Preliminary treatment of the selenium or tellurium, its application to the foundation plate, or the subsequent treatment of the combination

Industry

CPC
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/10Preliminary treatment of the selenium or tellurium, its application to the foundation plate, or the subsequent treatment of the combination

Industries

Patents Grantslast 30 patents

Information Patent Grant
Transistor structure with a stress layer
- Patent number 11,349,003
- Issue date May 31, 2022
- Cambridge Electronics, Inc.
- Bin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages and stacked package assemblies includ...
- Patent number 10,916,429
- Issue date Feb 9, 2021
- Advanced Semiconductor Engineering, Inc.
- John Richard Hunt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages and stacked package assemblies includ...
- Patent number 10,535,521
- Issue date Jan 14, 2020
- Advanced Semiconductor Engineering, Inc.
- John Richard Hunt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages and stacked package assemblies includ...
- Patent number 10,515,806
- Issue date Dec 24, 2019
- Advanced Semiconductor Engineering, Inc.
- John Richard Hunt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages and stacked package assemblies includ...
- Patent number 10,276,382
- Issue date Apr 30, 2019
- Advanced Semiconductor Engineering, Inc.
- John Richard Hunt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including chip enablement pads
- Patent number 10,002,851
- Issue date Jun 19, 2018
- SK hynix Inc.
- Ki Yong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making quantum dots
- Patent number 10,000,862
- Issue date Jun 19, 2018
- Samsung Electronics Co., Ltd.
- Wenhao Liu
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of forming semiconductor device having contact pad on source...
- Patent number RE46890
- Issue date Jun 12, 2018
- Samsung Electronics Co., Ltd.
- Kang-Yoon Lee
Information Patent Grant
Method of positioning elements, particularly optical elements, on t...
- Patent number 9,922,933
- Issue date Mar 20, 2018
- Societe Francaise de Detecteurs Infrarouges-Sofradir
- Olivier Chevrier
- C30 - CRYSTAL GROWTH
Information Patent Grant
Electronic modules
- Patent number 9,018,753
- Issue date Apr 28, 2015
- STMicroelectronics Pte Ltd
- Wing Shenq Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board unit and semiconductor package
- Patent number 8,023,268
- Issue date Sep 20, 2011
- Fujitsu Limited
- Kenji Fukuzono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intermediate semiconductor device having activated oxide-based laye...
- Patent number 7,042,010
- Issue date May 9, 2006
- Micron Technology, Inc.
- Nishant Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Activation of oxides for electroless plating
- Patent number 6,900,128
- Issue date May 31, 2005
- Micron Technology, Inc.
- Nishant Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Activation of oxides for electroless plating
- Patent number 6,872,659
- Issue date Mar 29, 2005
- Micron Technology, Inc.
- Nishant Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selenium rectifier
- Patent number 3,935,582
- Issue date Jan 27, 1976
- International Standard Electric Corporation
- John Duckles Underwood
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
3694908
- Patent number 3,694,908
- Issue date Oct 3, 1972
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3622712
- Patent number 3,622,712
- Issue date Nov 23, 1971
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3599058
- Patent number 3,599,058
- Issue date Aug 10, 1971
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3514323
- Patent number 3,514,323
- Issue date May 26, 1970
- C30 - CRYSTAL GROWTH
Information Patent Grant
3450967
- Patent number 3,450,967
- Issue date Jun 17, 1969
- G11 - INFORMATION STORAGE
Information Patent Grant
3445738
- Patent number 3,445,738
- Issue date May 20, 1969
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3367024
- Patent number 3,367,024
- Issue date Feb 6, 1968
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3170218
- Patent number 3,170,218
- Issue date Feb 23, 1965
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
2956218
- Patent number 2,956,218
- Issue date Oct 11, 1960
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
2933661
- Patent number 2,933,661
- Issue date Apr 19, 1960
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
2921834
- Patent number 2,921,834
- Issue date Jan 19, 1960
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
2918613
- Patent number 2,918,613
- Issue date Dec 22, 1959
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
2915686
- Patent number 2,915,686
- Issue date Dec 1, 1959
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
2914837
- Patent number 2,914,837
- Issue date Dec 1, 1959
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
2912353
- Patent number 2,912,353
- Issue date Nov 10, 1959
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Transistor Structure With A Stress Layer
- Publication number 20200365394
- Publication date Nov 19, 2020
- Cambridge Electronics, Inc.
- Bin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND STACKED PACKAGE ASSEMBLIES INCLUD...
- Publication number 20200111671
- Publication date Apr 9, 2020
- Advanced Semiconductor Engineering, Inc.
- John Richard HUNT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND STACKED PACKAGE ASSEMBLIES INCLUD...
- Publication number 20190206684
- Publication date Jul 4, 2019
- Advanced Semiconductor Engineering, Inc.
- John Richard HUNT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND STACKED PACKAGE ASSEMBLIES INCLUD...
- Publication number 20190206683
- Publication date Jul 4, 2019
- Advanced Semiconductor Engineering, Inc.
- John Richard HUNT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND STACKED PACKAGE ASSEMBLIES INCLUD...
- Publication number 20180047571
- Publication date Feb 15, 2018
- Advanced Semiconductor Engineering, Inc.
- John Richard HUNT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed circuit board unit and semiconductor package
- Publication number 20100014254
- Publication date Jan 21, 2010
- FUJITSU LIMITED
- Kenji Fukuzono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MESA-TYPE BIPOLAR TRANSISTOR
- Publication number 20070241427
- Publication date Oct 18, 2007
- Kazuhiro Mochizuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Intermediate semiconductor device having activated oxide-based laye...
- Publication number 20050205933
- Publication date Sep 22, 2005
- Nishant Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Activation of oxides for electroless plating
- Publication number 20050023687
- Publication date Feb 3, 2005
- Nishant Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Activation of oxides for electroless plating
- Publication number 20040033687
- Publication date Feb 19, 2004
- Nishant Sinha
- H01 - BASIC ELECTRIC ELEMENTS

