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H01J37/32816

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HELECTRICITY H01Electric elements H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge

Current Industry

H01J37/32816Pressure

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus for improved high pressure plasma processing
- Patent number 12,368,028
- Issue date Jul 22, 2025
- Applied Materials, Inc.
- William R. Johanson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor chamber components with advanced coating techniques
- Patent number 12,362,150
- Issue date Jul 15, 2025
- Applied Materials, Inc.
- Laksheswar Kalita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 12,362,156
- Issue date Jul 15, 2025
- Tokyo Electron Limited
- Atsushi Kubo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High aspect ratio etch with infinite selectivity
- Patent number 12,354,880
- Issue date Jul 8, 2025
- Lam Research Corporation
- Leonid Belau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for topography-selective depositions
- Patent number 12,347,675
- Issue date Jul 1, 2025
- ASM IP Holding B.V.
- Akiko Kobayashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Pressure control system for a multi-head processing chamber of a pl...
- Patent number 12,347,661
- Issue date Jul 1, 2025
- Beijing E-Town Semiconductor Technology Co., Ltd.
- Maolin Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 12,341,020
- Issue date Jun 24, 2025
- Tokyo Electron Limited
- Ryutaro Suda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Remote plasma ultraviolet enhanced deposition
- Patent number 12,334,317
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hai-Dang Trinh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma preclean system for cluster tool
- Patent number 12,334,318
- Issue date Jun 17, 2025
- Applied Materials, Inc.
- Songjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and plasma processing method
- Patent number 12,334,313
- Issue date Jun 17, 2025
- Tokyo Electron Limited
- Hwajun Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma enhanced chemical vapor deposition of graphene on optical fi...
- Patent number 12,312,680
- Issue date May 27, 2025
- California Institute of Technology
- Deepan Kishore Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier device, semiconductor apparatus, and residual charge detect...
- Patent number 12,315,706
- Issue date May 27, 2025
- BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
- Jian Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 12,288,683
- Issue date Apr 29, 2025
- Kokusai Electric Corporation
- Yasunobu Koshi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ceramic susceptor
- Patent number 12,283,513
- Issue date Apr 22, 2025
- MiCo Ceramics Ltd.
- Jusung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency grounding device and vacuum valve having high-freque...
- Patent number 12,283,469
- Issue date Apr 22, 2025
- VAT Holding AG
- Arthur Büchel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual pressure oxidation method for forming an oxide layer in a feature
- Patent number 12,272,531
- Issue date Apr 8, 2025
- Applied Materials, Inc.
- Christopher S. Olsen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and method for plasma coating solid fuels and coated soli...
- Patent number 12,264,289
- Issue date Apr 1, 2025
- The United States of America as represented by the Secretary of the Army
- Shaun M. Debow
- B08 - CLEANING
Information Patent Grant
Plasma processing apparatus and method for venting a processing cha...
- Patent number 12,266,508
- Issue date Apr 1, 2025
- HITACHI HIGH-TECH CORPORATION
- Kazuyuki Ikenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for sputtering and depositing metal on surface of...
- Patent number 12,266,513
- Issue date Apr 1, 2025
- Lanzhou Institute of Chemical Physics, CAS
- Bin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition of material comprising silicon and oxygen usin...
- Patent number 12,227,835
- Issue date Feb 18, 2025
- ASM IP Holding B.V.
- Viraj Madhiwala
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Topographic selective deposition
- Patent number 12,224,160
- Issue date Feb 11, 2025
- Tokyo Electron Limited
- Shyam Sridhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and electrostatic chuck
- Patent number 12,217,943
- Issue date Feb 4, 2025
- Tokyo Electron Limited
- Kohei Otsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sorption chamber walls for semiconductor equipment
- Patent number 12,217,945
- Issue date Feb 4, 2025
- Lam Research Corporation
- Hossein Sadeghi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon dry etching method
- Patent number 12,217,969
- Issue date Feb 4, 2025
- ULVAC, Inc.
- Kenta Doi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
HTCC antenna for generation of microplasma
- Patent number 12,198,897
- Issue date Jan 14, 2025
- Inficon, Inc.
- Shawn Briglin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ribbon beam plasma enhanced chemical vapor deposition system for an...
- Patent number 12,191,156
- Issue date Jan 7, 2025
- Applied Materials, Inc.
- John Hautala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas supply system, plasma processing apparatus, and gas supply method
- Patent number 12,170,187
- Issue date Dec 17, 2024
- Tokyo Electron Limited
- Atsushi Sawachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck sidewall gas curtain
- Patent number 12,154,813
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ian Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-assembled monolayer deposition from low vapor pressure organic...
- Patent number 12,142,467
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Qiwei Liang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for efficiently eliminating graphene wrinkles formed by chem...
- Patent number 12,116,281
- Issue date Oct 15, 2024
- Nanjing University
- Libo Gao
- C01 - INORGANIC CHEMISTRY

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...
- Publication number 20250226207
- Publication date Jul 10, 2025
- Kokusai Electric Corporation
- Yasunobu KOSHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE SUPPORT DEVICE AND METHOD OF PREVENTING OCCURRENCE OF ARCING
- Publication number 20250218723
- Publication date Jul 3, 2025
- SEMES CO., LTD.
- Soon Cheon CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF TREATING A SEMICONDUCTOR SUBSTRATE AND APPARATUS
- Publication number 20250210362
- Publication date Jun 26, 2025
- SPTS TECHNOLOGIES LIMITED
- Eloise BOND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20250210327
- Publication date Jun 26, 2025
- TOKYO ELECTRON LIMITED
- Takahiro YONEZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCHING OF SILICON OXIDE AT CRYOGENIC TEMPERATURE
- Publication number 20250210367
- Publication date Jun 26, 2025
- Applied Materials, Inc.
- Sonam Dorje SHERPA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS GAS PROVIDING APPARATUS AND SUBSTRATE TREATING APPARATUS IN...
- Publication number 20250201524
- Publication date Jun 19, 2025
- SEMES CO., LTD.
- Tae Sung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA CHAMBER FOR WAFER ETCHING AND WAFER ETCHING METHOD USING PLA...
- Publication number 20250166968
- Publication date May 22, 2025
- Nam Hun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD OF DAMAGE MITIGATION AND STEP COVERAGE ENHANCE...
- Publication number 20250157790
- Publication date May 15, 2025
- Applied Materials, Inc.
- Bencherki MEBARKI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF CONTROLLING PHY...
- Publication number 20250149317
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Yunha Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODEL-DRIVEN PRESSURE ESTIMATION
- Publication number 20250140538
- Publication date May 1, 2025
- Applied Materials, Inc.
- Devi Raghavee Veerappan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IN-SITU BACK SIDE PLASMA TREATMENT FOR RESIDUE REMOVAL FROM SUBSTRATES
- Publication number 20250140530
- Publication date May 1, 2025
- LAM RESEARCH CORPORATION
- Tu HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING EUV RESIST UNDERLAYER
- Publication number 20250130500
- Publication date Apr 24, 2025
- Applied Materials, Inc.
- Sudha RATHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR TESTING RING ASSEMBLY OF SUBSTRATE PROCESSING APPARATUS
- Publication number 20250104983
- Publication date Mar 27, 2025
- SEMES CO., LTD.
- Dong Mok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION OF MATERIAL COMPRISING SILICON AND OXYGEN USIN...
- Publication number 20250092515
- Publication date Mar 20, 2025
- ASM IP HOLDING B.V.
- Viraj Madhiwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND ELECTROSTATIC CHUCK
- Publication number 20250087469
- Publication date Mar 13, 2025
- TOKYO ELECTRON LIMITED
- Kohei OTSUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PLASMA ETCHING A LAYER BASED ON A III-N MATERIAL
- Publication number 20250079122
- Publication date Mar 6, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Nicolas POSSEME
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ONE CHAMBER MULTI-STATION SELECTIVE METAL REMOVAL
- Publication number 20250079199
- Publication date Mar 6, 2025
- Applied Materials, Inc.
- Shiyu YUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PRESSURE PLASMA INHIBITION
- Publication number 20250062118
- Publication date Feb 20, 2025
- LAM RESEARCH CORPORATION
- Dustin Zachary Austin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20250062130
- Publication date Feb 20, 2025
- TOKYO ELECTRON LIMITED
- Yusuke TAKINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ASSEMBLED MONOLAYER DEPOSITION FROM LOW VAPOR PRESSURE ORGANIC...
- Publication number 20250054739
- Publication date Feb 13, 2025
- Applied Materials, Inc.
- Qiwei Liang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING SYSTEM AND TRANSFER METHOD
- Publication number 20250046585
- Publication date Feb 6, 2025
- TOKYO ELECTRON LIMITED
- Tatsuru OKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTINUOUS PROCESSING MECHANISM FOR DUAL EFFECT PLASMA ETCHING
- Publication number 20250046574
- Publication date Feb 6, 2025
- UVAT TECHNOLOGY CO.,LTD.
- YUAN-CHI LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR IMPROVED INJECTION FOR A PLASMA REACTOR
- Publication number 20250022686
- Publication date Jan 16, 2025
- Nox Box Technologies LLC
- Joseph E. Lewis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECTIONAL SELECTIVE FILL OF SILICON OXIDE MATERIALS
- Publication number 20250022704
- Publication date Jan 16, 2025
- Applied Materials, Inc.
- Qiang Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INCREASED ETCH RATES OF SILICON-CONTAINING MATERIALS
- Publication number 20240429062
- Publication date Dec 26, 2024
- Applied Materials, Inc.
- Alok Ranjan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF SELECTIVELY ETCHING SILICON NITRIDE
- Publication number 20240420962
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Doreen Wei Ying Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFICATION OF METAL-CONTAINING SURFACES IN HIGH ASPECT RATIO PLAS...
- Publication number 20240420963
- Publication date Dec 19, 2024
- LAM RESEARCH CORPORATION
- He Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE SELF-ASSEMBLED MONOLAYER (SAM) REMOVAL
- Publication number 20240420996
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Jiajie Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU ETCH AND INHIBITION IN PLASMA ENHANCED ATOMIC LAYER DEPOSITION
- Publication number 20240420934
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Bhaskar Soman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND ME...
- Publication number 20240420935
- Publication date Dec 19, 2024
- Sumitomo Heavy Industries Ion Technology Co., Ltd.
- Tsunahiko NAITO
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Apparatus for improved high pressure plasma processing

Semiconductor chamber components with advanced coating techniques

Substrate processing method and substrate processing apparatus

High aspect ratio etch with infinite selectivity

Methods and systems for topography-selective depositions

Pressure control system for a multi-head processing chamber of a pl...

Substrate processing method and substrate processing apparatus

Remote plasma ultraviolet enhanced deposition

Plasma preclean system for cluster tool

Plasma processing apparatus and plasma processing method

Plasma enhanced chemical vapor deposition of graphene on optical fi...

Carrier device, semiconductor apparatus, and residual charge detect...

Method of manufacturing semiconductor device, substrate processing...

Ceramic susceptor

High-frequency grounding device and vacuum valve having high-freque...

Dual pressure oxidation method for forming an oxide layer in a feature

Apparatus and method for plasma coating solid fuels and coated soli...

Plasma processing apparatus and method for venting a processing cha...

Device and method for sputtering and depositing metal on surface of...

Selective deposition of material comprising silicon and oxygen usin...

Topographic selective deposition

Substrate processing apparatus and electrostatic chuck

Sorption chamber walls for semiconductor equipment

Silicon dry etching method

HTCC antenna for generation of microplasma

Ribbon beam plasma enhanced chemical vapor deposition system for an...

Gas supply system, plasma processing apparatus, and gas supply method

Electrostatic chuck sidewall gas curtain

Self-assembled monolayer deposition from low vapor pressure organic...

Method for efficiently eliminating graphene wrinkles formed by chem...

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...

SUBSTRATE SUPPORT DEVICE AND METHOD OF PREVENTING OCCURRENCE OF ARCING

METHODS OF TREATING A SEMICONDUCTOR SUBSTRATE AND APPARATUS

PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS

ATOMIC LAYER ETCHING OF SILICON OXIDE AT CRYOGENIC TEMPERATURE

PROCESS GAS PROVIDING APPARATUS AND SUBSTRATE TREATING APPARATUS IN...

PLASMA CHAMBER FOR WAFER ETCHING AND WAFER ETCHING METHOD USING PLA...

APPARATUS AND METHOD OF DAMAGE MITIGATION AND STEP COVERAGE ENHANCE...

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF CONTROLLING PHY...

MODEL-DRIVEN PRESSURE ESTIMATION

IN-SITU BACK SIDE PLASMA TREATMENT FOR RESIDUE REMOVAL FROM SUBSTRATES

METHODS FOR FORMING EUV RESIST UNDERLAYER

APPARATUS FOR TESTING RING ASSEMBLY OF SUBSTRATE PROCESSING APPARATUS

SELECTIVE DEPOSITION OF MATERIAL COMPRISING SILICON AND OXYGEN USIN...

SUBSTRATE PROCESSING APPARATUS AND ELECTROSTATIC CHUCK

METHOD FOR PLASMA ETCHING A LAYER BASED ON A III-N MATERIAL

ONE CHAMBER MULTI-STATION SELECTIVE METAL REMOVAL

HIGH PRESSURE PLASMA INHIBITION

PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS

SELF-ASSEMBLED MONOLAYER DEPOSITION FROM LOW VAPOR PRESSURE ORGANIC...

SUBSTRATE PROCESSING SYSTEM AND TRANSFER METHOD

CONTINUOUS PROCESSING MECHANISM FOR DUAL EFFECT PLASMA ETCHING

APPARATUS FOR IMPROVED INJECTION FOR A PLASMA REACTOR

DIRECTIONAL SELECTIVE FILL OF SILICON OXIDE MATERIALS

INCREASED ETCH RATES OF SILICON-CONTAINING MATERIALS

METHODS OF SELECTIVELY ETCHING SILICON NITRIDE

MODIFICATION OF METAL-CONTAINING SURFACES IN HIGH ASPECT RATIO PLAS...

SELECTIVE SELF-ASSEMBLED MONOLAYER (SAM) REMOVAL

IN-SITU ETCH AND INHIBITION IN PLASMA ENHANCED ATOMIC LAYER DEPOSITION

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND ME...