Printed elements for providing electric connections to or between printed circuits

Industry

CPC
H05K1/11

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/11Printed elements for providing electric connections to or between printed circuits

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bend compensation for conductive traces on printed circuit boards
- Patent number 12,150,240
- Issue date Nov 19, 2024
- Amphenol Corporation
- Michael Rowlands
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and procedure for miniaturing a multi-layer PCB
- Patent number 12,150,237
- Issue date Nov 19, 2024
- VEEA INC.
- Robert Migliorino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package assembly
- Patent number 12,150,243
- Issue date Nov 19, 2024
- Wiwynn Corporation
- Yi Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED circuit board structure and LED testing and packaging method
- Patent number 12,150,242
- Issue date Nov 19, 2024
- Ingentec Corporation
- Yi-Chuan Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual inline power module
- Patent number 12,150,258
- Issue date Nov 19, 2024
- Wolfspeed, Inc.
- Brice McPherson
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Wiring substrate having optical waveguide
- Patent number 12,150,244
- Issue date Nov 19, 2024
- Ibiden Co., Ltd.
- Masatoshi Kunieda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compact oscillator device with a cavity resonator on a circuit board
- Patent number 12,142,810
- Issue date Nov 12, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Mikael Hörberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board with increased durability in bending region a...
- Patent number 12,144,109
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Youngsun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
ESD protection of chip scale package LEDS
- Patent number 12,140,297
- Issue date Nov 12, 2024
- SIGNIFY HOLDING, B.V.
- Christian Tenhumberg
- F21 - LIGHTING
Information Patent Grant
Wiring board
- Patent number 12,144,105
- Issue date Nov 12, 2024
- Kyocera Corporation
- Toshihiro Hiwatashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board and display device
- Patent number 12,144,117
- Issue date Nov 12, 2024
- Chengdu Boe Optoelectronics Technology Co., Ltd.
- Fan Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and camera device comprising same
- Patent number 12,144,103
- Issue date Nov 12, 2024
- LG Innotek Co., Ltd
- Do Hyuk Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element mounting substrate, electronic device, and elect...
- Patent number 12,144,114
- Issue date Nov 12, 2024
- Kyocera Corporation
- Kanae Horiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module
- Patent number 12,144,159
- Issue date Nov 12, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 12,144,106
- Issue date Nov 12, 2024
- TPK Auto Tech (Xiamen) Limited
- Li Hua Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reduced vertical profile ejector for liquid cooled modules
- Patent number 12,144,110
- Issue date Nov 12, 2024
- Intel Corporation
- Guixiang Tan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of producing printed circuit board
- Patent number 12,144,111
- Issue date Nov 12, 2024
- Denso Corporation
- Hirokazu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and manufacturing method thereof
- Patent number 12,144,112
- Issue date Nov 12, 2024
- E Ink Holdings Inc.
- Yi Jiun Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure
- Patent number 12,144,113
- Issue date Nov 12, 2024
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressure-sensitive adhesive sheet-including wiring circuit board an...
- Patent number 12,144,125
- Issue date Nov 12, 2024
- Nitto Denko Corporation
- Takahiro Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,144,116
- Issue date Nov 12, 2024
- LG Innotek Co., Ltd
- Jong Bae Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through electrode substrate and semiconductor device
- Patent number 12,136,591
- Issue date Nov 5, 2024
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuits with embedded resistive thermal devices
- Patent number 12,135,592
- Issue date Nov 5, 2024
- Apple Inc.
- Anne M. Mason
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multilayer circuit board
- Patent number 12,137,521
- Issue date Nov 5, 2024
- 3M Innovative Properties Company
- YunLong Qiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for water intrusion mitigation
- Patent number 12,137,527
- Issue date Nov 5, 2024
- Rosemount Aerospace Inc.
- Dennis A. Quy
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for detecting and adjusting poor back drills in printed circ...
- Patent number 12,135,347
- Issue date Nov 5, 2024
- R&D Circuits
- Michael Caprio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 12,133,329
- Issue date Oct 29, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Su Min Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board and electronic device including flex...
- Patent number 12,133,332
- Issue date Oct 29, 2024
- Samsung Electronics Co., Ltd.
- Junwhon Uhm
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit structure and fabrication method thereof
- Patent number 12,133,337
- Issue date Oct 29, 2024
- INNOLUX CORPORATION
- Yi Hung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD
- Publication number 20240387344
- Publication date Nov 21, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Chi Hyeon JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED BALL GRID ARRAY PAD CAPACITANCE
- Publication number 20240389220
- Publication date Nov 21, 2024
- Dell Products L.P.
- Sandor FARKAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BURIED SKIP VIAS FOR IMPROVED SIGNAL AND POWER INTEGRITY
- Publication number 20240389230
- Publication date Nov 21, 2024
- NVIDIA Corporation
- Mingyi Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE
- Publication number 20240389235
- Publication date Nov 21, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTOR, CONNECTOR ASSEMBLY, CONNECTING STRUCTURE, AND CONNECTING...
- Publication number 20240388027
- Publication date Nov 21, 2024
- Japan Aviation Electronics Industry, Limited
- Kenta Ashibu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULE AND ELECTRONIC DEVICE COMPRISING SAME
- Publication number 20240387996
- Publication date Nov 21, 2024
- LG ELECTRONICS INC.
- Seungmin WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD TO MAINTAIN SIGNAL INTEGRITY BETWEEN MULTIPLE SIG...
- Publication number 20240389223
- Publication date Nov 21, 2024
- Dell Products L.P.
- SANDOR TIBOR FARKAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240389229
- Publication date Nov 21, 2024
- InnoLux Corporation
- Yu-Ting LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240389241
- Publication date Nov 21, 2024
- DAEDUCK ELECTRONICS CO., LTD.
- Min-Geun JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO-GROUND VIAS FOR IMPROVED SIGNAL INTEGRITY FOR HIGH-SPEED SERI...
- Publication number 20240389219
- Publication date Nov 21, 2024
- Dell Products L.P.
- William Andrew Smith
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CONTROL DEVICE
- Publication number 20240389228
- Publication date Nov 21, 2024
- Hitachi Astemo, Ltd.
- Akira ISHII
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTOR, CONNECTOR ASSEMBLY, AND WEARING ARTICLE
- Publication number 20240388026
- Publication date Nov 21, 2024
- Japan Aviation Electronics Industry, Limited
- Kenta Ashibu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY MODULE, COMMUNICATION DEVICE, AND FILTER
- Publication number 20240389222
- Publication date Nov 21, 2024
- Murata Manufacturing Co., Ltd.
- Eiji FUJIMORI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240389231
- Publication date Nov 21, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240381533
- Publication date Nov 14, 2024
- Unimicron Technology Corp.
- Chun Hung KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing a Component Carrier by a Nano Imprint Lithography Pro...
- Publication number 20240381538
- Publication date Nov 14, 2024
- AT&S Austria Technologie & Systemtechnik
- Heinrich TRISCHLER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
- Publication number 20240381530
- Publication date Nov 14, 2024
- LG Innotek Co., Ltd.
- Se Woong NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT APPLIQUES
- Publication number 20240381536
- Publication date Nov 14, 2024
- Liquid Wire Inc.
- Mark William Ronay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240381527
- Publication date Nov 14, 2024
- LG Innotek Co., Ltd.
- Jae Hwa KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20240381531
- Publication date Nov 14, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DELIVERY SYSTEM
- Publication number 20240377868
- Publication date Nov 14, 2024
- Dell Products L.P.
- JASON CHARLES PRITCHARD
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Thick Film Single Layer Capacitor
- Publication number 20240379649
- Publication date Nov 14, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HAVING ELECTRONIC COMPONENT MOUNTED IN A CAVITY OF A CORE...
- Publication number 20240373561
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Jung Won PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20240373552
- Publication date Nov 7, 2024
- Hefei BOE Ruisheng Technology Co., Ltd.
- Jiawei XU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE, CIRCUIT BOARD, AND MANUFACTURING METHOD FOR CIRC...
- Publication number 20240373553
- Publication date Nov 7, 2024
- Huawei Technologies Co., Ltd
- Xuanling Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT ASSEMBLY INCLUDING GALLIUM NITRIDE DEVICES
- Publication number 20240373557
- Publication date Nov 7, 2024
- Murata Manufacturing Co., Ltd.
- Jahangir AFSHARIAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLY SHEET AND METHOD FOR PRODUCING ASSEMBLY SHEET
- Publication number 20240373564
- Publication date Nov 7, 2024
- Nitto Denko Corporation
- Makoto TSUNEKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND IMAGE DISPLAY DEVICE INCLUDING SAME
- Publication number 20240373547
- Publication date Nov 7, 2024
- LG ELECTRONICS INC.
- Geumsub SIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AXIAL FIELD ROTARY ENERGY DEVICE WITH PCB STATOR WITH THERMAL EXPAN...
- Publication number 20240372426
- Publication date Nov 7, 2024
- INFINITUM ELECTRIC INC.
- Rich Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR TRANSMITTING CURRENT AND VOLTAGE SIGNALS O...
- Publication number 20240372116
- Publication date Nov 7, 2024
- CATARC New Energy Vehicle Test Center (Tianjin) Co., Ltd.
- Zirong YANG
- H01 - BASIC ELECTRIC ELEMENTS

