Press-fitting, i.e. pushing the parts together and fastening by friction

Industry

CPC
H01L2224/81898

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81898Press-fitting, i.e. pushing the parts together and fastening by friction

Industries

Patents Grantslast 30 patents

Information Patent Grant
Supporting backplane, manufacturing method therefor and backplane
- Patent number 12,087,892
- Issue date Sep 10, 2024
- BOE Technology Group Co., Ltd.
- Zhiwei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor product with interlocking metal-to-metal bonds and me...
- Patent number 12,015,000
- Issue date Jun 18, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of providing the same
- Patent number 11,950,467
- Issue date Apr 2, 2024
- Samsung Display Co., Ltd.
- Byoungyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the electrical bonding of semiconductor components
- Patent number 11,362,061
- Issue date Jun 14, 2022
- Imec VZW
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor product with interlocking metal-to-metal bonds and me...
- Patent number 11,018,102
- Issue date May 25, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and method for producing same
- Patent number 10,932,386
- Issue date Feb 23, 2021
- Dyconex AG
- Marc Hauer
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Package structure and bonding method thereof
- Patent number 10,756,050
- Issue date Aug 25, 2020
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor product with interlocking metal-to-metal bonds and me...
- Patent number 10,438,910
- Issue date Oct 8, 2019
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact bump connection and contact bump and method for producing a...
- Patent number 10,292,270
- Issue date May 14, 2019
- SMARTRAC TECHNOLOGY GmbH
- Carsten Nieland
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Bonding structure for semiconductor package and method of manufactu...
- Patent number 9,984,993
- Issue date May 29, 2018
- Advanced Semiconductor Engineering, Inc.
- Min-Fong Shu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-scrub process for fluxless micro-bump bonding
- Patent number 9,875,986
- Issue date Jan 23, 2018
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the semiconductor...
- Patent number 9,786,587
- Issue date Oct 10, 2017
- Fuji Electric Co., Ltd.
- Tatsuo Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 9,691,739
- Issue date Jun 27, 2017
- Tessera Advanced Technologies, Inc.
- Michihiro Kawashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced metal-to-metal direct bonding
- Patent number 9,640,509
- Issue date May 2, 2017
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor product with interlocking metal-to-metal bonds and me...
- Patent number 9,559,075
- Issue date Jan 31, 2017
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the semiconductor...
- Patent number 9,406,603
- Issue date Aug 2, 2016
- Fuji Electric Co., Ltd.
- Tatsuo Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack packages and methods of fabricating the same
- Patent number 9,368,482
- Issue date Jun 14, 2016
- SK hynix Inc.
- Jong Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact bumps methods of making contact bumps
- Patent number 9,215,809
- Issue date Dec 15, 2015
- SMARTRAC TECHNOLOGY GmbH
- Carsten Nieland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stack packages and methods of fabricating the same
- Patent number 9,214,410
- Issue date Dec 15, 2015
- SK Hynix Inc.
- Jong Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for controlling positions of stacked dies
- Patent number 9,209,165
- Issue date Dec 8, 2015
- Oracle International Corporation
- Michael H. S. Dayringer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for stacked dies, including penetrating str...
- Patent number 9,165,888
- Issue date Oct 20, 2015
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assemblies including mechanically secured protruding bon...
- Patent number 8,859,414
- Issue date Oct 14, 2014
- Texas Instruments Incorporated
- Jeffrey A West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,816,506
- Issue date Aug 26, 2014
- Tessera Advanced Technologies, Inc.
- Michihiro Kawashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for thin die-to-wafer bonding
- Patent number 8,697,542
- Issue date Apr 15, 2014
- The Research Foundation of State University of New York
- Daniel Pascual
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect structures for stacked dies, including penetrating str...
- Patent number 8,680,654
- Issue date Mar 25, 2014
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress reduction in chip packaging by using a low-temperature chip-...
- Patent number 8,482,123
- Issue date Jul 9, 2013
- GLOBALFOUNDRIES Inc.
- Michael Grillberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for stacked dies, including penetrating str...
- Patent number 8,435,836
- Issue date May 7, 2013
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed pillar structure
- Patent number 8,241,963
- Issue date Aug 14, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assemblies including mechanically secured protruding bon...
- Patent number 8,143,704
- Issue date Mar 27, 2012
- Texas Instruments Incorporated
- Jeffrey A West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,106,518
