Printed elements for providing electric connections to or between printed circuits

Industry

CPC
H05K1/11

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/11Printed elements for providing electric connections to or between printed circuits

Industries

Patents Grantslast 30 patents

Information Patent Grant
Flexible printed circuit board having vertical section and horizont...
- Patent number 12,185,459
- Issue date Dec 31, 2024
- Gigalane Co., Ltd.
- Sang Pil Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitive compensation for vertical interconnect accesses
- Patent number 12,185,462
- Issue date Dec 31, 2024
- Achronix Semiconductor Corporation
- Hansel Desmond Dsilva
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic device including electrostatic discharge path
- Patent number 12,181,936
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Donghyeon Yeo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Spectral module and method for manufacturing spectral module
- Patent number 12,181,339
- Issue date Dec 31, 2024
- Hamamatsu Photonics K.K.
- Takafumi Yokino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component embedded substrate
- Patent number 12,185,471
- Issue date Dec 31, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Ho Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for flexible circuit cable attachment
- Patent number 12,185,476
- Issue date Dec 31, 2024
- Jabil Inc.
- Wenlu Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Separable interface cable structure for high voltage under-module p...
- Patent number 12,183,999
- Issue date Dec 31, 2024
- International Business Machines Corporation
- Xin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,185,461
- Issue date Dec 31, 2024
- Innolux Corporation
- Cheng-Chi Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and light-emitting device
- Patent number 12,185,468
- Issue date Dec 31, 2024
- Nichia Corporation
- Soichiro Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring circuit board and method of producing the same
- Patent number 12,185,463
- Issue date Dec 31, 2024
- Nitto Denko Corporation
- Kanayo Sawashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rigid flexible printed circuit board and electronic device comprisi...
- Patent number 12,185,464
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Youngsun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board having embedded component
- Patent number 12,185,478
- Issue date Dec 31, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead frame and method for stacking discrete components to be embedd...
- Patent number 12,185,469
- Issue date Dec 31, 2024
- SARAS MICRO DEVICES, INC.
- Richard Sheridan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded printed circuit board
- Patent number 12,185,470
- Issue date Dec 31, 2024
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board and manufacturing method thereof
- Patent number 12,185,479
- Issue date Dec 31, 2024
- Unimicron Technology Corp.
- Cheng-Ta Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 12,177,971
- Issue date Dec 24, 2024
- Kyocera Corporation
- Tadashi Nagasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module
- Patent number 12,177,976
- Issue date Dec 24, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,177,974
- Issue date Dec 24, 2024
- LG Innotek Co., Ltd
- Dong Hun Joung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Extended center stiffener plate for improved structural dynamics of...
- Patent number 12,176,013
- Issue date Dec 24, 2024
- Western Digital Technologies, Inc.
- Jung-Seo Park
- G11 - INFORMATION STORAGE
Information Patent Grant
High frequency and high power thin film component
- Patent number 12,177,960
- Issue date Dec 24, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 12,177,973
- Issue date Dec 24, 2024
- Sumitomo Electric Industries, Ltd.
- Shoichiro Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 12,177,975
- Issue date Dec 24, 2024
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vertical transition from CPW to air waveguide using half-mode excit...
- Patent number 12,176,610
- Issue date Dec 24, 2024
- Oculii Corp
- Jun Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Minimizing impedance tolerances due to misregistration
- Patent number 12,177,963
- Issue date Dec 24, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and manufacturing method thereof and electronic device
- Patent number 12,177,964
- Issue date Dec 24, 2024
- Unimicron Technology Corp.
- Jun-Rui Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a flexible electronics assembly
- Patent number 12,177,968
- Issue date Dec 24, 2024
- The Boeing Company
- John E. Rogers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board and method of manufacturing flexible...
- Patent number 12,177,977
- Issue date Dec 24, 2024
- Sumitomo Electric Industries, Ltd.
- Koji Nitta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency circuit and communication module
- Patent number 12,171,059
- Issue date Dec 17, 2024
- Mitsubishi Electric Corporation
- Nobuo Ohata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect and method for manufacturing the same
- Patent number 12,171,064
- Issue date Dec 17, 2024
- Raytheon Company
- Brandon W. Pillans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 12,171,063
- Issue date Dec 17, 2024
- Amphenol Corporation
- Marc B. Cartier
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER SUPPLY BOARDS FOR WIRELESS COMMUNICATIONS DEVICES
- Publication number 20250008646
