Press-fitting, i.e. pushing the parts together and fastening by friction

Industry

CPC
H01L2224/83898

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83898Press-fitting, i.e. pushing the parts together and fastening by friction

Industries

Patents Grantslast 30 patents

Information Patent Grant
Micro device transferring method, and micro device substrate manufa...
- Patent number 10,770,426
- Issue date Sep 8, 2020
- CENTER FOR ADVANCED META-MATERIALS
- Yun Hwangbo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a substrate arrangement, substrate arrangement...
- Patent number 10,622,331
- Issue date Apr 14, 2020
- Heraeus Deutschland GmbH & Co. KG
- Andreas Hinrich
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Composite wafer including a molded wafer and a second wafer
- Patent number 9,354,388
- Issue date May 31, 2016
- Hewlett Packard Enterprise Development LP
- Michael Renne Ty Tan
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for mounting a semiconductor chip on a carrier
- Patent number 9,034,751
- Issue date May 19, 2015
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite wafer including a molded wafer and a second wafer
- Patent number 8,822,275
- Issue date Sep 2, 2014
- Hewlett-Packard Development Company, L.P.
- Michael Renne Ty Tan
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for mounting a semiconductor chip on a carrier
- Patent number 8,802,553
- Issue date Aug 12, 2014
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-adhering chip
- Patent number 6,756,540
- Issue date Jun 29, 2004
- Infineon Technologies AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING A SUBSTRATE ARRANGEMENT, SUBSTRATE ARRANGEMENT...
- Publication number 20180286831
- Publication date Oct 4, 2018
- Heraeus Deutschland GmbH & Co. KG
- Andreas HINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE WAFER INCLUDING A MOLDED WAFER AND A SECOND WAFER
- Publication number 20140334774
- Publication date Nov 13, 2014
- Michael Renne Ty Tan
- G02 - OPTICS
Information Patent Application
Method for Mounting a Semiconductor Chip on a Carrier
- Publication number 20140329361
- Publication date Nov 6, 2014
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE WAFER INCLUDING A MOLDED WAFER AND A SECOND WAFER
- Publication number 20130286614
- Publication date Oct 31, 2013
- Michael Renne Ty Tan
- G02 - OPTICS
Information Patent Application
Method for Mounting a Semiconductor Chip on a Carrier
- Publication number 20120208323
- Publication date Aug 16, 2012
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-adhering chip
- Publication number 20030035276
- Publication date Feb 20, 2003
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS

Press-fitting, i.e. pushing the parts together and fastening by friction

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Micro device transferring method, and micro device substrate manufa...

Method for producing a substrate arrangement, substrate arrangement...

Composite wafer including a molded wafer and a second wafer

Method for mounting a semiconductor chip on a carrier

Composite wafer including a molded wafer and a second wafer

Method for mounting a semiconductor chip on a carrier

Self-adhering chip

Patents Applicationslast 30 patents

METHOD FOR PRODUCING A SUBSTRATE ARRANGEMENT, SUBSTRATE ARRANGEMENT...

COMPOSITE WAFER INCLUDING A MOLDED WAFER AND A SECOND WAFER

Method for Mounting a Semiconductor Chip on a Carrier

COMPOSITE WAFER INCLUDING A MOLDED WAFER AND A SECOND WAFER

Method for Mounting a Semiconductor Chip on a Carrier

Self-adhering chip