substrates
- Patent number 10,886,252
- Issue date Jan 5, 2021
- Imec VZW
- Lan Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,756,046
- Issue date Aug 25, 2020
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Adhesive bonding composition and method of use
- Patent number 10,734,353
- Issue date Aug 4, 2020
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of manufacturing optical component
- Patent number 10,593,843
- Issue date Mar 17, 2020
- Nichia Corporation
- Masatsugu Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates together, and substrate bonding device
- Patent number 10,580,752
- Issue date Mar 3, 2020
- BONDTECH CO., LTD.
- Akira Yamauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,438,920
- Issue date Oct 8, 2019
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Adhesive bonding composition and method of use
- Patent number 10,410,991
- Issue date Sep 10, 2019
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanent bonding of wafers
- Patent number 10,083,933
- Issue date Sep 25, 2018
- EV Group E. Thallner GmbH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,032,758
- Issue date Jul 24, 2018
- Kabushiki Kaisha Toshiba
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of attaching an electronic part to a copper plate having a s...
- Patent number 9,831,157
- Issue date Nov 28, 2017
- Dowa Metaltech Co., Ltd.
- Naoya Sunachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of a stack of electronic devices
- Patent number 9,786,658
- Issue date Oct 10, 2017
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Benoit Mathieu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fastening chips with a contact element onto a substrate...
- Patent number 9,245,869
- Issue date Jan 26, 2016
- EV Group E. Thallner GmbH
- Jurgen Burggraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,373,284
- Issue date Feb 12, 2013
- NEC Corporation
- Toshinobu Ogatsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HEAT DISSIPATION IN SEMICONDUCTOR DEVICES
- Publication number 20250006687
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zheng-Yong Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER
- Publication number 20240282747
- Publication date Aug 22, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER
- Publication number 20240186284
- Publication date Jun 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A POLYMER LAYER
- Publication number 20240071976
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH UNDERFILL FLOW CONTROL
- Publication number 20230378124
- Publication date Nov 23, 2023
- Intel Corporation
- Frederick Atadana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20230191747
- Publication date Jun 22, 2023
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER
- Publication number 20210233889
- Publication date Jul 29, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Chandrasekhar MANDALAPU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN AT LEAST PARTLY PACKAGED SEMICONDUCTOR WAFER
- Publication number 20210013052
- Publication date Jan 14, 2021
- UNITED MONOLITHIC SEMICONDUCTORS GMBH
- Hermann STIEGLAUER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20200365552
- Publication date Nov 19, 2020
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20190341364
- Publication date Nov 7, 2019
- Immunolight, LLC
- Zakaryae Fathi
- B32 - LAYERED PRODUCTS
Information Patent Application
DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER
- Publication number 20190326252
- Publication date Oct 24, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Chandrasekhar MANDALAPU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENT BONDING OF WAFERS
- Publication number 20190006313
- Publication date Jan 3, 2019
- EV GROUP E. THALLNER GMBH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20180308831
- Publication date Oct 25, 2018
- Kabushiki Kaisha Toshiba
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING SEMICONDUCTOR SUBSTRATES
- Publication number 20180247914
- Publication date Aug 30, 2018
- IMEC vzw
- Lan Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING OPTICAL COMPONENT
- Publication number 20180248087
- Publication date Aug 30, 2018
- Nichia Corporation.
- Masatsugu ICHIKAWA
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD AND STORAGE MEDIUM
- Publication number 20180158796
- Publication date Jun 7, 2018
- TOKYO ELECTRON LIMITED
- Yoshitaka OTSUKA
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20170263595
- Publication date Sep 14, 2017
- Kabushiki Kaisha Toshiba
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING SUBSTRATES TOGETHER, AND SUBSTRATE BONDING DEVICE
- Publication number 20170221856
- Publication date Aug 3, 2017
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF A STACK OF ELECTRONIC DEVICES
- Publication number 20170179114
- Publication date Jun 22, 2017
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Benoit MATHIEU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Method, Storage Medium, Bonding Apparatus and Bonding System
- Publication number 20160155721
- Publication date Jun 2, 2016
- TOKYO ELECTRON LIMITED
- Kenji SUGAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENT BONDING OF WAFERS
- Publication number 20160111394
- Publication date Apr 21, 2016
- EV GROUP E. THALLNER GMBH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL NANOPATTERNABLE INTERFACIAL BONDING
- Publication number 20140283982
- Publication date Sep 25, 2014
- Tingrui Pan
- B32 - LAYERED PRODUCTS
Information Patent Application
ELECTRONIC PART MOUNTING SUBSTRATE AND METHOD FOR PRODUCING SAME
- Publication number 20140147695
- Publication date May 29, 2014
- DOWA METALTECH CO., LTD.
- Naoya Sunachi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PERMANENT BONDING OF WAFERS
- Publication number 20130299080
- Publication date Nov 14, 2013
- EV Group E. Thallner GmbH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Attachment Layer Having Traverse-Aligned Conductive Filler Par...
- Publication number 20120107552
- Publication date May 3, 2012
- TEXAS INSTRUMENTS INCORPORATED
- John P. TELLKAMP
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SUBSTRATE STRUCTURE FOR FLIP-CHIP INTERCONNECT DEVICE
- Publication number 20100289138
- Publication date Nov 18, 2010
- Kenji Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100213622
- Publication date Aug 26, 2010
- Toshinobu Ogatsu
- H01 - BASIC ELECTRIC ELEMENTS