- Publication date Jan 2, 2025
- Plume Design, Inc.
- Chiu-Wen CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND APPARATUS FOR MANUFACTURING AN ELECTRONIC APPARATUS
- Publication number 20250008654
- Publication date Jan 2, 2025
- Corning Incorporated
- Sean Matthew Garner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC MODULE HAVING A PCB CAP STRUCTURE
- Publication number 20250008677
- Publication date Jan 2, 2025
- DSBJ PTE. LTD.
- Jan Hendrik BERKEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR THE ACYLATION OF MAYTANSINOL
- Publication number 20250007192
- Publication date Jan 2, 2025
- ImmunoGen, Inc.
- Wayne C. Widdison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIN STRUCTURE OF MODULE POWER SUPPLY, AND MODULE POWER SUPPLY
- Publication number 20250008648
- Publication date Jan 2, 2025
- MORNSUN GUANGZHOU SCIENCE & TECHNOLOGY CO., LTD.
- Youyuan TAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECTABLE CIRCUIT BOARDS ADAPTED FOR THREE-DIMENSIONAL CONST...
- Publication number 20250008653
- Publication date Jan 2, 2025
- METROSPEC TECHNOLOGY, LLC
- Henry V. Holec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND ROTATING ELECTRICAL MACHINE
- Publication number 20250008655
- Publication date Jan 2, 2025
- Honda Motor Co., Ltd.
- Daiki Suetsugu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
QUANTUM DEVICE
- Publication number 20250005416
- Publication date Jan 2, 2025
- NEC Corporation
- Akira MIYATA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250008659
- Publication date Jan 2, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Jae Heun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND LIGHT-EMITTING PANEL WITH CIRCUIT BOARD
- Publication number 20250008649
- Publication date Jan 2, 2025
- AUO Corporation
- Chieh-Ming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT HEIGHT ADJUSTMENT STRUCTURE OF FLEXIBLE CIRCUIT BOARD
- Publication number 20250008650
- Publication date Jan 2, 2025
- ADVANCED FLEXIBLE CIRCUITS CO., LTD.
- CLINTON LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250008651
- Publication date Jan 2, 2025
- IBIDEN CO., LTD.
- Susumu KAGOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING FOR MINIATURIZING PRINTED CIRCUIT INTERCONNECTION
- Publication number 20250008656
- Publication date Jan 2, 2025
- Meta Platforms Technologies, LLC
- Andrew Matthew BARDAGJY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250008652
- Publication date Jan 2, 2025
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SWITCHES FOR MEDICATION CONTAINER CAPS
- Publication number 20240423872
- Publication date Dec 26, 2024
- Verily Life Sciences LLC
- Jasper Lodewyk Steyn
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20240431024
- Publication date Dec 26, 2024
- Murata Manufacturing Co., Ltd.
- Hirofumi OIE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS SUBSTRATE, THROUGH-ELECTRODE, MULTILAYER WIRING SUBSTRATE, AN...
- Publication number 20240431027
- Publication date Dec 26, 2024
- TOPPAN Holdings Inc.
- Yuki UMEMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUSES HAVING VIA STRUCTURES TO REDUCE CROSSTALK EFFECTS
- Publication number 20240431026
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jaeho CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240431031
- Publication date Dec 26, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240431023
- Publication date Dec 26, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Sang Ho JEONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CORROSION RESISTANT SINGLE DAMASCENE INTERCONNECTS
- Publication number 20240431025
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Takeshi Nogami
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DESIGN OF A RECYCLABLE ELECTRONIC DEVICE
- Publication number 20240431037
- Publication date Dec 26, 2024
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Stephan HARKEMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DYNAMICALLY RECONFIGURABLE MAGNETIC CIRCUIT SYSTEMS WITH TUNABLE CO...
- Publication number 20240422898
- Publication date Dec 19, 2024
- Albert Moses Haim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD, MAINTENANCE METHOD THEREFOR, AND DISPLAY APP...
- Publication number 20240422904
- Publication date Dec 19, 2024
- Chongqing BOE Electronic Technology Co., Ltd.
- Jie ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE WITH SELECTION STRUCTURE AND METHOD FOR FABRIC...
- Publication number 20240422906
- Publication date Dec 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Continuously Extending Vertical Connection S...
- Publication number 20240422907
- Publication date Dec 19, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Markus LEITGEB
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY PANEL, DISPLAY DEVICE, AND DRIVER CHIP
- Publication number 20240422909
- Publication date Dec 19, 2024
- Wuhan China Star Optoelectronics Technology Co., Ltd.
- Yiyu GUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240422912
- Publication date Dec 19, 2024
- PanelSemi Corporation
- Sheng-Ping CHIANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE AND CIRCUIT BOARD
- Publication number 20240422913
- Publication date Dec 19, 2024
- Murata Manufacturing Co., Ltd.
- Ryutatsu MIZUKAMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240422901
- Publication date Dec 19, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jae Heun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Printed elements for providing electric connections to or between printed circuits

