Pressing a bonding area against another bonding area by means of a further bonding area or connector

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CPC
H01L2224/80901

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/80901Pressing a bonding area against another bonding area by means of a further bonding area or connector

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Patents Grantslast 30 patents

Information Patent Grant
Ultrathin layer for forming a capacitive interface between joined i...
- Patent number 10,600,760
- Issue date Mar 24, 2020
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents