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H01J37/32816

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Parent Industries

HELECTRICITY H01Electric elements H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge

Current Industry

H01J37/32816Pressure

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Gas supply system, plasma processing apparatus, and gas supply method
- Patent number 12,170,187
- Issue date Dec 17, 2024
- Tokyo Electron Limited
- Atsushi Sawachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck sidewall gas curtain
- Patent number 12,154,813
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ian Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-assembled monolayer deposition from low vapor pressure organic...
- Patent number 12,142,467
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Qiwei Liang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for efficiently eliminating graphene wrinkles formed by chem...
- Patent number 12,116,281
- Issue date Oct 15, 2024
- Nanjing University
- Libo Gao
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Systems and methods for stabilizing reaction chamber pressure
- Patent number 12,098,460
- Issue date Sep 24, 2024
- ASM IP Holding B.V.
- Eiichiro Shiba
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processing devices having multi-port valve assemblies
- Patent number 12,100,575
- Issue date Sep 24, 2024
- Lam Research Corporation
- Daniel A. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support unit, and apparatus for treating substrate with the same
- Patent number 12,062,525
- Issue date Aug 13, 2024
- PSK, Inc.
- Jong Chan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for selective removal of contact oxides
- Patent number 12,057,299
- Issue date Aug 6, 2024
- Applied Materials, Inc.
- Tuck Foong Koh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processing apparatus
- Patent number 12,027,349
- Issue date Jul 2, 2024
- Tokyo Electron Limited
- Shinsuke Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and method of driving relay member
- Patent number 12,027,346
- Issue date Jul 2, 2024
- Tokyo Electron Limited
- Nobutaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flim forming method of carbon-containing film by microwave plasma
- Patent number 12,018,375
- Issue date Jun 25, 2024
- Tokyo Electron Limited
- Ryota Ifuku
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Atomic layer etching of Ru metal
- Patent number 12,020,908
- Issue date Jun 25, 2024
- Applied Materials, Inc.
- Yung-chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method of low temperature thin film deposition and in-si...
- Patent number 12,018,374
- Issue date Jun 25, 2024
- DSGI Technologies, Inc.
- Jeffrey Edward Kowalski
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal-doped carbon hardmasks
- Patent number 12,014,925
- Issue date Jun 18, 2024
- Applied Materials, Inc.
- Eswaranand Venkatasubramanian
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus, method of controlling the same, and...
- Patent number 12,001,194
- Issue date Jun 4, 2024
- Semes Co., Ltd.
- Seung Yeon Kim
- G05 - CONTROLLING REGULATING
Information Patent Grant
Carbon hard mask, film forming apparatus, and film forming method
- Patent number 11,993,849
- Issue date May 28, 2024
- Tokyo Electron Limited
- Masaru Hori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor etching methods
- Patent number 11,961,773
- Issue date Apr 16, 2024
- Ligang Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatically clamped edge ring
- Patent number 11,935,776
- Issue date Mar 19, 2024
- Lam Research Corporation
- Christopher Kimball
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Measuring device and method of obtaining thickness of sheath
- Patent number 11,898,840
- Issue date Feb 13, 2024
- Tokyo Electron Limited
- Shinji Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for controlling a processing reactor
- Patent number 11,894,220
- Issue date Feb 6, 2024
- Applied Materials, Inc.
- Michael Nichols
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic pressure control for processing chambers implementing real-...
- Patent number 11,869,754
- Issue date Jan 9, 2024
- Applied Materials, Inc.
- Tina Dhekial-Phukan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate joining method, substrate joining system and method for c...
- Patent number 11,837,444
- Issue date Dec 5, 2023
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing apparatus and processing method, and gas cluster generat...
- Patent number 11,772,138
- Issue date Oct 3, 2023
- Tokyo Electron Limited
- Kazuya Dobashi
- B08 - CLEANING
Information Patent Grant
Oxidation resistant protective layer in chamber conditioning
- Patent number 11,761,079
- Issue date Sep 19, 2023
- Lam Research Corporation
- Fengyuan Lai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
RF capacitive coupled etch reactor
- Patent number 11,742,187
- Issue date Aug 29, 2023
- EVATEC AG
- Johannes Weichart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Systems and methods for improved semiconductor etching and componen...
- Patent number 11,735,441
- Issue date Aug 22, 2023
- Applied Materials, Inc.
- Tien Fak Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus
- Patent number 11,705,346
- Issue date Jul 18, 2023
- Tokyo Electron Limited
- Yusei Kuwabara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method
- Patent number 11,705,309
- Issue date Jul 18, 2023
- Tokyo Electron Limited
- Yasutaka Hama
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Film deposition method and plasma processing apparatus
- Patent number 11,699,614
- Issue date Jul 11, 2023
- Tokyo Electron Limited
- Michiko Nakaya
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Textured processing chamber components and methods of manufacturing...
- Patent number 11,685,990
- Issue date Jun 27, 2023
