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Pressing the layer connector against the bonding areas by means of another connector

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Industry

  • CPC
  • H01L2224/83901
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83901Pressing the layer connector against the bonding areas by means of another connector
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    HEATSINK ATTACHMENT MODULE
    • Publication number 20130344660
    • Publication date Dec 26, 2013
    • International Business Machines Corporation
    • Evan G. Colgan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HEATSINK ATTACHMENT MODULE
    • Publication number 20130105994
    • Publication date May 2, 2013
    • International Business Machines Corporation
    • Evan G. Colgan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Bumpless Flip-Chip Assembly With a Complaint Interposer Contractor
    • Publication number 20080315389
    • Publication date Dec 25, 2008
    • NXP B.V.
    • Wayne Nunn
    • H01 - BASIC ELECTRIC ELEMENTS