Printed elements for providing electric connections to or between printed circuits

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bend compensation for conductive traces on printed circuit boards

Method and procedure for miniaturing a multi-layer PCB

Package assembly

LED circuit board structure and LED testing and packaging method

Dual inline power module

Wiring substrate having optical waveguide

Compact oscillator device with a cavity resonator on a circuit board

Printed circuit board with increased durability in bending region a...

ESD protection of chip scale package LEDS

Wiring board

Flexible circuit board and display device

Printed circuit board and camera device comprising same

Electronic element mounting substrate, electronic device, and elect...

Module

Electronic device

Reduced vertical profile ejector for liquid cooled modules

Printed circuit board and method of producing printed circuit board

Display panel and manufacturing method thereof

Circuit board structure

Pressure-sensitive adhesive sheet-including wiring circuit board an...

Printed circuit board

Through electrode substrate and semiconductor device

Printed circuits with embedded resistive thermal devices

Multilayer circuit board

Method and device for water intrusion mitigation

Method for detecting and adjusting poor back drills in printed circ...

Hermetic metallized via with improved reliability

Printed circuit board and method for manufacturing the same

Flexible printed circuit board and electronic device including flex...

Circuit structure and fabrication method thereof

Patents Applicationslast 30 patents

CIRCUIT BOARD

REDUCED BALL GRID ARRAY PAD CAPACITANCE

BURIED SKIP VIAS FOR IMPROVED SIGNAL AND POWER INTEGRITY

CIRCUIT MODULE

CONNECTOR, CONNECTOR ASSEMBLY, CONNECTING STRUCTURE, AND CONNECTING...

ANTENNA MODULE AND ELECTRONIC DEVICE COMPRISING SAME

SYSTEM AND METHOD TO MAINTAIN SIGNAL INTEGRITY BETWEEN MULTIPLE SIG...

ELECTRONIC DEVICE

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

MICRO-GROUND VIAS FOR IMPROVED SIGNAL INTEGRITY FOR HIGH-SPEED SERI...

ELECTRONIC CONTROL DEVICE

CONNECTOR, CONNECTOR ASSEMBLY, AND WEARING ARTICLE

RADIO FREQUENCY MODULE, COMMUNICATION DEVICE, AND FILTER

PRINTED WIRING BOARD

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

Manufacturing a Component Carrier by a Nano Imprint Lithography Pro...

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

ELECTRONIC COMPONENT APPLIQUES

PRINTED CIRCUIT BOARD

SELECTIVE TRANSFER OF MICRO DEVICES

POWER DELIVERY SYSTEM

Thick Film Single Layer Capacitor

SUBSTRATE HAVING ELECTRONIC COMPONENT MOUNTED IN A CAVITY OF A CORE...

WIRING SUBSTRATE AND ELECTRONIC DEVICE

ELECTRONIC DEVICE, CIRCUIT BOARD, AND MANUFACTURING METHOD FOR CIRC...

CIRCUIT ASSEMBLY INCLUDING GALLIUM NITRIDE DEVICES

ASSEMBLY SHEET AND METHOD FOR PRODUCING ASSEMBLY SHEET

PRINTED CIRCUIT BOARD AND IMAGE DISPLAY DEVICE INCLUDING SAME

AXIAL FIELD ROTARY ENERGY DEVICE WITH PCB STATOR WITH THERMAL EXPAN...

METHOD AND APPARATUS FOR TRANSMITTING CURRENT AND VOLTAGE SIGNALS O...