Preliminary treatment of the selenium or tellurium, its application to the foundation plate, or the subsequent treatment of the combination

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Transistor structure with a stress layer

Semiconductor device packages and stacked package assemblies includ...

Semiconductor device packages and stacked package assemblies includ...

Semiconductor device packages and stacked package assemblies includ...

Semiconductor device packages and stacked package assemblies includ...

Semiconductor packages including chip enablement pads

Method of making quantum dots

Method of forming semiconductor device having contact pad on source...

Method of positioning elements, particularly optical elements, on t...

Electronic modules

Printed circuit board unit and semiconductor package

Intermediate semiconductor device having activated oxide-based laye...

Activation of oxides for electroless plating

Activation of oxides for electroless plating

Selenium rectifier

3694908

3622712

3599058

3514323

3450967

3445738

3367024

3170218

2956218

2933661

2921834

2918613

2915686

2914837

2912353

Patents Applicationslast 30 patents

Transistor Structure With A Stress Layer

SEMICONDUCTOR DEVICE PACKAGES AND STACKED PACKAGE ASSEMBLIES INCLUD...

SEMICONDUCTOR DEVICE PACKAGES AND STACKED PACKAGE ASSEMBLIES INCLUD...

SEMICONDUCTOR DEVICE PACKAGES AND STACKED PACKAGE ASSEMBLIES INCLUD...

SEMICONDUCTOR DEVICE PACKAGES AND STACKED PACKAGE ASSEMBLIES INCLUD...

Printed circuit board unit and semiconductor package

MESA-TYPE BIPOLAR TRANSISTOR

Intermediate semiconductor device having activated oxide-based laye...

Activation of oxides for electroless plating

Activation of oxides for electroless plating