Press-fitting, i.e. pushing the parts together and fastening by friction

Industry

CPC
H01L2224/80898

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/80898Press-fitting, i.e. pushing the parts together and fastening by friction

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods of achieving universal interfacing using suspended and/or f...
- Patent number 10,807,864
- Issue date Oct 20, 2020
- The Regents of the University of Colorado, a Body Corporate
- Joseph J. Brown
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Small footprint semiconductor package
- Patent number 9,666,557
- Issue date May 30, 2017
- Infineon Technologies AG
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for packaging circuits
- Patent number 8,138,617
- Issue date Mar 20, 2012
- Round Rock Research, LLC
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for packaging circuits
- Patent number 8,115,306
- Issue date Feb 14, 2012
- Round Rock Research, LLC
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for packaging circuits
- Patent number 7,675,169
- Issue date Mar 9, 2010
- Micron Technology, Inc.
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating packaged die
- Patent number 7,358,154
- Issue date Apr 15, 2008
- Micron Technology, Inc.
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for packaging circuits
- Patent number 6,894,386
- Issue date May 17, 2005
- Micron Technology, Inc.
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF ACHIEVING UNIVERSAL INTERFACING USING SUSPENDED AND/OR F...
- Publication number 20180215613
- Publication date Aug 2, 2018
- The Regents of the University of Colorado, a Body Corporate
- JOSEPH J. BROWN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Small Footprint Semiconductor Package
- Publication number 20140353766
- Publication date Dec 4, 2014
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR PACKAGING CIRCUITS
- Publication number 20100140794
- Publication date Jun 10, 2010
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR PACKAGING CIRCUITS
- Publication number 20080054423
- Publication date Mar 6, 2008
- Micron Technology, Inc.
- Chia Y. Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for packaging circuits
- Publication number 20060084240
- Publication date Apr 20, 2006
- Micron Technology, Inc.
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for packaging circuits
- Publication number 20050029668
- Publication date Feb 10, 2005
- Micron Technology, Inc.
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for packaging circuits
- Publication number 20030067001
- Publication date Apr 10, 2003
- Micron Technology, Inc.
- Chin Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS

Press-fitting, i.e. pushing the parts together and fastening by friction

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of achieving universal interfacing using suspended and/or f...

Small footprint semiconductor package

Apparatus and method for packaging circuits

Apparatus and method for packaging circuits

Apparatus and method for packaging circuits

Method for fabricating packaged die

Apparatus and method for packaging circuits

Patents Applicationslast 30 patents

METHODS OF ACHIEVING UNIVERSAL INTERFACING USING SUSPENDED AND/OR F...

Small Footprint Semiconductor Package

APPARATUS AND METHOD FOR PACKAGING CIRCUITS

APPARATUS AND METHOD FOR PACKAGING CIRCUITS

Apparatus and method for packaging circuits

Apparatus and method for packaging circuits

Apparatus and method for packaging circuits