Pre-treatment of the layer connector or the bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

DBI to SI bonding for simplified handle wafer

Adhesive bonding composition and method of use

Method for producing an at least partly packaged semiconductor wafer

Bonding apparatus, bonding system, bonding method and storage medium

DBI to Si bonding for simplified handle wafer

Method of bonding semiconductor substrates

Bonding apparatus, bonding system, bonding method and storage medium

Adhesive bonding composition and method of use

Method of manufacturing optical component

Method for bonding substrates together, and substrate bonding device

Bonding apparatus, bonding system, bonding method and storage medium

Adhesive bonding composition and method of use

Method for permanent bonding of wafers

Method of manufacturing semiconductor device

Method of attaching an electronic part to a copper plate having a s...

Fabrication method of a stack of electronic devices

Method for fastening chips with a contact element onto a substrate...

Semiconductor device

Patents Applicationslast 30 patents

HEAT DISSIPATION IN SEMICONDUCTOR DEVICES

DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER

DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER

SEMICONDUCTOR DEVICE WITH A POLYMER LAYER

MICROELECTRONIC ASSEMBLY WITH UNDERFILL FLOW CONTROL

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER

METHOD FOR PRODUCING AN AT LEAST PARTLY PACKAGED SEMICONDUCTOR WAFER

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER

METHOD FOR PERMANENT BONDING OF WAFERS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF BONDING SEMICONDUCTOR SUBSTRATES

METHOD OF MANUFACTURING OPTICAL COMPONENT

BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD AND STORAGE MEDIUM

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR BONDING SUBSTRATES TOGETHER, AND SUBSTRATE BONDING DEVICE

FABRICATION METHOD OF A STACK OF ELECTRONIC DEVICES

Bonding Method, Storage Medium, Bonding Apparatus and Bonding System

METHOD FOR PERMANENT BONDING OF WAFERS

UNIVERSAL NANOPATTERNABLE INTERFACIAL BONDING

ELECTRONIC PART MOUNTING SUBSTRATE AND METHOD FOR PRODUCING SAME

METHOD FOR PERMANENT BONDING OF WAFERS

Chip Attachment Layer Having Traverse-Aligned Conductive Filler Par...

SUBSTRATE STRUCTURE FOR FLIP-CHIP INTERCONNECT DEVICE

SEMICONDUCTOR DEVICE