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Flexible printed circuit board having vertical section and horizont...

Capacitive compensation for vertical interconnect accesses

Electronic device including electrostatic discharge path

Spectral module and method for manufacturing spectral module

Electronic component embedded substrate

Method and apparatus for flexible circuit cable attachment

Separable interface cable structure for high voltage under-module p...

Electronic device

Wiring board and light-emitting device

Wiring circuit board and method of producing the same

Rigid flexible printed circuit board and electronic device comprisi...

Printed circuit board having embedded component

Lead frame and method for stacking discrete components to be embedd...

Embedded printed circuit board

Flexible circuit board and manufacturing method thereof

Wiring board

Module

Circuit board

Extended center stiffener plate for improved structural dynamics of...

High frequency and high power thin film component

Printed wiring board

Wiring substrate

Vertical transition from CPW to air waveguide using half-mode excit...

Minimizing impedance tolerances due to misregistration

Circuit board and manufacturing method thereof and electronic device

Method of forming a flexible electronics assembly

Flexible printed circuit board and method of manufacturing flexible...

High-frequency circuit and communication module

Interconnect and method for manufacturing the same

Backplane footprint for high speed, high density electrical connectors

Patents Applicationslast 30 patents

POWER SUPPLY BOARDS FOR WIRELESS COMMUNICATIONS DEVICES

METHODS AND APPARATUS FOR MANUFACTURING AN ELECTRONIC APPARATUS

ELECTRONIC MODULE HAVING A PCB CAP STRUCTURE

METHODS FOR THE ACYLATION OF MAYTANSINOL

PIN STRUCTURE OF MODULE POWER SUPPLY, AND MODULE POWER SUPPLY

INTERCONNECTABLE CIRCUIT BOARDS ADAPTED FOR THREE-DIMENSIONAL CONST...

FLEXIBLE CIRCUIT BOARD AND ROTATING ELECTRICAL MACHINE

QUANTUM DEVICE

PRINTED CIRCUIT BOARD

CIRCUIT BOARD AND LIGHT-EMITTING PANEL WITH CIRCUIT BOARD

CONTACT HEIGHT ADJUSTMENT STRUCTURE OF FLEXIBLE CIRCUIT BOARD

PRINTED WIRING BOARD

WIRE BONDING FOR MINIATURIZING PRINTED CIRCUIT INTERCONNECTION

PRINTED WIRING BOARD

SWITCHES FOR MEDICATION CONTAINER CAPS

ELECTRONIC COMPONENT

GLASS SUBSTRATE, THROUGH-ELECTRODE, MULTILAYER WIRING SUBSTRATE, AN...

APPARATUSES HAVING VIA STRUCTURES TO REDUCE CROSSTALK EFFECTS

PRINTED WIRING BOARD

PRINTED CIRCUIT BOARD

CORROSION RESISTANT SINGLE DAMASCENE INTERCONNECTS

DESIGN OF A RECYCLABLE ELECTRONIC DEVICE

DYNAMICALLY RECONFIGURABLE MAGNETIC CIRCUIT SYSTEMS WITH TUNABLE CO...

PRINTED CIRCUIT BOARD, MAINTENANCE METHOD THEREFOR, AND DISPLAY APP...

SEMICONDUCTOR DEVICE WITH SELECTION STRUCTURE AND METHOD FOR FABRIC...

Component Carrier With Continuously Extending Vertical Connection S...

DISPLAY PANEL, DISPLAY DEVICE, AND DRIVER CHIP

ELECTRONIC DEVICE

CIRCUIT MODULE AND CIRCUIT BOARD

PRINTED CIRCUIT BOARD