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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    ELECTRICAL JUNCTION BOX AND WIRE HARNESS
    • Publication number 20240389278
    • Publication date Nov 21, 2024
    • YAZAKI CORPORATION
    • Kazuki Shirosaka
    • B60 - VEHICLES IN GENERAL
  • Information Patent Application

    HEAT DISSIPATION APPARATUS AND ELECTRONIC DEVICE
    • Publication number 20240373588
    • Publication date Nov 7, 2024
    • ZTE Corporation
    • Zhenjie LI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DESKTOP ELECTRONIC DEVICE
    • Publication number 20240345635
    • Publication date Oct 17, 2024
    • Apple Inc.
    • Brett W. DEGNER
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    STRUCTURE FOR EVENLY APPLYING FORCES ON A HEAT DISSIPATION BASE PLATE
    • Publication number 20240349459
    • Publication date Oct 17, 2024
    • ASIA VITAL COMPONENTS (CHINA) CO., LTD.
    • Xue-Hui Liu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CORRUGATED THERMAL INTERFACE DEVICE WITH LATERAL SPRING FINGERS
    • Publication number 20240329342
    • Publication date Oct 3, 2024
    • HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
    • Harvey John Lunsman
    • G02 - OPTICS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20240334619
    • Publication date Oct 3, 2024
    • Mitsubishi Electric Corporation
    • Eri Kuwahara
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    HEAT DISSIPATION STRUCTURE OF OPTICAL TRANSCEIVER AND OPTICAL TRANS...
    • Publication number 20240302599
    • Publication date Sep 12, 2024
    • Cloud Light Technology Limited
    • CHIEH-TSE HUANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT ASSEMBLY
    • Publication number 20240249900
    • Publication date Jul 25, 2024
    • AUTONETWORKS TECHNOLOGIES, LTD.
    • Taiji YANAGIDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ACTUATING HEATSINK FOR PLUGGABLE MODULES
    • Publication number 20240206127
    • Publication date Jun 20, 2024
    • Juniper Networks, Inc.
    • Jimmy Chun-Chuen LEUNG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    HEAT DISSIPATION COMPONENT AND ASSOCIATED ELECTRICAL DEVICE
    • Publication number 20240206129
    • Publication date Jun 20, 2024
    • Nokia Shanghai Bell Co., Ltd.
    • Hua CAI
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    Low Profile Attachment Method for Pluggable Optical Modules
    • Publication number 20240192454
    • Publication date Jun 13, 2024
    • CIENA CORPORATION
    • Peter Vincent Saturley
    • G02 - OPTICS
  • Information Patent Application

    ELECTRONIC CONTROL UNIT
    • Publication number 20240172397
    • Publication date May 23, 2024
    • MAHLE International GmbH
    • Danijel Stolfa
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC APPARATUS
    • Publication number 20240160258
    • Publication date May 16, 2024
    • LENOVO (SINGAPORE) PTE. LTD.
    • Ryota Watanabe
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    COMPUTER HOUSING
    • Publication number 20240143043
    • Publication date May 2, 2024
    • Apple Inc.
    • Eugene A. Whang
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    Multiple PCB Cooling Module Assembly
    • Publication number 20240121918
    • Publication date Apr 11, 2024
    • Panasonic Automotive Systems Company of America, Division of Panasonic Corpor...
    • MICHAEL DARRILL MOORE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COMPONENT COOLER WITH SPRING MECHANISM
    • Publication number 20240114664
    • Publication date Apr 4, 2024
    • ADVANCED MICRO DEVICES, INC.
    • ROBERT EDWARD RADKE
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    SYSTEMS AND METHODS FOR COOLING SYSTEM AND POWER MODULE FOR INVERTE...
    • Publication number 20240107719
    • Publication date Mar 28, 2024
    • DELPHI TECHNOLOGIES IP LIMITED
    • Bryan Rohl
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD ASSEMBLY INCLUDING THERMAL MODULE
    • Publication number 20240098940
    • Publication date Mar 21, 2024
    • Samsung Electronics Co., Ltd.
    • Haein CHUNG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Control Device and Electric Heating Device Comprising the Same
    • Publication number 20240098848
    • Publication date Mar 21, 2024
    • Eberspacher catem GmbH & Co. KG
    • Simon Georg Kräck
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DEVICE FOR LIQUID COOLING OF NETWORK INTERFACE DEVICES
    • Publication number 20240090165
    • Publication date Mar 14, 2024
    • MELLANOX TECHNOLOGIES LTD.
    • Oren Weltsch
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    COMPUTER HOUSING
    • Publication number 20240053804
    • Publication date Feb 15, 2024
    • Apple Inc.
    • Eugene A. Whang
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    ADJUSTABLE RETENTION DEVICE FOR HEAT SINK ASSEMBLY
    • Publication number 20240049432
    • Publication date Feb 8, 2024
    • International Business Machines Corporation
    • Mehdi Hamid Vishkasougheh
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CONNECTOR ASSEMBLY
    • Publication number 20240027709
    • Publication date Jan 25, 2024
    • Molex, LLC
    • Che-Yuan Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CORRUGATED THERMAL INTERFACE DEVICE WITH LATERAL SPRING FINGERS
    • Publication number 20240027708
    • Publication date Jan 25, 2024
    • HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
    • Harvey John LUNSMAN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FLEXIBLE METAL CHIP COOLING INTERFACE
    • Publication number 20240023285
    • Publication date Jan 18, 2024
    • Quantum-Si Incorporated
    • Todd Rearick
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC COMPONENT UNIT
    • Publication number 20240015934
    • Publication date Jan 11, 2024
    • YAZAKI CORPORATION
    • Kouzou Kosho
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COMPRESSIBLE THERMAL LINK
    • Publication number 20230422449
    • Publication date Dec 28, 2023
    • Cisco Technology, Inc.
    • Chejung Liu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ADAPTABLE SUNSHIELD FOR FAN-LESS ELECTRONIC COMPONENT
    • Publication number 20230422426
    • Publication date Dec 28, 2023
    • QUANTA COMPUTER INC.
    • Yi-Chieh CHEN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BOARD AND ELECTRONIC APPARATUS
    • Publication number 20230422450
    • Publication date Dec 28, 2023
    • Fujitsu Limited
    • Shohei Hashimoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HEAT DISSIPATING DEVICE AND CONTROLLER ASSEMBLY
    • Publication number 20230422451
    • Publication date Dec 28, 2023
    • ROBERT BOSCH GmbH
    • Joerg Gebers
    • F28 - HEAT EXCHANGE IN GENERAL