- Applied Materials, Inc.
- Cariappa Baduvamanda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
INCREASED ETCH RATES OF SILICON-CONTAINING MATERIALS
- Publication number 20240429062
- Publication date Dec 26, 2024
- Applied Materials, Inc.
- Alok Ranjan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF SELECTIVELY ETCHING SILICON NITRIDE
- Publication number 20240420962
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Doreen Wei Ying Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFICATION OF METAL-CONTAINING SURFACES IN HIGH ASPECT RATIO PLAS...
- Publication number 20240420963
- Publication date Dec 19, 2024
- LAM RESEARCH CORPORATION
- He Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE SELF-ASSEMBLED MONOLAYER (SAM) REMOVAL
- Publication number 20240420996
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Jiajie Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU ETCH AND INHIBITION IN PLASMA ENHANCED ATOMIC LAYER DEPOSITION
- Publication number 20240420934
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Bhaskar Soman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND ME...
- Publication number 20240420935
- Publication date Dec 19, 2024
- Sumitomo Heavy Industries Ion Technology Co., Ltd.
- Tsunahiko NAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-CAPILLARY HIGH VOLTAGE ISOLATOR FOR GAS DELIVERY TO VACUUM
- Publication number 20240412952
- Publication date Dec 12, 2024
- Oregon Physics, LLC
- Philip J. Witham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HALOGEN-FREE ETCHING OF SILICON NITRIDE
- Publication number 20240404837
- Publication date Dec 5, 2024
- Applied Materials, Inc.
- Zhiren Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...
- Publication number 20240404988
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...
- Publication number 20240404989
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Topographic Selective Deposition
- Publication number 20240395507
- Publication date Nov 28, 2024
- TOKYO ELECTRON LIMITED
- Shyam Sridhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHAMBER PROCESSING TOOL WITH ENHANCED THROUGHPUT
- Publication number 20240395514
- Publication date Nov 28, 2024
- Prashant AGARWAL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD
- Publication number 20240395512
- Publication date Nov 28, 2024
- Disco Corporation
- Kazuma SEKIYA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
REMOTE PLASMA DEPOSITION WITH ELECTROSTATIC CLAMPING
- Publication number 20240387226
- Publication date Nov 21, 2024
- LAM RESEARCH CORPORATION
- Aaron Blake MILLER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electrostatic Chuck Sidewall Gas Curtain
- Publication number 20240387228
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ian HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING CAPACITOR STRUCTURE
- Publication number 20240387606
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Qinghui ZHENG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND SYSTEMS FOR INHIBITING PRECURSOR INTERACTIONS DURING RA...
- Publication number 20240368760
- Publication date Nov 7, 2024
- Lotus Applied Technology, LLC
- ERIC DICKEY
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF PLASMA CLEANING OF FUSED SILICA TUBES
- Publication number 20240363317
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Vicknesh Sahmuganathan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Program, Information Processing Method, Information Processing Devi...
- Publication number 20240355653
- Publication date Oct 24, 2024
- SPP Technologies Co., Ttd.
- Tatsuo Hiramura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PARAMETER PLASMA ASHING TECHNIQUES
- Publication number 20240355595
- Publication date Oct 24, 2024
- Micron Technology, Inc.
- Rachmat Wibowo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPRESSIVE FILMS FOR LARGE AREA GAPFILL
- Publication number 20240332028
- Publication date Oct 3, 2024
- Applied Materials, Inc.
- Supriya Ghosh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DENSIFIED SEAM-FREE SILICON GAP FILL PROCESSES
- Publication number 20240331975
- Publication date Oct 3, 2024
- Applied Materials, Inc.
- Shuchi Sunil Ojha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING FILM FORMING METHOD AND SUBSTRATE PROCESSING SYSTEM
- Publication number 20240321571
- Publication date Sep 26, 2024
- TOKYO ELECTRON LIMITED
- Daisuke OBA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR REDUCING INCUBATION PERIOD OF SILICON NITRIDE LAYER DEPO...
- Publication number 20240318311
- Publication date Sep 26, 2024
- ASM IP HOLDING B.V.
- Agung Setiadi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, METHOD OF PROCESSING SUBSTRATE, MET...
- Publication number 20240321558
- Publication date Sep 26, 2024
- Kokusai Electric Corporation
- Takeshi YASUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING PROCESSING METHOD
- Publication number 20240312789
- Publication date Sep 19, 2024
- Hitachi High-Tech Corporation
- Takashi HATTORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHAMBER COMPONENTS WITH ADVANCED COATING TECHNIQUES
- Publication number 20240304423
- Publication date Sep 12, 2024
- Applied Materials, Inc.
- Laksheswar Kalita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA PROCESSING APPARATUS
- Publication number 20240290581
- Publication date Aug 29, 2024
- Hitachi High-Tech Corporation
- Shengnan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20240290609
- Publication date Aug 29, 2024
- Tokyo Electron Limited
- Tadahiro ISHIZAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHODS TO IMPROVE ETCHED SILICON-AND-GERMANIUM-CONTAINI...
- Publication number 20240290623
- Publication date Aug 29, 2024
- Applied Materials, Inc.
- Bin Yao
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Gas supply system, plasma processing apparatus, and gas supply method