- Issue date Jan 31, 2012
- Renesas Electronics Corporation
- Michihiro Kawashita
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE BONDING METHOD
- Publication number 20240038705
- Publication date Feb 1, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yunzhi LING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORTING BACKPLANE, MANUFACTURING METHOD THEREFOR AND BACKPLANE
- Publication number 20230131247
- Publication date Apr 27, 2023
- BOE TECHNOLOGY GROUP CO., LTD.
- Zhiwei LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF PROVIDING THE SAME
- Publication number 20220392989
- Publication date Dec 8, 2022
- BYOUNGYONG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE ELECTRONIC STRUCTURE
- Publication number 20220238472
- Publication date Jul 28, 2022
- PRAGMATIC PRINTING LTD.
- Brian COBB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR THE ELECTRICAL BONDING OF SEMICONDUCTOR COMPONENTS
- Publication number 20200402950
- Publication date Dec 24, 2020
- IMEC vzw
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND BONDING METHOD THEREOF
- Publication number 20200043890
- Publication date Feb 6, 2020
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PRODUCT WITH INTERLOCKING METAL-TO-METAL BONDS AND ME...
- Publication number 20200020654
- Publication date Jan 16, 2020
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING PROCESS
- Publication number 20180076169
- Publication date Mar 15, 2018
- RODAN (TAIWAN) LTD.
- Kuo-Kuang CHANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO-SCRUB PROCESS FOR FLUXLESS MICRO-BUMP BONDING
- Publication number 20170103963
- Publication date Apr 13, 2017
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...
- Publication number 20170033075
- Publication date Feb 2, 2017
- Advanced Semiconductor, Inc.
- Min-Fong SHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Bump Connection and Contact Bump and Method for Producing a...
- Publication number 20150208508
- Publication date Jul 23, 2015
- SMARTRAC TECHNOLOGY GmbH
- Carsten Nieland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20140246783
- Publication date Sep 4, 2014
- Fuji Electric Co., Ltd.
- Tatsuo NISHIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE PROCESS AND STRUCTURE THEREOF
- Publication number 20140217578
- Publication date Aug 7, 2014
- Chipbond Technology Corporation
- Lung-Hua Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...
- Publication number 20140206145
- Publication date Jul 24, 2014
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact bumps methods of making contact bumps
- Publication number 20140084460
- Publication date Mar 27, 2014
- SMARTRAC TECHNOLOGY GmbH
- Carsten Nieland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNING HYBRIDIZATION METHOD
- Publication number 20140061911
- Publication date Mar 6, 2014
- TELEDYNE SCIENTIFIC & IMAGING, LLC
- Donald E. Cooper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNING HYBRIDIZATION METHOD
- Publication number 20140061838
- Publication date Mar 6, 2014
- TELEDYNE SCIENTIFIC & IMAGING, LLC
- PHILIP A. STUPAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR THIN DIE-TO-WAFER BONDING
- Publication number 20130273691
- Publication date Oct 17, 2013
- THE RESEARCH FOUNDATION OF STATE UNIVERSITY OF NEW YORK
- Daniel PASCUAL
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...
- Publication number 20130234296
- Publication date Sep 12, 2013
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Assemblies Including Mechanically Secured Protruding Bon...
- Publication number 20120149155
- Publication date Jun 14, 2012
- TEXAS INSTRUMENTS INCORPORATED
- JEFFREY A. WEST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120091583
- Publication date Apr 19, 2012
- Michihiro KAWASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress Reduction in Chip Packaging by Using a Low-Temperature Chip-...
- Publication number 20120049350
- Publication date Mar 1, 2012
- GLOBALFOUNDRIES INC.
- Michael Grillberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILEVEL INTERCONNECTION SYSTEM
- Publication number 20120045909
- Publication date Feb 23, 2012
- NXP B.V.
- Erich Pischler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Recessed Pillar Structure
- Publication number 20120012997
- Publication date Jan 19, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...
- Publication number 20110111561
- Publication date May 12, 2011
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLIES INCLUDING MECHANICALLY SECURED PROTRUDING BON...
- Publication number 20110079916
- Publication date Apr 7, 2011
- TEXAS INSTRUMENTS INCORPORATED
- JEFFREY A. WEST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100155940
- Publication date Jun 24, 2010
- Renesas Technology Corp.
- Michihiro KAWASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...
- Publication number 20100059897
- Publication date Mar 11, 2010
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Nanowires For Electrical Interconnect
- Publication number 20100018747
- Publication date Jan 28, 2010
- Shih-Yuan Wang
- B82 - NANO-TECHNOLOGY
Information Patent Application
Apparatus incorporating small-feature-size and large-feature-size c...
- Publication number 20070117274
- Publication date May 24, 2007
- Susan Swindlehurst
- G06 - COMPUTING CALCULATING COUNTING

Press-fitting, i.e. pushing the parts together and fastening by friction

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Supporting backplane, manufacturing method therefor and backplane

Semiconductor product with interlocking metal-to-metal bonds and me...

Display device and method of providing the same

Method for the electrical bonding of semiconductor components

Semiconductor product with interlocking metal-to-metal bonds and me...

Electronic module and method for producing same

Package structure and bonding method thereof

Semiconductor product with interlocking metal-to-metal bonds and me...

Contact bump connection and contact bump and method for producing a...

Bonding structure for semiconductor package and method of manufactu...

Micro-scrub process for fluxless micro-bump bonding

Semiconductor device and method for manufacturing the semiconductor...

Semiconductor device and method of manufacturing same

Advanced metal-to-metal direct bonding

Semiconductor product with interlocking metal-to-metal bonds and me...

Semiconductor device and method for manufacturing the semiconductor...

Stack packages and methods of fabricating the same

Contact bumps methods of making contact bumps

Stack packages and methods of fabricating the same

Technique for controlling positions of stacked dies

Interconnect structures for stacked dies, including penetrating str...

Electronic assemblies including mechanically secured protruding bon...

Semiconductor device and method of manufacturing the same

Method for thin die-to-wafer bonding

Interconnect structures for stacked dies, including penetrating str...

Stress reduction in chip packaging by using a low-temperature chip-...

Interconnect structures for stacked dies, including penetrating str...

Recessed pillar structure

Electronic assemblies including mechanically secured protruding bon...

Semiconductor device and method of manufacturing the same

Patents Applicationslast 30 patents

SUBSTRATE BONDING METHOD

SUPPORTING BACKPLANE, MANUFACTURING METHOD THEREFOR AND BACKPLANE

DISPLAY DEVICE AND METHOD OF PROVIDING THE SAME

FLEXIBLE ELECTRONIC STRUCTURE

METHOD FOR THE ELECTRICAL BONDING OF SEMICONDUCTOR COMPONENTS

PACKAGE STRUCTURE AND BONDING METHOD THEREOF

SEMICONDUCTOR PRODUCT WITH INTERLOCKING METAL-TO-METAL BONDS AND ME...

CHIP BONDING PROCESS

MICRO-SCRUB PROCESS FOR FLUXLESS MICRO-BUMP BONDING

BONDING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...

Contact Bump Connection and Contact Bump and Method for Producing a...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE PROCESS AND STRUCTURE THEREOF

INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...

Contact bumps methods of making contact bumps

SELF-ALIGNING HYBRIDIZATION METHOD

SELF-ALIGNING HYBRIDIZATION METHOD

APPARATUS AND METHOD FOR THIN DIE-TO-WAFER BONDING

INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...

Electronic Assemblies Including Mechanically Secured Protruding Bon...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Stress Reduction in Chip Packaging by Using a Low-Temperature Chip-...

MULTILEVEL INTERCONNECTION SYSTEM

Recessed Pillar Structure

INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...

ELECTRONIC ASSEMBLIES INCLUDING MECHANICALLY SECURED PROTRUDING BON...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...

Conductive Nanowires For Electrical Interconnect

Apparatus incorporating small-feature-size and large-feature-size c...