Electrostatic chuck sidewall gas curtain

Self-assembled monolayer deposition from low vapor pressure organic...

Method for efficiently eliminating graphene wrinkles formed by chem...

Systems and methods for stabilizing reaction chamber pressure

Plasma processing devices having multi-port valve assemblies

Support unit, and apparatus for treating substrate with the same

Methods for selective removal of contact oxides

Plasma processing apparatus

Substrate processing apparatus and method of driving relay member

Flim forming method of carbon-containing film by microwave plasma

Atomic layer etching of Ru metal

System and method of low temperature thin film deposition and in-si...

Metal-doped carbon hardmasks

Substrate processing apparatus, method of controlling the same, and...

Carbon hard mask, film forming apparatus, and film forming method

Semiconductor etching methods

Electrostatically clamped edge ring

Measuring device and method of obtaining thickness of sheath

Method and apparatus for controlling a processing reactor

Dynamic pressure control for processing chambers implementing real-...

Substrate joining method, substrate joining system and method for c...

Processing apparatus and processing method, and gas cluster generat...

Oxidation resistant protective layer in chamber conditioning

RF capacitive coupled etch reactor

Systems and methods for improved semiconductor etching and componen...

Substrate processing apparatus

Substrate processing method

Film deposition method and plasma processing apparatus

Textured processing chamber components and methods of manufacturing...

Patents Applicationslast 30 patents

INCREASED ETCH RATES OF SILICON-CONTAINING MATERIALS

METHODS OF SELECTIVELY ETCHING SILICON NITRIDE

MODIFICATION OF METAL-CONTAINING SURFACES IN HIGH ASPECT RATIO PLAS...

SELECTIVE SELF-ASSEMBLED MONOLAYER (SAM) REMOVAL

IN-SITU ETCH AND INHIBITION IN PLASMA ENHANCED ATOMIC LAYER DEPOSITION

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND ME...

MICRO-CAPILLARY HIGH VOLTAGE ISOLATOR FOR GAS DELIVERY TO VACUUM

HALOGEN-FREE ETCHING OF SILICON NITRIDE

FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...

PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...

Topographic Selective Deposition

MULTI-CHAMBER PROCESSING TOOL WITH ENHANCED THROUGHPUT

WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD

REMOTE PLASMA DEPOSITION WITH ELECTROSTATIC CLAMPING

Electrostatic Chuck Sidewall Gas Curtain

METHOD FOR MANUFACTURING CAPACITOR STRUCTURE

METHODS AND SYSTEMS FOR INHIBITING PRECURSOR INTERACTIONS DURING RA...

METHOD OF PLASMA CLEANING OF FUSED SILICA TUBES

Program, Information Processing Method, Information Processing Devi...

LOW PARAMETER PLASMA ASHING TECHNIQUES

COMPRESSIVE FILMS FOR LARGE AREA GAPFILL

DENSIFIED SEAM-FREE SILICON GAP FILL PROCESSES

INSULATING FILM FORMING METHOD AND SUBSTRATE PROCESSING SYSTEM

METHOD FOR REDUCING INCUBATION PERIOD OF SILICON NITRIDE LAYER DEPO...

SUBSTRATE PROCESSING APPARATUS, METHOD OF PROCESSING SUBSTRATE, MET...

ETCHING PROCESSING METHOD

SEMICONDUCTOR CHAMBER COMPONENTS WITH ADVANCED COATING TECHNIQUES

PLASMA PROCESSING APPARATUS

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

PROCESSING METHODS TO IMPROVE ETCHED SILICON-AND-GERMANIUM-CONTAINI...